Epoxy resins processing

It is these solid carboxylic nitrile elastomers which began to show utility in the modification of epoxy resins. Processing needs for solid elastomer Inclusion, particularly in liquid epoxy resins, have not always been advantageous. Associated problems include gel, viscosity threshold limitations and achieving desired rubber levels in excess of 5-6 phr. Sometimes processing must be carried out in selected solvents, not always a desirable or tolerable step. 

Thermosetting-encapsulation compounds, based on epoxy resins (qv) or, in some niche appHcations, organosiHcon polymers, are widely used to encase electronic devices. Polyurethanes, polyimides, and polyesters are used to encase modules and hybrids intended for use under low temperature, low humidity conditions. Modified polyimides have the advantages of thermal and moisture stabiHty, low coefficients of thermal expansion, and high material purity. Thermoplastics are rarely used for PEMs, because they are low in purity, requHe unacceptably high temperature and pressure processing conditions. 

A variety of thermosetting resins are used in SMC. Polyesters represent the most volume and are available in systems that provide low shrinkage and low surface profile by means of special additives. Class A automotive surface requirements have resulted in the development of sophisticated systems that commercially produce auto body panels that can be taken direcdy from the mold and processed through standard automotive painting systems, without additional surface finishing. Vinyl ester and epoxy resins (qv) are also used in SMC for more stmcturaHy demanding appHcations. 

Process Raw Material. Industrial solvents are raw materials in some production processes. Eor example, only a small proportion of acetone is used as a solvent, most is used in producing methyl methacrylate and bisphenol A. Alcohols are used in the manufacture of esters and glycol ethers. Diethylenetriamine is also used in the manufacture of curing agents for epoxy resins. Traditionally, chlorinated hydrocarbon solvents have been the starting materials for duorinated hydrocarbon production. 

The thermoplastic or thermoset nature of the resin in the colorant—resin matrix is also important. For thermoplastics, the polymerisation reaction is completed, the materials are processed at or close to their melting points, and scrap may be reground and remolded, eg, polyethylene, propjiene, poly(vinyl chloride), acetal resins (qv), acryhcs, ABS, nylons, ceUulosics, and polystyrene (see Olefin polymers Vinyl polymers Acrylic ester polymers Polyamides Cellulose ESTERS Styrene polymers). In the case of thermoset resins, the chemical reaction is only partially complete when the colorants are added and is concluded when the resin is molded. The result is a nonmeltable cross-linked resin that caimot be reworked, eg, epoxy resins (qv), urea—formaldehyde, melamine—formaldehyde, phenoHcs, and thermoset polyesters (qv) (see Amino resins and plastics Phenolic resins). 

Vinyl ester resins generally offer mechanical properties superior to those of polyester matrices but at an increased cost. Vinyl esters are chemically similar to epoxy resins but are manufactured via a cold-curing process similar to that used in the manufacture of polyester resins. Vinyl esters offer superior resistance to water and chemical attack and are used in such appHcations as underground pipes, tank liners, and storage tanks (see Vinyl polymers). 

Commonly accepted practice restricts the term to plastics that serve engineering purposes and can be processed and reprocessed by injection and extmsion methods. This excludes the so-called specialty plastics, eg, fluorocarbon polymers and infusible film products such as Kapton and Updex polyimide film, and thermosets including phenoHcs, epoxies, urea—formaldehydes, and sdicones, some of which have been termed engineering plastics by other authors (4) (see Elastol rs, synthetic-fluorocarbon elastol rs Eluorine compounds, organic-tdtrafluoroethylenecopolyt rs with ethylene Phenolic resins Epoxy resins Amino resins and plastics). 

In the preparation of commercial DGEBPA, an excess of epichl orohydrin is used in order to minimize polymeriza tion of the reactants to higher molecular-weight species. Nevertheless, the typical viscous final product usually contains ca 80% by weight of the monomeric (n = 0) DGEBPA as deterrnined by gel-permeation chromatography (gpc). The manufacture of Hquid epoxy resins in a batch process has been described in some detail (9). 

Polyfunctional aliphatic resins have exhibited high reactivity and degrees of cure with amines but problems of toxicity have diminished their usehilness and commercial interest. SoHd epoxy resins can be prepared by the taffy process or the advancement process. 

Advancement Process. In the advancement process, sometimes referred to as the fusion method, Hquid epoxy resin (cmde diglycidyl ether of bisphenol A) is chain-extended with bisphenol A in the presence of a catalyst to yield higher polymerized products. The advancement reaction is conducted at elevated temperatures (175—200°C) and is monitored for epoxy value and viscosity specifications. The finished product is isolated by cooling and cmshing or flaking the molten resin or by allowing it to soHdify in containers. 

Gel-permeation chromatography studies of epoxy resins prepared by the taffy process shown n values = 0, 1, 2, 3, etc, whereas only even-numbered repeat units are observed for resins prepared by the advancement process. This is a consequence of adding a difunctional phenol to a diglycidyl ether derivative of a difunctional phenol in the polymer-forming step. 

In recent years, proprietary catalysts for advancement have been incorporated in precataly2ed Hquid resins. Thus only the addition of bisphenol A is needed to produce soHd epoxy resins. Use of the catalysts is claimed to provide resins free from branching which can occur in conventional fusion processes (10). Additionally, use of the catalysts results in rapid chain-extension reactions because of the high amount of heat generated in the processing. 

The preparation of flame-retardant epoxy resins is accompanied by inclusion of tetrabromobisphenol A [79-94-7] in the advancement process (see Flame retardants). Products containing ca 20 wt % Br are extensively employed in the printed circuit board industry. 

The commercial interest in epoxide (epoxy) resins was first made apparent by the publication of German Patent 676117 by I G Farben in 1939 which described liquid polyepoxides. In 1943 P. Castan filed US Patent 2 324483, covering the curing of the resins with dibasic acids. This important process was subsequently exploited by the Ciba Company. A later patent of Castan covered the hardening of epoxide resins with alkaline catalysts used in the range 0.1-5% This patent, however, became of somewhat restricted value as the important amine hardeners are usually used in quantities higher than 5%. 

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