Electrochemical reaction, electroless deposition

The electrochemical mechanism was rejected by Salvago and Cavallotti [26] on the basis that it does not explain several features of electroless deposition of ferrous metals it does not account for the isotopic composition of the H2 gas evolved it does not explain the effect of the various solution components on reaction rate and it does not account for the homogeneous decomposition of very active solutions or the fact that they can give deposition on insulating surfaces. These authors put forward a chemical mechanism, involving various hydrolyzed nickel species, which they claim explains the observed behavior of the system ... 

Mital et al. [40] studied the electroless deposition of Ni from DMAB and hypophosphite electrolytes, employing a variety of electrochemical techniques. They concluded that an electrochemical mechanism predominated in the case of the DMAB reductant, whereas reduction by hypophosphite was chemically controlled. The conclusion was based on mixed-potential theory the electrochemical oxidation rate of hypophosphite was found, in the absence of Ni2 + ions, to be significantly less than its oxidation rate at an equivalent potential during the electroless process. These authors do not take into account the possible implication of Ni2+ (or Co2+) ions to the mechanism of electrochemical reactions of hypophosphite. 

With regard to eqn. (2), which represents the metal deposition half reaction in electroless deposition, in a simplistic sense we see that it is analogous to an electrodeposition process. With respect to the reducing agent reaction, organic [20, 21] and relatively complex inorganic oxidation reactions [22] have similarly been widely studied electrochemically. It is therefore reasonable to think that electroless deposition could be described, or modeled, using an electrochemical approach. 

Paunovic [23] and Saito [24] first advanced the notion that an electroless deposition process could be modeled using a simple electrochemical approach. They reasoned that the potential of a surface undergoing electroless deposition could be regarded as a mixed potential intermediate in value between the potentials of its constituent anodic and cathodic partial reactions. These authors employed the mixed potential concept of corrosion reactions first outlined in a systematic manner by Wagner and... 

The shapes of the polarization curves shown in Fig. 3, including those generally observed for other reducing agents, are invariably complex, and not representative of simple electrochemical reactions. From the inception of modern electroless deposition practice, a number of mechanisms have been advanced to describe the electroless deposition process, many of which dealt with Ni-P. These classical mechanisms include the following ... 

As suggested by Epelboin et al. [72] on the basis of electrochemical impedance measurements, Ni [ds may play more than one role in Ni electrodeposition, and by extension, similar roles in electroless deposition. It is worth briefly noting the reactions Epelboin et al. proposed in which a Ni [ds intermediate may be involved in ... 

The incorporation of a third element, e.g. Cu, in electroless Ni-P coatings has been shown to improve thermal stability and other properties of these coatings [99]. Chassaing et al. [100] carried out an electrochemical study of electroless deposition of Ni-Cu-P alloys (55-65 wt% Ni, 25-35 wt% Cu, 7-10 wt% P). As mentioned earlier, pure Cu surfaces do not catalyze the oxidation of hypophosphite. They observed interactions between the anodic and cathodic processes both reactions exhibited faster kinetics in the full electroless solutions than their respective half cell environments (mixed potential theory model is apparently inapplicable). The mechanism responsible for this enhancement has not been established, however. It is possible that an adsorbed species related to hypophosphite mediates electron transfer between the surface and Ni2+ and Cu2+, rather in the manner that halide ions facilitate electron transfer in other systems, e.g., as has been recently demonstrated in the case of In electrodeposition from solutions containing Cl [101]. 

This can be accomplished by means of two different processes (1) an electrodeposition process in which z electrons (e) are provided by an external power supply, and (2) an electroless (autocatalytic) deposition process in which a reducing agent in the solution is the electron source (no external power supply is involved). These two processes, electrodeposition and electroless deposition, constitute the electrochemical deposition. In this book we treat both of these processes. In either case our interest is in a metal electrode in contact with an aqueous ionic solution. Deposition reaction presented by Eq. (1.1) is a reaction of charged particles at the interface between a solid metal electrode and a liquid solution. The two types of charged particles, a metal ion and an electron, can cross the interface. 

In electroless deposition the two electrochemical reactions, reduction of oxidation of Redsoiution occur at the same electrode, at the same electrode-electrolyte interface [Eq. (8.2) and Fig. 8.1]. Thus, in electroless deposition there is a statistical division of the catalytic sites on the substrate into anodic and cathodic sites. Since these catalytic sites are part of the same piece of metal (substrate), there is a flow of electrons between these sites. 

