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Copper alloys deposit attack

Corrosion of industrial alloys in alkaline waters is not as common or as severe as attack associated with acidic conditions. Caustic solutions produce little corrosion on steel, stainless steel, cast iron, nickel, and nickel alloys under most cooling water conditions. Ammonia produces wastage and cracking mainly on copper and copper alloys. Most other alloys are not attacked at cooling water temperatures. This is at least in part explained by inherent alloy corrosion behavior and the interaction of specific ions on the metal surface. Further, many dissolved minerals have normal pH solubility and thus deposit at faster rates when pH increases. Precipitated minerals such as phosphates, carbonates, and silicates, for example, tend to reduce corrosion on many alloys. [Pg.185]

Most cases of crevice corrosion take place in near-neutral solutions in which dissolved oxygen is the cathode reactant, but in the case of copper and copper alloys crevice corrosion can occur owing to differences in the concentration of Cu ions however, in the latter the mechanism appears to be different, since attack takes place at the exposed surface close to the crevice and not within the crevice in fact, the inside of the crevice may actually be cathodic and copper deposition is sometimes observed, particularly in the Cu-Ni alloys. Similar considerations apply in acid solutions in which the hydrogen ion is the cathode reactant, and again attack occurs at the exposed surface close to the crevice. [Pg.165]

Deposit attack and pitting When water speeds are low and deposits settle on the surface (particularly at water speeds below about 1 m/s), pitting of copper and copper alloys is liable to occur by differential aeration effects. [Pg.696]

Tin—Nickel, Alloy deposits having 65% tin have been commercially plated since about 1951 (135). The 65% tin alloy exhibits good resistance to chemical attack, staining, and atmospheric corrosion, especially when plated copper or bronze undercoats are used. This alloy has a low coefficient of friction. Deposits are solderable, hard (650—710 HV 5Q), act as etch resists, and find use in printed circuit boards, watch parts, and as a substitute for chromium in some applications. The rose-pink color of 65% tin is attractive. In marine exposure, tin—nickel is about equal to nickel—chromium deposits, but has been found to be superior in some industrial exposure sites. Chromium topcoats increase the protection further. Tin—nickel deposits are brittle and difficult to strip from steel. Temperature of deposits should be kept below 300°C. [Pg.164]

Ferrous-alloy-clad tube sheets are generally prepared by a weld overlay process in which the alloy material is deposited by welding upon the face of the tube sheet. Precautions are required to produce a weld deposit free of defects, since these may permit the process fluid to attack the base metal below the alloy. Copper-alloy-clad tube sheets are prepared by brazing the alloy to the carbon steel backing material. [Pg.897]

At the base of the pits where reducing action accompanies corrosion, copper deposition can be seen. Copper comes from corrosion of bronze circulating pumps, phosphor-bronze fittings and copper alloy lines. These cooling systems could have been well protected by a chromate inhibitor, or by a borate-nitrite-MBT product, but experienced accelerated attack when using the improper phosphate-silicate inhibitor. [Pg.380]

The addition of 1 to 2 mass% Fe was shown to improve the corrosion resistance impingement attack, deposit attack, pitting, of copper alloys containing 10 mass% Ni [1951Bai]. Copper precipitation has been... [Pg.487]

Electroforrning is the production or reproduction of articles by electro deposition upon a mandrel or mold that is subsequendy separated from the deposit. The separated electro deposit becomes the manufactured article. Of all the metals, copper and nickel are most widely used in electroforming. Mandrels are of two types permanent or expendable. Permanent mandrels are treated in a variety of ways to passivate the surface so that the deposit has very Httie or no adhesion to the mandrel, and separation is easily accompHshed without damaging the mandrel. Expendable mandrels are used where the shape of the electroform would prohibit removal of the mandrel without damage. Low melting alloys, metals that can be chemically dissolved without attack on the electroform, plastics that can be dissolved in solvents, ate typical examples. [Pg.166]

Most simple inorganic salt solutions cause virtually no attack on aluminium-base alloys, unless they possess the qualities required for pitting corrosion, which have been considered previously, or hydrolyse in solution to give acid or alkaline reactions, as do, for example, aluminium, ferric and zinc chlorides. With salts of heavy metals —notably copper, silver, and gold —the heavy metal deposits on to the aluminium, where it subsequently causes serious bimetallic corrosion. [Pg.672]

Joints in copper components may be a source of trouble. Copper/zinc brazing alloys may dezincify and consequently give rise to leaks . In some waters, soft solders are preferentially attacked unless in a proper capillary joint. Copper/phosphorus, copper/silver/phosphorus, and silver brazing alloys are normally satisfactory jointing materials. Excessive corrosion of copper is sometimes produced by condensates containing dissolved oxygen and carbon dioxide. Rather severe corrosion sometimes occurs on the fire side of fire-back boilers and on electric heater element sheaths under scales deposited from hard waters . [Pg.700]

Sulfuric acid used in the processing of fuels can carry over into finished products. It can attack copper and copper-containing alloys to form copper sulfate, a blue-green deposit. [Pg.216]


See other pages where Copper alloys deposit attack is mentioned: [Pg.149]    [Pg.2421]    [Pg.72]    [Pg.189]    [Pg.297]    [Pg.894]    [Pg.901]    [Pg.906]    [Pg.512]    [Pg.8]    [Pg.149]    [Pg.2176]    [Pg.2684]    [Pg.331]    [Pg.2661]    [Pg.2425]    [Pg.149]    [Pg.541]    [Pg.212]    [Pg.650]    [Pg.262]    [Pg.227]    [Pg.125]    [Pg.452]    [Pg.688]    [Pg.722]    [Pg.791]    [Pg.1590]    [Pg.589]    [Pg.194]    [Pg.125]   
See also in sourсe #XX -- [ Pg.4 , Pg.52 ]

See also in sourсe #XX -- [ Pg.4 , Pg.52 ]




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Copper deposit attack

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