Crosstalk cause

Faulty Wiring and/or Developmental Delay. Remember that neurotransmission moves through brain circuits. Some mental illnesses may be caused by misconnections in the circuitry that can result in the brain s equivalent of crosstalk that occurs when telephone lines are crossed. Examples of this problem are the so-called neurodevelopmental disorders such as autism, certain forms of mental retardation, and possibly schizophrenia. 

Ruled Line Target. For the measurement of pincushion distortion, we decided to examine a ruled line target. It turned out that the intensity profiles obtained for these measurements were also useful for evaluation of the distortion caused by the pulsing of the SIT vidicon and also for measurement of channel-to-channel crosstalk. 

The development of new materials possessing low dielectric constant (k) is crucial for applications in miniaturized integrated circuits (sub-lOOnm technology). Porous thin films with low k dielectric could provide solutions to the problems of signal delays caused by interconnect resistance-capacitance, signal crosstalk, and power consumption. Suggest a thin film material that would be suitable for low k dielectric applications. 

The amount of internal standard to add to a biological sample has been a matter of some debate. Many workers have added a large excess in the hopes that this would act as a carrier. However, isotopic impurities can in such cases cause considerable "crosstalk" into the SIM channel of the biological sample. A more ideal approach is to add the identical amount of internal standard as is present in the biological sample under normal conditions. With this procedure, decreases and increases in the endogenous ammo acid level can be accurately monitored. An additional feature of this approach is that a full standard curve need not always be constructed since with deuterated internal standards a wide dynamic range in such curves is observed. Indeed, mole ratios (endogenous/internal standard) are linear up to 100 and down to 0.1 (Colby and McCamen, 1979). 

The absence of crosstalk between sample outputs crosstalk is the appearance of a feature on the DSC curve for one sample caused by a transition occurring at another position. 

As discussed in component 1, the dominant background in the LSS is caused by optical crosstalk. It was established that the effect of cosmic events interacting with the liquid scintillating solution is negligible. Noise pulses from photomultiplier tubes are usually cut down to less than 1 cpm by electronic means (Packard Instrument s manual, 1977). Radioactive impurities in carefully-selected materials and surroundings should not contribute more than... 

This fact, with others mentioned in section C, support the argument that the major background is caused by the interaction of cosmic rays with the photomultiplier tubes, resulting in crosstalk between the two tubes. The small background reduction observed with an additional layer of shielding is due to high penetration of the cosmic-ray muon component, which requires massive lead shielding to remove. 

Crosstalk is usually caused by unintentional capacitive (ac) coupling. 

The temperature gradient is not to be confused with thermal lag, which is another physical property that should also be minimized in DSC experiments. Thermal lag is the difference between the average sample temperature and the sensor temperature and is caused by so-called thermal resistance, which characterizes the ability of the material to hinder the flow of heat. Thermal lag is smaller in DSC than in DTA because of smaller sample size (milligrams in DSCs), but more types of thermal resistance develop in DSC than in DTA. These effects are caused by introduction of the sample and reference pans into the DSC sample and reference holders. Thus, in DTA thermal resistance develops between the sample holder (in some instruments called the sample pod) and the sample (analogously, between the reference holder and the reference material), and within the sample and the reference materials. On the other hand, in DSC thermal resistance will develop between the sample holder and the bottom of the sample pan and the bottom of the sample pan and the sample (these are called external thermal resistances), and within the sample itself (this is called internal thermal resistance). These thermal resistances should be taken into account since they determine the thermal lag. Let us suppose that the cell is symmetric with regard to the sample and reference pods or holders, the instrumental thermal resistances are identical for the sample and reference holders, the contact between the pans and the pods are intimate, no crosstalk exists between the sample and reference sensors (i.e.. 

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