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Defects voids

In these studies the role of the surface, the sample temperature and the sample structure (defects, voids and crystallinity) appear to be important but require further study. As mentioned earlier, void formation has been imaged when ice is placed in an electron microscope. However, the relationship between the formation of interior surfaces and O2 production has not been studied, although it appears that O2 may be formed more efficiently at a surface. [Pg.405]

Sub-conformal and conformal electrodeposition of copper in vias and trenches, on the other hand, occurs in an additive-free acid sulfate solution. These deposits have two types of defects voids and seams (Fig. 3 in Ref. 22). [Pg.389]

Volume lattice defects voids, and inclusions (for example, graphite inclusionsf ). [Pg.45]

Even if the principal cause of corrosion is carbonation or chloride penetration, construction defects (voids, honeycombs, early cracks, etc.) or other processes of deterioration (sulfate, freeze-thaw, dynamic loading, etc.) can contribute to the damage of the structure. These should be detected in order to take appropriate measures in the repair work. Furthermore, the condition of the structure with regard to stability must be investigated in order to define if strengthening is required. [Pg.330]

The expansion creates an internal force in the molding compound, which is maintained until gel or cure takes place. This results in reduction of surface defects, voids and hollow parts. It will also reduce resin shrinkage while a syntactic foam core is established. Parts containing hollow microspheres can be deflashed and trimmed more easily and with less work. They are also easier to grind, drill, tap, and thread with increased holding power, which can be attributed to the syntactic foam, which will exhibit compression/ rebound properties. [Pg.54]

Fig. 79. The stmcture of the Si(100)2xl-Sb surface, (a) 50x50 empty state STM image of the Si(100)2xl-Sb surface formed by annealing of 0.6 ML Sb at 820 K. The surface comprises the array of the Sb dimer rows. The brighter areas are Sb dimers of the second Sb layer. The surface is characterized by a high density of defects, voids (seen as dark regions) and anti-phase domain boundaries, (b) The registry of the Sb dimers observed by STM relative to the clean Si(100)2xl surface. The Sb dimers are aligned perpendicular to the Si dimers and form rows that run parallel to the Si dimer direction [90R4]. Similar stmcture is formed in Te/Si(100) system. Fig. 79. The stmcture of the Si(100)2xl-Sb surface, (a) 50x50 empty state STM image of the Si(100)2xl-Sb surface formed by annealing of 0.6 ML Sb at 820 K. The surface comprises the array of the Sb dimer rows. The brighter areas are Sb dimers of the second Sb layer. The surface is characterized by a high density of defects, voids (seen as dark regions) and anti-phase domain boundaries, (b) The registry of the Sb dimers observed by STM relative to the clean Si(100)2xl surface. The Sb dimers are aligned perpendicular to the Si dimers and form rows that run parallel to the Si dimer direction [90R4]. Similar stmcture is formed in Te/Si(100) system.
Structure Defects Interior defects Voids Impurities Heterogeneity Chemical change Stabilization Process Homogeneity (skin core texture) Extent of applied tension Stabilization rate... [Pg.232]

This technique produces an intimate mixture of cellulose and matrix polymer, which is preserved as the water is evaporated during matrix consolidation. High strength composite films have been produced. A major drawback with this approach is that it is only suitable for forming composite films, and that the consolidation of the polymer matrix requires volatilization and removal of the solvent phase, which may create defects (voids) in the final product and poses economic and environmental concerns. [Pg.131]

Mechanical properties of polymers are dependent on their molecular weight, orientation and crystallinity, material purity, the presence of defects, voids, and/or reinforcing elements in the material, and, polymer chemical structure. Polymer tensile strength and moduli increase with increasing molecular weight up to a plateau of molecular weight, which differs for different polymers [90]. [Pg.60]

Unfortunately, most nondestructive evaluation techniques are not effective at finding encapsulation defects. Voids and density variations are not readily detectable by visual inspection or by x-ray analysis. In the case of x-ray, the inherently low density of encapsnlant foams limits the contrast between filled and unfilled (void) regions. Scanning aconstic microscopy (SAM) has had some limited success when the encapsulant layer is relatively thin, which is not often the case. Witness samples taken during the casting process are used to confirm foam density. [Pg.968]

The lifetime speetra of positron annihilation in the MCM-41 ordered silica before template removal were measured as a function of pressure. The samples were compressed with various hydrostatic pressures by argon. Moreover, the same samples were compressed mechanically. Several lifetime components, well pronounced in the spectra, indicate the presence of various types of defects, voids or pores in the template as well as silica network. When the hydrostatic pressure increases, one can observe evolution of defects in the micellar interior and high stability of micropores in the silica walls of cylindrical pores. In the case of higher mechanical pressure, the samples exhibit strong degradation of silica fiamework. Simultaneously structural changes of template are less pronounced. [Pg.471]

Sohd interfaces caimot be deformed as hquid-fluid ones, therefore, it is not possible to measure direcdy the interfacial force with techniques similar to those just described. The stillness of sohd molecules is also responsible for the apparition of defects (voids, inclusions, dislocations, impurities, etc.) which can induce local tensile and compressive stress fields that alter the surface energy of solids. This topic will be discussed in more detail in the next subsection. [Pg.192]

The microscale It is the level of the defects (voids, micro-cracks...). Here, It is very difficult to know what is the real behaviour (complex microstructure analysis would be required ) and phenomenological considerations are more practical. We will assume a very simple behaviour for the defects elastic-brittle, with a randomly distributed probability... [Pg.241]


See other pages where Defects voids is mentioned: [Pg.329]    [Pg.146]    [Pg.146]    [Pg.41]    [Pg.46]    [Pg.322]    [Pg.346]    [Pg.21]    [Pg.495]    [Pg.181]    [Pg.128]    [Pg.30]    [Pg.76]    [Pg.58]    [Pg.604]    [Pg.330]    [Pg.50]    [Pg.631]   
See also in sourсe #XX -- [ Pg.61 ]

See also in sourсe #XX -- [ Pg.79 ]




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