Coverage resistance

The first term in Equation 6.27 corresponds to the inverse of the charge-transfer resistance, and the second term represents the inverse of the intermediate coverage resistance (Rc) ... 

Physical Properties. Table 1 (2) shows that olefin fibers differ from other synthetic fibers in two important respects (/) olefin fibers have very low moisture absorption and thus excellent stain resistance and almost equal wet and dry properties, and (2) the low density of olefin fibers allows a much lighter weight product at a specified size or coverage. Thus one kilogram of polypropylene fiber can produce a fabric, carpet, etc, with much more fiber per unit area than a kilogram of most other fibers. 

Dielectric Film Deposition. Dielectric films are found in all VLSI circuits to provide insulation between conducting layers, as diffusion and ion implantation (qv) masks, for diffusion from doped oxides, to cap doped films to prevent outdiffusion, and for passivating devices as a measure of protection against external contamination, moisture, and scratches. Properties that define the nature and function of dielectric films are the dielectric constant, the process temperature, and specific fabrication characteristics such as step coverage, gap-filling capabihties, density stress, contamination, thickness uniformity, deposition rate, and moisture resistance (2). Several processes are used to deposit dielectric films including atmospheric pressure CVD (APCVD), low pressure CVD (LPCVD), or plasma-enhanced CVD (PECVD) (see Plasma technology). 

Aluminum, the most common material used for contacts, is easy to use, has low resistivity, and reduces surface Si02 to form interfacial metal-oxide bonds that promote adhesion to the substrate. However, as designs reach submicrometer dimensions, aluminum, Al, has been found to be a poor choice for metallization of contacts and via holes. Al has relatively poor step coverage, which is nonuniform layer thickness when deposited over right-angled geometric features. This leads to keyhole void formation when spaces between features are smaller than 0.7 p.m. New collimated sputtering techniques can extend the lower limit of Al use to 0.5-p.m appHcations. 

They may not provide superior hiding or coverage because these properties are not as important for primers as they are for topcoat paints. Primers may also contain specialty pigments and additives to help resist corrosion or prevent stain bleed-through. 

Additional discussions are available in the General References concerning the properties of several nitrofiirans. This includes further coverage of the chemotherapeutic and physical properties antimicrobial activity bacterial resistance absorption, distribution, and excretion clinical use and safety studies, of this interesting class of antiinfective compounds. 

Concurrent bombardment during film growth affects film properties such as the film—substrate adhesion, density, surface area, porosity, surface coverage, residual film stress, index of refraction, and electrical resistivity. In reactive ion plating, the use of concurrent bombardment allows the deposition of stoichiometric, high density films of compounds such as TiN, ZrN, and Zr02 at low substrate temperatures. 

Electrodeposition This method of paint application is basically a dipping process. The paint is water-based and is either an emulsion or a stabilised dispersion. The solids of the paint are usually very low and the viscosity lower than that used in conventional dipping. The workpiece is made one electrode, usually the cathode, in a d.c. circuit and the anode can be either the tank itself or suitably sized electrodes sited to give optimum coating conditions. The current is applied for a few minutes and after withdrawal and draining the article is rinsed with de-ionised water to remove the thin layer of dipped paint. The deposited film is firmly adherent and contains a minimum of water and can be stoved without any flash-off period. This process is used for metal fabrications, notably car bodies. Complete coverage of inaccessible areas can be achieved and the corrosion resistance of the coating is excellent (Fig. 14.1). 

Ternary Nitrides as Diffusion Barriers. Barrier layers with good step coverage and low resistivity are formed from ternary nitrides with various compositions Ti-Si-N, W-Si-N, and W-B-N. They are deposited by MOCVD with deposition temperatures between 300 and 450°C. Complete step coverage is obtained on reentrant features as low as 0.25 micron with an aspect ratio of 4.0.Pi]... 

Types of wood and their chemical resistance and physical characteristics are reviewed, including examples showing the manufacture of typical tank and pipe construction. In-service case histories are included. While this coverage takes you from the Forest to the plants making acetic acid, that is beyond the need for most users it is hoped that the reader becomes aware that this product family is the only MOC for several CPI applications and is a competitive choice over some quite exotic materials, e.g., titanium, in others. 

To prevent development of resistance and promote synergy, inhaled tobramycin or colistin is usually added to an oral fluoroquinolone for P. aeruginosa coverage.1,3 Methicillin-sensitive S. aureus (MSSA) may be treated with oral amoxiciUin-clavulanic acid, dicloxacillin, first- or second-generation cephalosporins, trimethoprim-sulfamethoxazole, or clindamycin, depending on sensitivity. Likewise, methiciUin-resistant S. aureus (MRSA) may be treated with oral trimethoprim-sulfamethoxazole, clindamycin, minocycline, or linezolid. H. influenzae often produces... 

Oral, narrow-spectrum antibiotic therapy with activity against Staphylococcus aureus and streptococcal species. Include coverage for MRSA (HA- or CA-MRSA) according to patient history and resistance patterns in the area. 

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