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Brown, William

Brown, William H. The Plant Kingdom. Ginn Company, Boston. 1935. Chamberlain, Charles Joseph. Gymnosperms Structure and Evolution. University of Chicago Press, Chicago. 1935. [Pg.42]

Although the physiological function of plant and animal lectins is unknown, these ubiquitous carbohydrate-binding (glyco)proteins can recognize and bind to complex carbohydrates as they occur in solution and on membranes and cell surfaces. A series of papers (by Hardman Brewer and Brown Williams and coworkers Thomas and colleagues and Evans and Wang) deal with the fundamental chemistry of lectin... [Pg.229]

Phyllis R. Brown William S. Hancock Milton T. W. Hearn Hubert A. Scoble Lloyd R. Snyder James T. Sparrow... [Pg.233]

The former is represented by the neutron diffraction analysis of Fe[P(OCH3)3]3( -C8Hi3) +[BF4] (Figure 8), by Brown, Williams, Ittel et as well as by Williams,... [Pg.6128]

Brown, William, Modern Dyeing and Cleaning Practice a Practical Treatise on Present-day... [Pg.207]

Brown, William, What s Wrong and Why with Laundry Work an Investigation of Faults... [Pg.207]

Proteins—Research—Methodology. I. Howard, Gary C. II. Brown, William E., 1945-... [Pg.264]

Brown, William H., and Foote, Christopher S. (2002). Organic Chemistry, 3rd edition. San Diego Saunders. [Pg.898]

A01 Alford, E. and S. Houpt Identification of the sulfur compounds in gas phase smoke Brown Williams Tobacco 18B04. [Pg.1460]

Brown, William E. (1992) Plastics in Food Packaging Properties, Design, and Fabrication, New York, Marcel Dekker... [Pg.450]

Brown, William H. director. 1954. Climaxl Casino Royale. CBS Television Network. [Pg.420]

Making sure cities operate smoothly and efficiently is a core component of engineering. In 2002, New York City suffered a drought emergency. Nicole Brown-Williams now works to redesign the city s water supply to handle such future problems. The project has put her in the middle of an extraordinary engineering challenge. [Pg.97]

Brown, William H. and Christopher S. Foote, Organic Chemistry, 4th ed., Thomson Brooks/Cole, Belmont, CA, 2005. [Pg.336]

Brown, William D.,and Ulrich, Richard K. eds.), Advanced Electronic Packaging, 2wded.,Wiley-lEEE Press, 2006. [Pg.98]

Landers,Thomas L., Brown, William D., Eant, Earnest W., Malstrom, Eric M., and Schmitt, Neil M., Electronic Manufacturing Processes, Prentice Hall, 1994. [Pg.99]

Afonso, Sergio, Schaper, Leonard W, Parkerson, James P, Brown, William D., Ang, Simon S., and Naseem, Hameed A., deling and Electrical Analysis of Seamless High Oft-Chip Connectivity (SHOCC) Interconnects, IEEE Transactions on Advanced Packaging, Vol. 22, No. 3,1999, pp. 309-320. [Pg.99]

O Neal, Chad B., Malshe, Ajay P, Schmidt, William E, Gordon, Matthew H., Reynolds, Robert R., Brown, William D., Eaton, William R, and Miller, William M., A Study of the Effects of Packaging Induced Stress on the Reliability of the Sandia MEMS Microengine, paper presented at the Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, HI, July 8-13,2001. [Pg.100]

Brown, William H., and Thomas Boon, Introduction to Organic Chemistry, WUey, Hoboken, NJ, 2011. Denniston, Katherine J., Joseph J. Topping, and Robert L. Caret, General, Organic, and Biochemistry, 7th ed., McGraw-HUl, New York, 2011. [Pg.576]


See other pages where Brown, William is mentioned: [Pg.102]    [Pg.641]    [Pg.378]    [Pg.97]    [Pg.97]    [Pg.97]    [Pg.97]    [Pg.372]   
See also in sourсe #XX -- [ Pg.22 ]

See also in sourсe #XX -- [ Pg.207 ]




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Browning, William

Browning, William

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