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Curing process, polymers

Burgel, T., andFedtke, M. Reactions of Cyclic Carbonates with Amines Model Studies for Curing Process, Polym. Bull. 27 (1991) 171-177. [Pg.177]

Xu P and Jing X (2010) Computer simulation of resin flow through the bleeder in the autoclave curing process, Polym Polym Comos 18 213-220. [Pg.33]

The relative effectiveness of nucleating agents in a polymer can be determined by measuring recrystallization exotherms of samples molded at different temperatures (105). The effect of catalyst concentration and filler content has been determined on unsaturated polyesters by using dynamic thermal techniques (124). Effects of formulation change on the heat of mbber vulcanization can be determined by dsc pressurized cells may be needed to reduce volatilization during the cure process (125). [Pg.150]

Radiation-induced degradation reactions are in direct opposition to cross-linking or curing processes, in that the average molecular weight of the preformed polymer decreases because of chain scission and without any subsequent... [Pg.424]

Accelerator activators are chemicals required to initiate the acceleration of the curing process. They also improve the polymer compound quaUty. [Pg.499]

Vinyl ester resins generally offer mechanical properties superior to those of polyester matrices but at an increased cost. Vinyl esters are chemically similar to epoxy resins but are manufactured via a cold-curing process similar to that used in the manufacture of polyester resins. Vinyl esters offer superior resistance to water and chemical attack and are used in such appHcations as underground pipes, tank liners, and storage tanks (see Vinyl polymers). [Pg.7]

Curing primarily refers to the process of solidification of polymer matrix materials. Metal matrix materials are simply heated and cooled around fibers to solidify. Ceramic matrix and carbon matrix materials are either vapor deposited, mixed with fibers in a slurry and hardened, or, in the case of carbon, subjected to repeated liquid infiltration followed by carbonization. Thus, we concentrate here on curing of polymers. [Pg.23]

The final physical properties of thermoset polymers depend primarily on the network structure that is developed during cure. Development of improved thermosets has been hampered by the lack of quantitative relationships between polymer variables and final physical properties. The development of a mathematical relationship between formulation and final cure properties is a formidable task requiring detailed characterization of the polymer components, an understanding of the cure chemistry and a model of the cure kinetics, determination of cure process variables (air temperature, heat transfer etc.), a relationship between cure chemistry and network structure, and the existence of a network structure parameter that correlates with physical properties. The lack of availability of easy-to-use network structure models which are applicable to the complex crosslinking systems typical of "real-world" thermosets makes it difficult to develop such correlations. [Pg.190]

The microwave technique is widely applied to process polymer materials, e.g. in microwave cure [429], Microwave processing is a developing technology. [Pg.102]

Accelerate chemical, photochemical, biochemical reactions or processes, e.g. cross-linking or degradation of polymers. Also called promoters, co-catalysts. Refer usually to the cure process in thermosetting resins. [Pg.773]

The diisocyanates and polyols are reacted to form a high molecular weight hydroxyl terminated millable gum. These millable gums are compounded and processed as conventional elastomers, both sulphur and peroxides being used to cure the polymers. Here again, polyether and polyester types are available, and the differences between these two types referred to above also apply here. [Pg.111]

The thermal polymerization of reactive polyimide oligomers is a critical part of a number of currently important polymers. Both the system in which we are interested, PMR-15, and others like it (LARC-13, HR-600), are useful high temperature resins. They also share the feature that, while the basic structure and chemistry of their imide portions is well defined, the mode of reaction and ultimately the structures that result from their thermally activated end-groups is not clear. Since an understanding of this thermal cure would be an important step towards the improvement of both the cure process and the properties of such systems, we have approached our study of PMR-15 with a focus only on this higher temperature thermal curing process. To this end, we have used small molecule model compounds with pre-formed imide moieties and have concentrated on the chemistry of the norbornenyl end-cap (1). [Pg.53]

Monitoring the polymerization of each substrate provided an informative picture of the effect of both substituents and of isomer distribution on the curing process. We first addressed the question of the relative rates of substrate isomerization and polymerization. We found that, for the parent monomer (PN and PX), the rate of isomerization greatly exceeds the rate of polymerization. Under conditions where PN and PX are fully equilibrated (195°C/15 hrs or 250 /l hr) there is still less than 20% polymer formation in the neat sample. We conclude that for PN or PX the composition of the mixture undergoing polymerization is essentially independent of the starting isomer. The observation that fully cured samples of either PN or PX show identical and C NMR spectra and indistinguishable SEC analyses, is consistent with this contention. [Pg.58]

Wedge test results suggest that the curing process (e.g., percent crosslinking) of the epoxy-polyamide primer system is not affected by the addition of organosilanes, but may be affected by NTMP. The results of substrate surface characterization, adsorption behavior of applied films, and evaluation of candidate inhibitors by chemical, mechanical, and electrochemical test methods are presented. Mechanisms to explain the observed behavior of the various phosphonate and silane polymer systems are discussed. [Pg.234]


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See also in sourсe #XX -- [ Pg.20 ]




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