Barrier layer, product

Preproduction dye developer negatives used a combination of cellulose acetate and cellulose acetate hydrogen phthalate as barrier layers. The images produced from these negatives were outstanding in color isolation, color saturation, and overall color balance. However, solvent coating was requited with this composition, and it was not used in production. 

There are various theories on how passive films are formed however, there are two commonly accepted theories. One theory is called the oxide film theory and states that the passive film is a diffusion-barrier layer of reaction products (i.e., metal oxides or other compounds). The barriers separate the metal from the hostile environment and thereby slow the rate of reaction. Another theory is the adsorption theory of passivity. This states that the film is simply adsorbed gas that forms a barrier to diffusion of metal ions from the substrata. 

Barrier plastic Also called barrier layer. They are materials such as plastic films, sheets, etc. with low or no permeability to different products. 

Tenet (iv). The influence of a barrier layer in opposition to the progress of reaction may be expected to rise as the quantity of product, and therefore the thickness of the interposed layer, is increased [35,37,38]. Thus, the characteristic kinetic behaviour of the overall process may be expected to include contributions from both geometric factors and the barrier effect, though in specific instances one or other of these may be dominant. 

The characteristic feature of solid—solid reactions which controls, to some extent, the methods which can be applied to the investigation of their kinetics, is that the continuation of product formation requires the transportation of one or both reactants to a zone of interaction, perhaps through a coherent barrier layer of the product phase or as a monomolec-ular layer across surfaces. Since diffusion at phase boundaries may occur at temperatures appreciably below those required for bulk diffusion, the initial step in product formation may be rapidly completed on the attainment of reaction temperature. In such systems, there is no initial delay during nucleation and the initial processes, perhaps involving monomolec-ular films, are not readily identified. The subsequent growth of the product phase, the main reaction, is thereafter controlled by the diffusion of one or more species through the barrier layer. Microscopic observation is of little value where the phases present cannot be unambiguously identified and X-ray diffraction techniques are more fruitful. More recently, the considerable potential of electron microprobe analyses has been developed and exploited. 

This expression, the parabolic law [38,77,468], has been shown to be obeyed in the oxidation of metals, where the reactant is in the form of a thin sheet. Variations in behaviour are apparent when diffusion in the barrier layer is inhomogeneous as a consequence of cracking or due to the development of more than a single product layer. Alternative rate relations may be applicable, e.g. 

While it is inherently probable that product formation will be most readily initiated at sites of effective contact between reactants (A IB), it is improbable that this process alone is capable of permitting continued product formation at low temperature for two related reasons. Firstly (as discussed in detail in Sect. 2.1.1) the area available for chemical contact in a mixture of particles is a very small fraction of the total surface (and, indeed, this total surface constitutes only a small proportion of the reactant present). Secondly, bulk diffusion across a barrier layer is usually an activated process, so that interposition of product between the points of initial contact reduces the ease, and therefore the rate, of interaction. On completion of the first step in the reaction, the restricted zones of direct contact have undergone chemical modification and the continuation of reaction necessitates a transport process to maintain the migration of material from one solid to a reactive surface of the other. On increasing the temperature, surface migration usually becomes appreciable at temperatures significantly below those required for the onset of bulk diffusion within a product phase. It is to be expected that components of the less refractory constituent will migrate onto the surfaces of the other solid present. These ions are chemisorbed as the first step in product formation and, in a subsequent process, penetrate the outer layers of the... 

Fig. 20. Schematic representation of the solid + solid reaction A + B -> AB in which constituents of the relatively mobile reactant (A) are transported to the outer surfaces of the product phase (AB) and rate is controlled by diffusion of constituents of A and/ or B across the barrier layer AB.

The kinetic principles operating during the initiation and advance of interface-controlled reactions are identical with the behaviour discussed for the decomposition of a single solid (Chaps. 3 and 4). The condition that overall rate control is determined by an interface process is that a chemical step within this zone is slow compared with the rate of arrival of the second reactant. This condition is not usually satisfied during reaction between solids where the product is formed at the contact of a barrier layer with a reactant. Particular systems that satisfy the specialized requirements can, however, be envisaged for example, rate processes in which all products are volatilized or a solid additive catalyzes the decomposition of a solid yielding no solid residue. Even here, however, the kinetic characteristics are likely to be influenced by changing effectiveness of contact as reaction proceeds, or the deactivation of the catalyst surface. 

The relative displacement rates of the interfaces AIAB and ABIB in any particular system will, of course, depend on the relative migration velocities of all mobile participants across the barrier layer and reaction will continue while appropriate reactant constituents remain available. Such migrant entities travel by the most efficient route and therefore overall rates of such reactions are frequently sensitive to the concentration of imperfections in the product crystal lattice [1171]. One possible... 

Since, in both these reactions (i.e. KI or Rbl and Agl), product formation occurs on both sides of the original contact interface, it is believed that there is migration of both alkali metal and silver ions across the barrier layer. Alkali metal movement is identified as rate limiting and the relatively slower reaction of the rubidium salt is ascribed to the larger size and correspondingly slower movement of Rb+. The measured values of E are not those for cation diffusion alone, but include a contribution from... 

Two product barrier layers are formed and the continuation of reaction requires that A is transported across CB and C across AD, assuming that the (usually smaller) cations are the mobile species. The interface reactions involved and the mechanisms of ion migration are similar to those already described for other systems. (It is also possible that solid solutions will be formed.) As Welch [111] has pointed out, reaction between solids, however complex they may be, can (usually) be resolved into a series of interactions between two phases. In complicated processes an increased number of phases, interfaces, and migrant entities must be characterized and this requires an appropriate increase in the number of variables measured, with all the attendant difficulties and limitations. However, the careful selection of components of the reactant mixture (e.g. the use of a common ion) or the imaginative design of reactant disposition can sometimes result in a significant simplification of the problems of interpretation, as is seen in some of the examples cited below. 

Then a very thin barrier layer and a copper seed layer are formed (Figs. 21 (b) and 21 (c)>). In order to conduct the electric current, good conductive material, e.g., copper, will be coated on the surface of the copper seed layer which forms a rough surface as shown in Fig. 21(d). Since multilayer s introduction into IC production, the surface coated with copper must be very smooth, clean, and bare of dielectric stacks... 

Diffusion Barriers. Diffusion barriers are used in the production of various components in the electronic industry. For example, electrochemically deposited nickel is used as a barrier layer between gold and copper in electronic connectors and solder interconnections. In these applications the product is a trilayer of composition Cu/Ni/Au. In another example, Ni and Co are considered as diffusion barriers and cladding materials in the production of integrated circuits and multichip electronic packaging. In this case the barrier metal (BM), Co or Ni, is the diffusion barrier between conductor and insulator (i.e., Cu and insulator), and the product trilayer is of composition Cu/BM/insulator. The common couple in these applications is the Cu/BM bilayer (BM, the diffusion barrier metal Co, Ni, or Ni-Co alloy). 

Multilayered articles can be made by coinjection blow-molding or coextrusion methods. A three-layer system generally contains a barrier layer sandwiched between two exterior layers. These are actually laminar products. In the coextrusion sequence, several extruders can be used to place the material into the mold. The multilayer container is then produced from blowing air into the preform. 

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