Compatibility join

Eabrication techniques must take into account the metallurgical properties of the metals to be joined and the possibiUty of undesirable diffusion at the interface during hot forming, heat treating, and welding. Compatible alloys, ie, those that do not form intermetaUic compounds upon alloying, eg, nickel and nickel alloys (qv), copper and copper alloys (qv), and stainless steel alloys clad to steel, may be treated by the traditional techniques developed for clads produced by other processes. On the other hand, incompatible combinations, eg, titanium, zirconium, or aluminum to steel, require special techniques designed to limit the production at the interface of undesirable intermetaUics which would jeopardize bond ductihty. 

Brazing or welding alloys should be more noble (i.e., cathodic) than at least one of the joined metals. Also, these alloys should be compatible to both the other metals. 

Finally, mechanical joints, e.g. nuts, bolts, rivets etc., are still important joining methods for which attention must be given to compatibility to avoid dissimilar metal corrosion problems and crevice corrosion " . ... 

A number of material suppliers offer information on their products on electronic devices (floppy discs, CDs, etc.) for use on personal computers. An important one, called Campus, is a database concept started by four German material manufacturers who use a uniform software. This database, initially developed jointly by BASF, Bayer, Hoechst, and Hulls, provided for other manufacturers to join. The present consortium has more than 50 materials suppliers worldwide. It is given in the form of diskettes in German, English, French, Italian, or Spanish. Each diskette contains the uniform test and evaluation program and the range of the respective material producers. It runs on IBM-compatible personal computers under the MS-DOS operating system. 

Overmolding is the process by which two different materials are joined into one assembly without using secondary operations like gluing or welding. In case the materials are chemically compatible, chemical bonds may form between them and so mechanical interlocks are not required. There are two common techniques of overmolding—insert molding and multiple-shot injection molding. 

Z.G. Yang, K.S. Weil, K.D. Meinhardt, J.W. Stevenson, D.M. Paxton, G.-G. Xia, and D.-S. Kim, Chemical compatibility of barium-calcium-aluminosilicate base sealing glasses with heat resistant alloys, in Joining of Advanced and Speciality Materials... 

Concerning the quark matter EOS, we found that a density dependent bag parameter B p) is necessary in order to be compatible with the CERN-SPS findings on the phase transition from hadronic to quark matter. Joining the corresponding EOS with the baryonic one, maximum masses of about 1.6 M are reached, in line with other recent calculations of neutron star properties employing various phenomenological RMF nuclear EOS together with either effective mass bag model [39] or Nambu-Jona-Lasinio model [40] EOS for quark matter. 

The physical properties of the filler metal are based on its metallurgical properties. The composition will determine whether the filler metal is compatible with the metals being joined—capable of wetting them and flowing completely through the joint area. There arc also special... 

The stitches or eyelets should not be so close together that there is risk that the pieces might tear. For similar reasons, tension and strain on the join should be avoided. The fixing (clips, eyelets, thread, etc.) should be compatible with the articles to be joined, not harder or more abrasive. Film, non-woven, and woven fabrics all may be finished in this way. With film and non-wovens the stitches should be loose and separated fairly widely thread should be of about the same diameter as the thickness of film or fabric. When selecting thread or other fixings for woven fabrics the gauges should be compatible with the warp and weft (not too thick, and not too fine). 

In addition to joining, adhesives in electrical applications may be required to conduct heat, conduct or isolate electricity, provide shock mounting, seal, protect substrates, etc. Thermal and chemical resistance, weathering, and structural compatibility must also be considered in diverse electrical and electronic applications. Of course, the choice of adhesive will also be governed by application methods, cure temperature, processing speed, and overall economic cost. 

These plastics are quite inert thus, compatibility with other substrates does not pose major problems. The terephthalates have high tensile and tear strengths, excellent chemical resistance, good electrical properties, and an operating temperature range from —55 to 200°C. These materials are generally joined with adhesives, and surface treatments are used to enhance adhesion, if required. 

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