Bisphenol epoxy resin

Resin type Orthophthalic, isophthalic, low profile, halogenated Epoxy Novolak, methacrylate esters of bisphenol epoxy resins Epichlorohydrin/ bisphenol-A... 

Selecting a flame retardant for an adhesive system has many ramifications, depending on the formulation being modified, the end use, how it will be processed, and the cost/performance ratio. When one is choosing a flame retardant, characteristics such as water extraction, particle size, viscosity, toxicity, dusting, uniformity, as well as economics must be considered. The materials chosen to perform the function of flame retardation must not interfere with the final product s performance. The major problem with incorporating flame retardants in adhesives is that very often a significant amount is required, and they interfere with the other properties of the adhesive and contribute to the cost. This is why bromo bisphenol epoxy resins are often employed in flame-retardant epoxy adhesives. 

Resin Types and Structure Typical Bisphenol Epoxy Resins Reactions of Epoxides and Curing Mechanisms Addition Reactions of Amines... 

Bisphenol A lbis- fe- nol, - nol. fi-K n. OH-Ar-(CH3)2 -Ar-OH, a diol which reacts with epichlorohydrin to form bisphenol epoxy resins. (4,4 -isopropylidenediphenol) An intermediate used in the production... 

Bisphenol epoxy resins n. Resins based on bisphenol A. 

Epoxy amine adduct JK512 is the reaction product of Epikote 1001 bisphenol epoxy resin with diamines and with a Cardura ElO/diamine adduct. Further details can be obtained from Shell Chemicals. 

K. Yasuda, T. Suzuki, T. Takata and I. Kaneko, Trisphenol, bisphenol and halogenated bisphenol epoxy resins composition, US Patent 5081206, assigned to Mitsui Petrochemical Industries, Ltd., January 14,1992. 

Bisphenol Epoxy Resins n Resins based on Bisphenol A. 

Commercial PBDs are available (e.g., from Sartomer) that bear epoxy entities on the polymer backbone and also have terminal hydroxyl groups The hydroxyl groups can cure a formulation containing reactive monomers such as cycloaliphatic or siloxane epoxides, or the epoxidized PBD itself [237]. Bisphenol epoxy resins show an increased impact strength when the formulation contains less than 10 wt% of an epoxidized HTPB. Higher contents of HTPBD result in a resin that is softer and has a lower Tg and generally unfavorable mechanical properties [115]. 

Bisphenol A. One mole of acetone condenses with two moles of phenol to form bisphenol A [80-05-07] which is used mainly in the production of polycarbonate and epoxy resins. Polycarbonates (qv) are high strength plastics used widely in automotive appHcations and appHances, multilayer containers, and housing appHcations. Epoxy resins (qv) are used in fiber-reinforced larninates, for encapsulating electronic components, and in advanced composites for aircraft—aerospace and automotive appHcations. Bisphenol A is also used for the production of corrosion- and chemical-resistant polyester resins, polysulfone resins, polyetherimide resins, and polyarylate resins. 

Epoxy Resins. The chemistry of epoxy resin adhesives is quite varied. However, the most widely used is that formed from the reaction of 4,4 -isopropyhdene diphenol (bisphenol A) [80-05-7] and epichlorohydrin [106-89-8] C H CIO. This epoxy resin is more commonly known as... 

TetrabromobisphenolA. TBBPA is the largest volume reactive flame retardant. Its primary use is in epoxy resins (see Epoxyresins) where it is reacted with the bis-glycidyl ether of bisphenol A to produce an epoxy resin having 20—25% bromine. This brominated resin is typically sold as a 80% solution in a solvent. TBBPA is also used in the production of epoxy oligomers which are used as additive flame retardants. 

Polycarbonates. Currently, all audio CDs (CD-AD), all CD-ROM, and the biggest fraction of substrate disks for WORM and EOD worldwide are manufactured from a modified bisphenol A—polycarbonate (BPA-PC) (3). In 1991, some 1.3 x 10 compact disks were produced, equivalent to an annual amount of about 35,000 t BPA-PC. WORM and EOD disks are manufactured mainly from BPA-PC for sizes of 5.25 in. and below, and glass for larger form factors (eg, 12 in.), partially also from BPA-PC, and in some cases from aluminum or from cross-linked polymers (epoxy resins) (190). 

The largest outlet for phenol worldwide is phenoHc resins (qv). However, the growth rate of bisphenol A is higher than that of the other significant derivatives and is projected to become the principal use of phenol in the future (see Epoxy resins Polycarbonates). Table 6 shows the portion of world phenol demand by use and the anticipated growth rate of the uses. 

Bisphenol A diglycidyl ether [1675-54-3] reacts readily with methacrylic acid [71-49-4] in the presence of benzyl dimethyl amine catalyst to produce bisphenol epoxy dimethacrylate resins known commercially as vinyl esters. The resins display beneficial tensile properties that provide enhanced stmctural performance, especially in filament-wound glass-reinforced composites. The resins can be modified extensively to alter properties by extending the diepoxide with bisphenol A, phenol novolak, or carboxyl-terrninated mbbers. 

Process Raw Material. Industrial solvents are raw materials in some production processes. Eor example, only a small proportion of acetone is used as a solvent, most is used in producing methyl methacrylate and bisphenol A. Alcohols are used in the manufacture of esters and glycol ethers. Diethylenetriamine is also used in the manufacture of curing agents for epoxy resins. Traditionally, chlorinated hydrocarbon solvents have been the starting materials for duorinated hydrocarbon production. 

Epoxy Resins. Epoxy resins (qv) or polyether resins are thermosets used as the binder for terrazzo dooring. The epoxy resin often is made from epichlorohydrin and bisphenol A. An excess of epichlorohydrin is used to assure that the intermediate product contains terminal epoxide groups. 

Epoxy Resins. Epoxy resins (qv) are used to cross-link other resins with amine, hydroxyl, and carboxyHc acid (or anhydride) groups. The epoxy group, properly called an oxkane, is a cycHc three-membered ether group. By far the most widely used epoxy resins in coatings are bisphenol A (BPA) (4,4 -(l-methylethyHdene)bisphenol) [80-05-7] epoxy resins. 

Fig. 1. Structures of commercial epoxy resins (a) phenolic novolac epoxy resin, (b) glycidated polybasic acid, (c) glycidated polyamine (A,A,A, A -tetraglycidyl-4,4 -diaminodiphenylmethane [28768-32-3] (TGMDA)), and (d) glycidated bisphenol A.

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