Electro/electroless plating

No reaction with Electro/Electroless plating Cr over coat... 

Characteristic Electro/electroless plating Thermal spray Chemical vapour deposition Physical vapour deposition... 

Electrogalvanizing Electrography Electrogravimetry Electrohydrodynamics Electro-Katadyn process Electrokinetics Electroless deposition Electroless nickel Electroless plating... 

Electroforrning, which is used in the production of art objects or jewelry is a combination of electroless plating and electro deposition. A wax mold of the object to be produced is made conductive by electroless gold plating, a thick layer of gold or gold alloy is then electrodeposited and, finally, the wax is removed by melting (134). 

The major source of hazardous metals from chromating and other chemical conversion processes, as well as from electro- and electroless plating, is generally the process baths themselves. Spent cleaners and etchants also can contain large quantities of metal removed from workpieces. 

The metal was deposited by electro and electroless plating, vacuum deposition and deposition by the decomposition of organometallic compounds. 

Electro- and electroless plating of tin, nickel, gold, and solder are common surface treatments for flexible circuits. Solder plating by a hot-air leveler could be a low-cost solution. However, it entails severe high-temperature process conditions, and the poor uniformity of the solder is not acceptable for several applications. 

Although reactions with hydrazine as an oxidant are possible, these are less frequent. Hydrazine is basically a strong reducing agent and as such reduces many ions to lower oxidation states or even to the bare metal and even beyond, to the hydride. The commonly encountered redox reactions of hydrazine are its autoxidation or atmospheric decay, oxidation in solution, and electro-oxidation. These redox reactions are governed by their reduction potentials and are responsible for its applications in fuel cells, electroless plating, or photographic processes. 

Many electroless coppers also have extended process Hves. Bailout, the process solution that is removed and periodically replaced by Hquid replenishment solution, must still be treated. Better waste treatment processes mean that removal of the copper from electroless copper complexes is easier. Methods have been developed to eliminate formaldehyde in wastewater, using hydrogen peroxide (qv) or other chemicals, or by electrochemical methods. Ion exchange (qv) and electro dialysis methods are available for bath life extension and waste minimi2ation of electroless nickel plating baths (see... 

This paper describes a process for activating polyimide surfaces for electroless metal plating. A thin surface region of a polyimide film can be electro-chemically reduced when contacted with certain reducing agent solutions. The electroactivity of polyimides is used to mediate electron transfer for depositing catalytic metal (e.g., Pd, Pt, Ni, Cu) seeds onto the polymer surface. The proposed metal deposition mechanism presented is based on results obtained from cyclic voltammetric, UV-visible, and Rutherford backscattering analysis of reduced and metallized polyimide films. This process allows blanket and full-additive metallization of polymeric materials for electronic device fabrication. 

There is a basic difference between the damascene and the plating-through-mask processes in the way in which the trenches and vias are filled with electrochemically deposited Cu, either through electro- or electroless technique. In multilevel metal structures, vias provide... 

All books, reviews, and entries on CPs describe the potential applications. Chandrasekhar and others ° have reviewed in comprehensive fashion the applications of CPs, including batteries sensors electro-optic and optical devices microwave- and conductivity-based technologies electrochromic devices electrochemomechanical and chemomechanical devices corrosion protection semiconductor, lithography, and electrically related applications— photovoltaics, heterojunction, and photoelectrochemical cells capacitors electrolytic and electroless metal plating CP-based molecular electronic devices catalysis and delivery of drugs and chemicals membranes and LEDs. 

The related processes for metal deposition include electroless deposition, immersion plating, and electro-forming. They follow the basic principles of electrochemistry. 

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