Bisphenol F epoxy resins

Owing to relatively low viscosity, these resins offer advantages for 100% soHds (solvent-free) systems. Higher filler levels are possible because of the low viscosity. Faster bubble release is also achieved. Higher epoxy content and functionaHty of bisphenol F epoxy resins can provide improved chemical resistance compared to conventional epoxies. [Pg.363]

Bisphenol F epoxy resins are used in high-soHds-high-build systems such as tank and pipe linings, industrial floors, road and bridge deck toppings, stmctural adhesives, grouts, coatings, and electrical varnishes. Bisphenol F epoxy resins are manufactured in Europe and Japan. [Pg.363]

Bisphenol A resins, 10 5-6 Bisphenol A terminated hardeners, 10 406 Bisphenol F epoxy resin, 10 368-369 Bis(phenolic) developers, 19 346-347 Bisphenol resins, formulation of,... [Pg.107]

Hisphenol F Resin. Bisphenol F epoxy resin is of the same general structure as the epoxy phenol novolaks. Bisphenol F is 2.2 -tnelhylene hisphenol... [Pg.578]

Bisphenol F epoxy resins are produced by condensing phenol with formaldehyde, resulting in a mixture of isomers and higher-MW condensation products. Bisphenol F epoxy resins have lower viscosity then DGEB A epoxy resins for the same molecular weight (or number of repeating units n). Cured bisphenol F epoxy resins also have increased solvent resistance. [Pg.77]

The repeat unit of bisphenol F epoxy resins (Figure 2.3) or epoxy novolac resin does not significantly increase the epoxy equivalent weight although viscosity and functionality do increase (Helfad, 1996). [Pg.28]

Bisphenol F epoxy resins provide similar chemical resistance to that of bisphenol A based epoxies. However, there is some improvement to acid resistance in the former, depending on the curing agent used. With bisphenol F epoxy resins it is possible to have higher filler levels and faster bubble release because of their relatively low viscosity (Figure 2.4). [Pg.28]

Bisphenol A/bisphenol F epoxy resin blends. It is possible to use blends of bisphenol A and F to achieve superior properties. Many such combinations are commercially available. Such blends significantly reduce the crystallisation tendency which may occur with bisphenol A based epoxy resins when they are subjected to temperature cycling. Such blends also facilitate filler loading and processability. [Pg.29]

Gamma irradiation curing of epoxy resins for structural adhesives — Radiation cure polymerization of commercial diglycidyl ether of bisphenol F epoxy resin has been achieved using Co-60 irradiation source, compounding the monomer with and onium salt catalyst [9],... [Pg.35]

Properties Gardner < 3 sol n. dens. 9.5 Ib/gal vise. 10,000 cps EEW 240 on resin solids 90% solids D.E.R. 354 [Dow/Epoxy Prods. Infermeds.j Chem. Descrip. Bisphenol F epoxy resin Uses Epoxy tor coatings, linings, floorings, and secondary containment Features Otters low vise, with crystallization resist., resist, to cone, sultu-... [Pg.245]

Chem. Descrip. Bisphenol A/bisphenol F epoxy resin Uses Epoxy for powd. coatings... [Pg.246]

Chem. Descrip. Bisphenol-F epoxy resin Uses Epoxy for high solids coatings, fiberglass-reinforced plastics, elec, encapsulation and laminates, adhesives, flooring, and sealants modifier for Epotuf 37-140... [Pg.332]

Decyl alcohol Elemi gum Epoxy, bisphenol A Epoxy, bisphenol F Epoxy resin Ethylacetoacetate Ethylcellulose Ethylene/VA copolymer Ethyl hydroxyethyl cellulose Gilsonite... [Pg.4973]

Epoxy, bisphenol A Epoxy, bisphenol F Epoxy resin Ethylene/propylene/dicyclopentadiene terpolymer Ethylene-propylene-ethyl idene norbomene Glycidyl neodecanoate PEG-4 dimethacrylate 3-(n-Pentadecyl) phenol Saccharin sodium anhydrous Saccharin sodium dihydrate Sodium-4-chlorophthalate resin modifier, adhesive coating elastomer Glyceryl hydrogenated rosinate resin modifier, adhesive coating film-formers Glyceryl hydrogenated rosinate resin modifier, adhesives... [Pg.5616]

No-flow, fluxing type underfill Novolac and Bisphenol-F epoxy resins 40-50% Methyl hexahydrophthalic anhydride 20-30% Polysebacic and proprietary anhydride mixture 7-12% Thermoplastic copolymer Amicon El 350, 1355... [Pg.141]

Bisphenol F Epoxy Resin. The lowest MW member of the phenol novolacs is bisphenol F, which is prepared with a large excess of phenol to formaldehyde a mixture of o,o, oj, and pj) isomers is obtained ... [Pg.2677]

Figure 1. Chemical structures of used model molecules a) Cycloaliphatic epoxy resin (Araldite CY179), b) Methylcyclohexyl cyclohexanecarboxylate (Ester), c) Dicyclohexyl ketone d) cyclohexane oxide e) Bisphenol F epoxy resin (Epon 862), f) Bisphenol A epoxy resin (DER 331), g) Ethyl acetate, h) acetone, i) Phenol, j) 1,1,1,3,3,3 Hexafluoro-2-propanol (HFIP)...

Another aromatic ether type of commercial epoxy resins, analogous to BPA epoxy resins, is based on bisphenol F. Such epoxy resins are known as bisphenol F epoxy resins (Figure 2.38). [Pg.96]

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