Chip protection

CARBON INFRA-RED EMITTERS PROVIDE CURE FOR LAND ROVER ANTI-CHIP PROTECTION... 

High-Performance Silicone Gel as Integrated-Circuit-Device Chip Protection... 

Screen-Printable Polyimide. Bending beam results for a screen-printable polyimide used for chip protection are presented in Figure 8. The EPO-TEK 600 polyimide paste was applied to a quartz beam, then the beam was spun at 5000 rpm to achieve high uniformity. Results are presented as inverse radius of curvature, 1/R, because the 50 m coating thickness on the 84 im substrate violates the thin film criterion of Equation 2. We have no knowledge of the polyimide s viscoelastic modulus, which is needed in order to convert 1/R into interfacial stress using Equation 1. 

Loctite 3561/ Loctite High-piirity liquid epoxy 1 Ceramics, laminates Automated dispensing Bare chip protection in chip on board, MCMs, BGAs, and pin-grid arrays. 

Loctite 3563/ Loctite Rapid-cure, fast-flow, capillary epoxy underfill 1 Ceramics Dispense, capillary underfill Flip-chip underfill in hare-chip protection (memory cards, chip carriers, hybrids and MCMs)... 

Loctite 3566/ Loctite Rapid curing, fast flowing epoxy underfill 0.5 Silicon, ceramics, laminates Dispense, capillary underfill Unfilled material required for bare chip protection (advanced packaging). 

Oriented polypropylene film (OPP) may be classified as heat-set and non-heat-set, blown and tentered, coextmded and coated. Orientation improves the cold-temperature resistance and other physical properties. Heat-set biaxially oriented polypropylene film (BOPP) is the most widely used protective packagiag film ia the United States. It is used to wrap bakery products, as lamination pHes for potato and com chips, and for pastas and numerous other flexible pouch and wrapping appHcations. Nonheat-set OPP is used as a sparkling, transparent shrink-film overwrap for cartons of candy. 

Polymers are only marginally important in main memories of semiconductor technology, except for polymeric resist films used for chip production. For optical mass memories, however, they are important or even indispensable, being used as substrate material (in WORM, EOD) or for both substrate material and the memory layer (in CD-ROM). Peripheral uses of polymers in the manufacturing process of optical storage media are, eg, as binder for dye-in-polymer layers or as surfacing layers, protective overcoatings, uv-resist films, photopolymerization lacquers for repHcation, etc. 

Electrical Properties. Electrical properties are important for the corrosion protection of chip-on-board (COB) encapsulated devices. Accelerated temperature, humidity, and bias (THB) are usually used to test the embedding materials. Conventional accelerating testing is done at 85°C, 85% relative humidity, and d-c bias voltage. Triple-track test devices with tantalum nitride (Ta2N), titanium—palladium—gold (Ti—Pd—Au) metallizations with 76... 

In joining reinforced thermosetting pipe it is particularly important that the pipe be cut without chipping or cracking it. It is also important to sand, file, or grind any mold-release agent from the surfaces to be cemented. Joints are built up layer by layer of adhesive-saturated reinforcement by following the manufacturer s recommended procedure. Application of adhesive to the surfaces to be joined and assembly of these surfaces shall produce a continuous bond and provide an adhesive seal to protect the reinforcement from attack by the contents of the pipe. Unfilled or unbonded areas of the joint are considered defects and must be repaired. 

Figure 7.3. The evolution of electronics a vacuum tube, a discrete transistor in its protective package, and a 150 nun (diameter) silicon wafer patterned w ith hundreds of integrated circuit chips. Each chip, about I enr in area, contains over one million transistors, 0..35 pm in size (courtesy M.L. Green, Bell Laboratories/Lucent Technologies).

Supporting the hydrated ferric oxide chips is a combination of a perforated, heavy metal support plate and a coarse support packing material. This material may consist of scrap pipe thread protectors and 2-3-in. sections of small diameter pipe. This provides support for the bed, while offering some protection against detrimental pressure surges. 

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