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Electronics adhesives cured

Adhesive tapes (electron-beam-cured adhesives)... [Pg.433]

Sulfur chemistry [29] has also been used to crosslink rubber/resin PSAs, although the use of elemental sulfur itself yields tapes that can stain substrates. Other patents exemplify the use of typical rubber vulcanizing chemistry such as Tetrone A , dipentamethylenethiuramtetrasulfide, and Tuads , tetramethylthiu-ram disulfide [30], or zinc butyl xanthate [31] for this purpose. Early art [32] also claimed electron beam curing of both natural rubber and other adhesives that were solvent coated on tape backings. Later references to electron beam curing... [Pg.475]

In the field of adhesives, electron beam curing has been used mainly in pressure-sensitive and laminating adhesives. ... [Pg.205]

Because of the precise control of the degree of cross-linking attainable by the electron beam process, it is well suited for the production of PSAs. Recent developments in EB design, particularly lower voltage, and materials developments have made electron beam curing of pressure-sensitive adhesives affordable, practical, and possible. ... [Pg.206]

ULTRAVIOLET AND ELECTRON BEAM CURED EPOXY ADHESIVES... [Pg.255]

Acrylic acid, isobomyl ester Ageflex IBOA Al-co-cure IBA Ebecryl IBOA EINECS 227-561-6 IBOA Isobomyl acrylate Light Acrylate IB-XA 2-Propenolc acid, (1R,2R,4R)-1,7,7-trimethylbicyclo(2.2.1)hept-2-ylester, rel- 2-Propenoic acid, 1,7,7-trimethylbicyclo(2.2.1)hept-2-yl ester, exo- QM 589 Sartomer 506 SR 506 SR 506 (acrylate). Intermediate in the preparation of monomers and for acrylic polymers which, when cured provide hardness, low shnnkage, abrasion resistant, heat and water resistant, good weatherability in automotive coatings, electronics, adhesives. Liquid mp = -60° d 8 = 0.986 m.p. -60° f.p. <-20° flash... [Pg.342]

Trimethylbicyclo-(2.2.1)hept-2-yl methacrylate. Monomers when cured providing hardness, low shrinkage, abrasion resistance, heat and water resistance, good weatherability in automotive coatings, electronics, adhesives, and other acrylic polymers. Liquid mp = -60° bp = 245° djfl = 0.983. Rhine Poulenc Surfactants Rit-Chem. [Pg.343]

Plasma cleaning Dry process (no solvents or chemical solutions) active oxygen plasma is an aggressive cleaner for organic residues effective in removing adhesive bleedout Electron-free plasma is required to avoid damage to sensitive components cleaning surfaces with plasma prior to adhesive cure enhances bleedout... [Pg.160]

Formula CH HOCOCH CH OCOCH CH CH CH CH OH Uses Adhesion props, for UV and electron beam curing as protective coating for metal, plastics, wood, and paper as acrylic adhesive for metal, plastics, PC, acrylic sheet, and paper Trade Names SR 495... [Pg.1023]

The contributions of physics to adhesion are further manifested by the extension of uv- and electron-beam curing of adhesives to low temperatures. Radiation-curable adhesives were originally intended to eliminate solvents in the systems. However, the use of certain toxic acrylate monomers presented some problems. So far, radiation-curable systems have become technologically challenging, but economically less attractive than most thermally cured systems. Since one of the earliest papers on photoadhesives by Nakano (35) many patents have been issued on this subject. Two reviews have been published by Stueben (36). ... [Pg.9]

The papers presented in the following chapters represent advances in pressure sensitive adhesives (ultraviolet light activated acrylate monomer - low Tg polyether formulations) photoinitiated cationic polymerization (light activated aryliodonium and arylsulfonium salts of lewis acids in epoxy resin formulations) polymer and formulation design criteria for radiation curable adhesives radiation curable composites (dynamic thermal analysis characterization of electron beam cured... [Pg.317]

Dynamic Thermal Analysis Characterizations of Electron-Beam Cured Adhesives... [Pg.379]

CHARACTERIZATIONS OF ELECTRON-BEAM CURED ADHESIVES ACKNOWLEDGMENT... [Pg.392]

An electronics manufacturer attaches a plastic base to a 1-in. square ceramic circuit holder with a UV adhesive. Cure time is 10 seconds, which is about the same as the previously used cyanoacrylate. The lower cost, higher performance, and worker safety features justified the change in adhesive. [Pg.746]

For some electrical and electronic adhesive applications it may be advantageous to use CTBN modified epoxide adhesives in place of unmodified epoxides because of the enhanced tensile shear strengths achieved. The tensile shear strengths for a boron trifluoride amine complex cured DGEBA-type epoxide modified with various amounts of CTBN on solvent-cleaned cold-rolled steel are shown in Table 10.3. [Pg.322]

The curing time of EB adhesives is comparable to that of UV adhesives. In general, EB radiation allows adhesive curing to be achieved at greater depths than is possible with UV radiation. Electrons can pass through substrates that are opaque to UV light. In addition, the area of exposure and the depth of penetration can be controlled by means of the EB conditions. [Pg.43]

Several systems may be important in the future as aerospace adhesives, electronic adhesives, high solid adhesives, hot melt adhesives, and photo-cured adhesives. We believe that future adhesives will be less likely to pollute the environments and will somehow save energy. [Pg.18]

See other pages where Electronics adhesives cured is mentioned: [Pg.206]    [Pg.175]    [Pg.260]    [Pg.330]    [Pg.175]    [Pg.123]    [Pg.294]    [Pg.1021]    [Pg.146]    [Pg.348]    [Pg.54]    [Pg.320]    [Pg.381]    [Pg.383]    [Pg.385]    [Pg.387]    [Pg.389]    [Pg.390]    [Pg.643]    [Pg.306]    [Pg.361]    [Pg.146]    [Pg.350]    [Pg.48]    [Pg.491]   
See also in sourсe #XX -- [ Pg.287 ]



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