Electrodeposition transfer process

The polarization curves for the electrodeposition process, which include the Ohmic voltage drop, can be obtained as follows, assuming = 1 in all cases.7,9,24 This will be performed for a one-electron transfer process and /3 = 0.5, meaning y = O.5.7... 

One of these is the "shape change" phenomenon, in which the location of the electrodeposit is not the same as that of the discharge (deplating) process. Thus, upon cycling, the electrode metal is preferentially transferred to new locations. For the most part, this is a problem of current distribution and hydrodynamics rather than being a materials issue, therefore it will not be discussed further here. 

The incorporation of a third element, e.g. Cu, in electroless Ni-P coatings has been shown to improve thermal stability and other properties of these coatings [99]. Chassaing et al. [100] carried out an electrochemical study of electroless deposition of Ni-Cu-P alloys (55-65 wt% Ni, 25-35 wt% Cu, 7-10 wt% P). As mentioned earlier, pure Cu surfaces do not catalyze the oxidation of hypophosphite. They observed interactions between the anodic and cathodic processes both reactions exhibited faster kinetics in the full electroless solutions than their respective half cell environments (mixed potential theory model is apparently inapplicable). The mechanism responsible for this enhancement has not been established, however. It is possible that an adsorbed species related to hypophosphite mediates electron transfer between the surface and Ni2+ and Cu2+, rather in the manner that halide ions facilitate electron transfer in other systems, e.g., as has been recently demonstrated in the case of In electrodeposition from solutions containing Cl [101]. 

Electrodeposition is by its nature a condensed phase process, whereas most studies of ALE have been performed using gas phase or vacuum methodologies, CVD or MBE. A solution phase deposition methodology related to ALE has been developed in France by Nicolau et al. [27-32] (Fig. 2), in which adsorbed layers of elements are formed by rinsing a substrate in aqueous solutions containing ionic precursor for the desired elements, sequentially, in a cycle. After exposure to each precursor, the substrate is copiously rinsed and then transferred to a solution containing the precursor for the next element. The method is referred to as successive ionic layer adsorption and reaction (SILAR). Reactivity in SILAR appears to be controlled by the rinsing procedure, solution composition, pH, and specifically... 

In the electrodeposition of metals, a metal ion is transferred from solution into the ionic metal lattice. A simplified atomistic representation of this process is... 

In the discussion of atomistic aspects of electrodepKJsition of metals in Section 6.8 it was shown that in electrodeposition the transfer of a metal ion M"+ from the solution into the ionic metal lattice in the electrodeposition process may proceed via one of two mechanisms (1) a direct mechanism in which ion transfer takes place on a kink site of a step edge or on any site on the step edge (any growth site) or (2) the terrace-site ion mechanism. In the terrace-site transfer mechanism a metal ion is transferred from the solution (OHP) to the flat face of the terrace region. At this position the metal ion is in an adion state and is weakly bound to the crystal lattice. From this position it diffuses onto the surface, seeking a position with lower potential energy. The final position is a kink site. 

The cadmium electrodeposition on the solid cadmium electrode from the sulfate medium was investigated [217]. The following kinetic parameters were obtained cathodic transfer coefficient a = 0.65, exchange current density Iq = 3.41 mA cm , and standard rate constant kg = 8.98 X 10 cm s . The electrochemical deposition of cadmium is a complex process due to the coexistence of the adsorption and nucleation process involving Cd(II) species in the adsorbed state. 

O Brien. 1235 Ohmic drop, 811, 1089, 1108 Ohmic resistance, 1175 Ohm s law, 1127. 1172 Open circuit cell, 1350 Open circuit decay method, 1412 Order of electrodic reaction, definition 1187. 1188 cathodic reaction, 1188 anodic reaction, 1188 Organic adsorption. 968. 978. 1339 additives, electrodeposition, 1339 aliphatic molecules, 978, 979 and the almost-null current test. 971 aromatic compounds, 979 charge transfer reaction, 969, 970 chemical potential, 975 as corrosion inhibitors, 968, 1192 electrode properties and, 979 electrolyte properties and, 979 forces involved in, 971, 972 977, 978 free energy, 971 functional groups in, 979 heterogeneity of the electrode, 983, 1195 hydrocarbon chains, 978, 979 hydrogen coadsorption and, 1340 hydrophilicity and, 982 importance, 968 and industrial processes, 968 irreversible. 969. 970 isotherms and, 982, 983... 

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