In this chapter we discuss the electrochemical model of electroless deposition (Sections 8.2 and 8.3), kinetics and mechanism of partial reactions (Sections 8.4 and 8.5), activation of noncatalytic surfaces (Section 8.6), kinetics of electroless deposition (Section 8.7), the mechanism of electroless crystallization (Section 8.8), and unique properties of some deposits (Section 8.9). 

An electrochemical model for the process of electroless metal deposition was suggested by Paunovic (10) and Saito (8) on the basis of the Wagner-Traud (1) mixed-potential theory of corrosion processes. According to the mixed-potential theory of electroless deposition, the overall reaction given by Eq. (8.2) can be decomposed into one reduction reaction, the cathodic partial reaction. 

Wagner-Traud Diagram, According to the mixed-potential theory, the overall reaction of the electroless deposition, [Eq. (8.2)] can be described electrochemically in terms of three current-potential i-E) curves, as shown schematically in Eigure 8.2. First, there are two current-potential curves for the partial reactions (solid curves) (1) ic =f(E), the current-potential curve for the reduction of ions, recorded from the rest potential E eq M the absence of the reducing agent Red (when the activity of is equal to 1, eq,M E m) and (2) = f(E), the current-potential... 

For example, in electroless deposition of copper, when the reducing agent is formaldehyde and the snbstrate is Cu, Hads desorbs in the chemical reaction (8.17). If the substrate is Pd or Pt, hydrogen desorbs in the electrochemical reaction (8.18). 

Steady-State Kinetics, There are two electrochemical methods for determination of the steady-state rate of an electrochemical reaction at the mixed potential. In the first method (the intercept method) the rate is determined as the current coordinate of the intersection of the high overpotential polarization curves for the partial cathodic and anodic processes, measured from the rest potential. In the second method (the low-overpotential method) the rate is determined from the low-overpotential polarization data for partial cathodic and anodic processes, measured from the mixed potential. The first method was illustrated in Figures 8.3 and 8.4. The second method is discussed briefly here. Typical current—potential curves in the vicinity of the mixed potential for the electroless copper deposition (average of six trials) are shown in Figure 8.13. The rate of deposition may be calculated from these curves using the Le Roy equation (29,30) ... 

Electrochemical properties of silicon single crystals, usually cuts of semiconductor wafers, have to be considered under two distinct respects (1) As an electrode, silicon is a source of charge carriers, electrons or positive holes, involved in electrochemical reactions, and whose surface concentration is a determining parameter for the rate of charge transfer. (2) As a chemical element, silicon material is also involved in redox transformations such as electroless deposition, oxide generation, and anodic etching, or corrosion processes. 

The film deposition was carried out at room temperature from an aqueous solution of plumbous acetate, ammonium acetate, and ammonium persulphate, using NH4OH to bring the pH to 6. A trace of AgNOs was added as a catalyst for reaction 7.4 [29]. A film of PbOi ca. 50 nm thick was formed in an hour. Once this initial film was deposited, thicker films could be built up, usually at a somewhat higher pH, in the absence of the AgNOs. The initial film formation appears to be a pure CD reaction. However, electrochemical studies of further film buildup showed that an electroless deposition mechanism, involving two partial electrochemical reactions, was responsible for film formation. 

Wagner-Traud Diagram. According to the mixed-potential theory, the overall reaction of the electroless deposition, [Eq. (8.2)] can be described electrochemically in terms of three current-potential (i-E) curves, as shown schematically in Figure 8.2. 

Thus, from the kinetic aspects, the cathodic partial reaction is an electrochemical reaction [Eq. (8.14)], which is preceded by a chemical reaction [Eq. (8.13)]. Paunovic (31) studied the first step in the cathodic partial reaction of electroless copper deposition by chronopotentiometry and potential sweep (potentiodynamic)... 

It is well established that the overall electroless deposition reactions are basically electrochemical in nature, consisting of cathodic and anodic partial reactions occurring simultaneously on the same substrate surface ... 

According to the mixed potential theory, the overall reaction should be interpretable simply by superimposing the respective electrochemical behavior of the two partial reactions, determined independently. More recent studies, however, show that electroless deposition processes are much more complicated than represented by the simple mixed potential theory described above. Interdependence of partial reactions and participation of a third reaction are among the complications which limit the significance of simple combination of independently studied partial reactions. Examples of such complications Eire discussed in the subsequent sections. 

In spite of such limitations associated with the application of the mixed potential concept, results of electrochemical investigation of the partial reactions are highly useful to understand the characteristics of electroless deposition processes. 

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