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Fabrication processes tape casting

Many different types of sensors have also been fabricated by tape casting. One of the most widely used sensors is the oxygen sensor used in automotive and other applications. These sensors are based upon solid-state conductivity of the ceramic elements at elevated temperatures. Most are fabricated from stabilized zirconia, which is the electrolyte in the device. The zirconia is a solid ionic conductor that transforms oxygen partial pressure or activity gradients into an electrical signal, which can then be further processed to perform control activities such as carburation or ignition modification. The... [Pg.216]

Equally important as tape casting in the fabrication of multilayer ceramics is thick film processing. Thick film technology is widely used in microelectronics for resistor networks, hybrid integrated circuitry, and discrete components, such as capacitors and inductors along with metallization of MLC capacitors and packages as mentioned above. [Pg.313]

Once the structural support layers have been fabricated by extrusion or EPD for tubular cells or by tape casting or powder pressing for planar cells, the subsequent cell layers must be deposited to complete the cell. A wide variety of fabrication methods have been utilized for this purpose, with the choice of method or methods depending on the cell geometry (tubular or planar, and overall size) materials to be deposited and support layer material, both in terms of compatibility of the process with the layer to be deposited and with the previously deposited layers, and desired microstructure of the layer being deposited. In general, the methods can be classified into two very broad categories wet-ceramic techniques and direct-deposition techniques. [Pg.256]

Brief summaries of the various processing technologies used in fabricating cell components are given in Section 3.6.9.They include tape-casting, calendering, screen-printing, electrophoretic deposition, electrochemical vapour deposition, chemical vapour deposition, spray-pyrolysis and sol-gel. [Pg.191]

R.E. Mistier, D.J. Shanefield and R.B. Runk, Tape casting of ceramics, in G.Y. Onoda and L.E. Hench (ed.). Ceramic Fabrication Processing Before Firing. Wiley Interscience, New York, NY, 1978, pp. 411-448. [Pg.138]

The tape casting process, which is utilized widely in the electronics industry, has been adopted by many MCFC developers. The tape casting process was originally introduced for matrix fabrication, because of its... [Pg.1756]

FABRICATION OF Ni-GDC ANODE SUBSTRATE BY TAPE CASTING PROCESS... [Pg.191]

Fabrication of Ni-GDC Anode Substrate by Tape Casting Process... [Pg.192]

Next to tubes and fibers, tbin ceramic sheets are also a very interesting subject for the development of thermoplastic ceramic extrusion systems. It has been shown that it is feasible to produce ceramic sheets and films with thicknesses under 200 pm. Figure 8 shows a picture of a ceramic sheet made of silicon dioxide nanoparticles. This technique could, for example, be used for the fabrication of multilayer ceramic bodies (e.g. multilayer capacitors, structural laminates) which currently are produced using the tape casting process. Big advantages relative to this conventional process would be the recycleability of the thermoplastic feedstocks and the higher achievable powder loading. [Pg.341]


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See also in sourсe #XX -- [ Pg.3 , Pg.4 , Pg.20 ]




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