Glass fibers etched surface

Fig. 4.19 SEI images show the result of plasma etching with argon (A) a glass fiber surface shows no ordered details (B) amorphous PET film with particles but no order (C) an orient crystalline PET fiber surface with lateral striations, and (D) an aramid surface also with lateral striations. The effect of plasma etching with oxygen is shown for a glass fiber surface (E) which reveals no detail and (F) an aramid fiber which exWbits a lateral striated texture.

Fig. 5.82 SEM images show the morphology of surface finish coated glass fibers. The finish is seen in several morphologies as a thin film coating on the surfaces, as lumps of material on the surfaces and connecting fibers, and as etchings or fibrils spanning across the fibers.

Goodhew [189-192] discussed the formation of large scale structures (0.1-1 jum) perpendicular to the drawn fiber axis upon ion etching carbon fibers. He attributed these structures to be derived from the original surface striations. Such structures were not formed on glass fibers which... 

In many applications it may not be feasible to employ the fused spray coatings because of the relatively high temperature (700° F) necessary to fuse the PTFE. Phenolic-bonded PTFE, PTFE-filled porous bronze, and PTFE glass-filled tape are among the other products that may be considered for sliding surfaces. The phenolic-bonded PTFE can be applied with cure temperatures as low as 300 F. The PTFE-filled porous bronze is available in sheets that can be formed to various shapes and mechanically pressed or clamped into retainers. The PTFE tape containing about 25 per cent glass fiber was molded and had one surface etched so that it could be applied to metal surfaces with adhesives. 

In course of further sample calcination at 300°C the intensity of the band at 44600 em sharply deerease and new band at 39800 em is simultaneously appeared. This band may be attributed to d-d transitions in small eharged platinum elusters due to the following reasons. First, the electron microscopy data of GFC samples [1] showed the presence of Pt speeies with size not exceeding 1 nm and the absenee of metal partieles at the outer fiber surface. According to XPS data obtained in eombination with ion etching the Pt clusters are localized in the upper layers of glass fibers at the depth up to 10 nm. 

Silicon dioxide is the most widely used ceramic material in the semiconductor industry, and the majority of Si02 deposits in microelectronic circuits are formed by CVD. Silica layers are used as diffusion sources, intermetallic dielectrics, and dopant and etch barriers in the microelectronics industry. CVD of Si02 is also commonly used in manufacturing energy-efficient glass windows, surface coatings for fiber optics, and micromechanical applications. ... 

You should use many of the same kinds of protection for vacuum systems as you use for high-pressure systems—chemical splash goggles, face shield, and protective shielding. The glass equipment must be designed for vacuum conditions for example, some flasks are made with flat bottoms and these should not be used on rotary evaporators since flat surfaces are inherently subject to failure when the two sides are at different pressures. Always check equipment for cracks, scratches, or etches that could weaken the vessels and cause collapse under vacuum. Vacuum desiccators should be handled carefully after evacuation—you should wrap these with fiber or electrical tape to prevent flying glass in the event of implosion. 

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