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Ceramic pin grid array

Figure 6. Cofired ceramic pin grid array package with 270 pins and a tape-automated-bonded 1C. Figure 6. Cofired ceramic pin grid array package with 270 pins and a tape-automated-bonded 1C.
Wong CP. Polymers for Electronic and Photonic Applications. Academic Press 1993. Tan N, Lim K, Chin B, Bourdillon A. Engineering surfaces in ceramic pin grid array... [Pg.33]

Tan N, Chin B, Lim KHK, Bourdillon AJ. Engineering surfaces in ceramic pin grid array packaging to inhibit epoxy bleeding. Hewlett Packard J. Aug. 1998. [Pg.71]

FIGURE 34.9 A ceramic pin-grid-array package (96% pure AijOs with multilayer Au metallization. [Pg.628]

Tan, N., Lim, K., Chin, B., and Bourdillon, A., Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding, Hewlett-Packard J. (Aug.1998)... [Pg.36]

Figure 4 shows an example of a pin grid array (PGA), developed to accommodate IC s with 84 or more pins. The original PGA s were ceramic packages, but several techniques are now used to produce them in plastic. The PGA s can be through-hole mounted on the printed wiring board, or can be socketed and surface mounted. [Pg.9]

Loctite 3561/ Loctite High-piirity liquid epoxy 1 Ceramics, laminates Automated dispensing Bare chip protection in chip on board, MCMs, BGAs, and pin-grid arrays. [Pg.293]

The major applications of LCPs are in metal and ceramic replacements that require resistance to high temperatures, chemicals, mechanical stress, creep resistance, and so forth. LCP parts include electronic and electrical connectors, sockets and pin-grid arrays exposed to high-temperature manufacturing or service conditions, automotive and aerospace parts that require the ability to withstand high temperatures and flame retardance, and chemical-processing components that exist in aggressive environments. [Pg.423]

Land grid array (LGA), an Intel package used for parts such as the 80386L microprocessor. The package is similar to a PGA except that it has gold-plated pads (called landing pads) vs. pins. Leadless inverted device (LID), a shaped metallized ceramic form used as an intermediate carrier for the semiconductor chip (die). It is especially adapted for attachment to conductor lands of a thick-film or thin-film network by reflow solder bonding. [Pg.861]

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See also in sourсe #XX -- [ Pg.683 ]



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