Land grid arrays

Land grid array and fine-pitch baU-grid array (National)... 

Land grid array (LGA), an Intel package used for parts such as the 80386L microprocessor. The package is similar to a PGA except that it has gold-plated pads (called landing pads) vs. pins. Leadless inverted device (LID), a shaped metallized ceramic form used as an intermediate carrier for the semiconductor chip (die). It is especially adapted for attachment to conductor lands of a thick-film or thin-film network by reflow solder bonding. 

ASTM American Society for Testing and Materials LGA land grid array... 

Ball-grid array, land-grid Flash memory and ASIC... 

Integration of passives in LTCC is also used to build components. Several elements can be combined in a multilayer structure to achieve a specific electrical function (e.g., a band-pass filter). These small-sized components have terminations allowing surface-moimt assembly operations (land grid, castellation, or ball grid array [BGA]). Depending on the nature of diese passive multicomponent devices, they are referred as monolithic (only LTCC elements) or hybrid [58] (mixture of embedded components and additional surface-mounted elements). Reasons for not implementing all passives in the hybrid type are ... 

This consideration has led to the development of a number of area array solder-bumping termination methods for 1C and multichip module (MCM) packages, variously called pad grid, land grid, or ball grid arrays (EGAs) with terminal grids set at 1 mm (0.040 in), 1.27 mm (0.050 in), and 1.50 mm (0.060 in), respectively. 

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