Electroless deposition for

Hilmi, A. and J. H. T. Luong. Electrochemical detectors prepared by electroless deposition for microfabricated electrophoresis chips. Anal. Chem. 72, 4677-4682 (2000). 

Hilmi, A., and J. H. T. Luong. Electrochemical detectors prepared by electroless deposition for microfabricated electrophoresis chips. Anal. Chem. 72, 4677-4682 (2000b). Hines, M. A. and P. Guyot-Sionnest. Synthesis and characterization of strongly luminescing ZnS-capped CdSe nanocrystals. J. Phys. Chem. 100, 468-471 (1996). 

J. Wang, G. Chen and M.P. Chatrathi, Nickel amperometric detector prepared by electroless deposition for microchip electrophoretic measurement of alcohols and sugars, Electroanalysis, 16 (2004) 1603-1608. 

Wang et al.37 used TaN/Si02/Si substrates with hole pattern, as schematically presented in Fig. 4, for investigating filling via hole by electroless deposition. For this purpose, the ionized cluster beam (ICB) Pd layers with a thickness of 1-2 nm were deposited. The diameter of holes was in the range 0.31-1.0 (dm with depth 1.5 (dm. The solution for electroless deposition of copper and operating conditions, used in Wang s work, is presented in Table 4. 

Electroless Deposition for Energy Conversion and Catalytic Purposes... 

Soft Magnetic Underlayer by Electroless-Deposition for Perpendicular Magnetic Recording... 

The most commonly used process is electroplating, either by electrochemical or by electroless deposition. For nearly aU conditions, these methods provide a corrosion-protective solution, either consisting of the deposition of a one layer or a multilayer process. Because electroplating also provides the most economical solution for metallic coatings, we will concentrate on this method in this article. The main advantage of an electrochemicaUy prepared metaUic coating is the mechanism of... 

Chen et al. [95], very recently, prepared Au thin-film electrodes made by electroless deposition for in situ electrochemical attenuated total-reflection surface-enhanced infrared adsorption spectroscopy (ATR-SEIRAS) which consisted of 46 nm Au nanoparticles deposited on a Si infrared window. Very interestingly, they observed that a square-wave treatment of the Au film led to a much enhanced ORR activity (02-saturated 0.1 M HCIO4) as a consequence of the surface reconstruction of the nanoparticle film. Thus, whereas the ORR activity of the initial Au... 

Kim JW, Ryu JH, Lee KT, Oh SM (2005) Improvement of silicon powder negative electrodes by copper electroless deposition for lithium secondary batteries. J Power Sourc 147 227-233... 

Electroless Electrolytic Plating. In electroless or autocatalytic plating, no external voltage/current source is required (21). The voltage/current is suppHed by the chemical reduction of an agent at the deposit surface. The reduction reaction must be catalyzed, and often boron or phosphoms is used as the catalyst. Materials that are commonly deposited by electroless plating (qv) are Ni, Cu, Au, Pd, Pt, Ag, Co, and Ni—Fe (permalloy). In order to initiate the electroless deposition process, a catalyst must be present on the surface. A common catalyst for electroless nickel is tin. Often an accelerator is needed to remove the protective coat on the catalysis and start the reaction. 

The important beneficial effects that substrate roughness can bring were firmly established in the late sixties and early seventies, principally as a result of work in two areas. The first was associated with the electroless deposition of metals onto plastics such as ABS and polypropylene. In the process the plastics must be etched in a way which produces pits on a micrometre scale. Such a topography had been shown to be a necessary, but not sufficient condition for adequate adhesion [40]. 

The most extensively used reducing agent for the electroless deposition of nickel is hypophosphite", and the reaction is as follows ... 

Simple electroless techniques have been used for the formation of CdTe layers following an anodic or a cathodic route of deposition. For instance, spontaneous cathodic formation of CdTe was observed on Ti or glass electrodes short circuited with a corroding A1 contact (electron source) in a solution of Cd " " and HTe02 ions [96]. After thermal treatment and subsequent growth of an a-Pb02 layer on them, the as-obtained CdTe thin films were found to exhibit n-type behavior in alkaline polysulfide PEC cells. 

Photovoltaic response parameters for electrodeposited (polycrystalline) CdTe thin film electrodes in sulfide-polysulfide or alkaline sodium telluride PEC have been reported, primarily with no reference to the stability of the cells [100], In view of the instability of CdTe in aqueous solutions, Bhattacharya and Rajeshwar [101] employed two methods for the characterization of their electrodeposited CdTe-based PEC. In the first one, a coating of Pb02 (-100 nm thick) was deposited on the CdTe film surface by electroless deposition, and the coated films... 

According to Ref. [12], template for synthesis of nanomaterials is defined as a central structure within which a network forms in such a way that removal of this template creates a filled cavity with morphological or stereochemical features related to those of the template. The template synthesis was applied for preparation of various nanostructures inside different three-dimensional nanoporous structures. Chemically, these materials are presented by polymers, metals, oxides, carbides and other substances. Synthetic methods include electrochemical deposition, electroless deposition, chemical polymerization, sol-gel deposition and chemical vapor deposition. These works were reviewed in Refs. [12,20]. An essential feature of this... 

Electroless Deposition Processes for Thin-Film Media. 253... 

Structure-Magnetics Interrelationships for Electrolessly Deposited Media. 258... 

The electrochemical mechanism was rejected by Salvago and Cavallotti [26] on the basis that it does not explain several features of electroless deposition of ferrous metals it does not account for the isotopic composition of the H2 gas evolved it does not explain the effect of the various solution components on reaction rate and it does not account for the homogeneous decomposition of very active solutions or the fact that they can give deposition on insulating surfaces. These authors put forward a chemical mechanism, involving various hydrolyzed nickel species, which they claim explains the observed behavior of the system ... 

The substrate was also found to influence the properties of the electrolessly deposited vertical media CoNiMnP, CoNiReMnP, and CoNiReP. The c-axis orientation had a larger degree of perpendicular orientation for films deposited on electroless NiP than for those deposited on Cu foil, presumably because of the smaller roughness of the former substrate [43]. The double-layer (magnetically soft interface, magnetically hard bulk) properties of CoNiReP deposited on a NiMoP underlayer [57] have already been discussed. 

The structures of electroplated hard alloys have been less extensively studied than those of similar electrolessly deposited materials. Sallo and co-workers [118-120] have investigated the relationship between the structure and the magnetic properties of CoP and CoNiP electrodeposits. The structures and domain patterns were different for deposits with different ranges of coercivity. The lower-f/c materials formed lamellar structures with the easy axis of magnetization in the plane of the film. The high-Hc deposits, on the other hand, had a rod-like structure, and shape anisotropy may have contributed to the high coercivity. The platelets and rods are presumed to be isolated by a thin layer of a nonmagnetic material. 

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