Auger electron spectroscopy depth profile

Quantitative Auger electron spectroscopy depth profiling of iron oxides formed on Fe (100) and polycrystalline Fe by exposure to gas phase oxygen and borate buffer solution. Langmuir 6 1683-1690... 

Figure 5 Auger electron spectroscopy depth profiles of a) unused and b) used palladium membranes.

Fig. 2. Auger electron spectroscopy depth profiles for FA 49 a) exposed for 50h to environment 2 at 700°C, b) preoxidized for 16 h and exposed for 50 h to environment 1 at 700 °C...

Fig. 1 Auger electron spectroscopy depth profile of an oxygen-plasma-treated film of poly(ferrocenyldimethylsilane). The front of the image corresponds to the exposed free surface. Reproduced with permission from [4]. Copyright 2001, American Chemical Society...

Zalar, A. (1985) Improved depth resolution by sample rotation during Auger electron spectroscopy depth profiling. Thin Solid Films, 124, 223-230. 

Thirdly, the sample is etched with an Ar ion beam (5keV) in order to remove the tribofilm where it is not covered by the mask (Figure l.c). AES (Auger Electron Spectroscopy) depth profiles are performed during this operation, in order to monitor the etching process and record analytical data. Etching is stopped when the tribofilm is completely removed (Figure 2). 

AES Auger electron spectroscopy After the ejection of an electron by absorption of a photon, an atom stays behind as an unstable Ion, which relaxes by filling the hole with an electron from a higher shell. The energy released by this transition Is taken up by another electron, the Auger electron, which leaves the sample with an element-specific kinetic energy. Surface composition, depth profiles... 

Roughness from sputtering causes loss of depth resolution in depth profiling for Auger Electron Spectroscopy (AES), X-Ray Photoelectron Spectroscopy (XPS), and SIMS. 

Fig. 12. Auger electron spectroscopy (AES) sputter-depth profile of CAA-treated titanium after various exposure.s in vacuum (a) as anodized, (b) 450°C for 1 h, and (c) 7(X)°C for 1 h. The sputter etch rate is 1.5 nm/min. The line indicates the original interface. The arrow denotes oxygen diffused into the substrate. Adapted from Ref. [51].

The film thickness and retractive index were calculated using spectroscopic ellipsometry. X-ray photoelectron spectroscopy (XPS) was used for composition analysis. Auger electron spectroscopy (AES) and secondary ion mass spectroscopy (SIMS) was used to investigate the depth profiles of the film. 

The elemental composition, oxidation state, and coordination environment of species on surfaces can be determined by X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) techniques. Both techniques have a penetration depth of 5-20 atomic layers. Especially XPS is commonly used in characterization of electrocatalysts. One common example is the identification and quantification of surface functional groups such as nitrogen species found on carbon-based catalysts.26-29 Secondary Ion Mass spectrometry (SIMS) and Ion Scattering Spectroscopy are alternatives which are more surface sensitive. They can provide information about the surface composition as well as the chemical bonding information from molecular clusters and have been used in characterization of cathode electrodes.30,31 They can also be used for depth profiling purposes. The quantification of the information, however, is rather difficult.32... 

Figure 6.10 Depth profile of Auger Electron Spectroscopy (AES) sputtering of marmatite surface in the presence of cupric ion and ethyl xanthate...

Figure 6. Depth profile of SNR layer by Auger Electron Spectroscopy (AES) (a) no-etching, (b) 1 minute 02 RIE.

A new method of interpreting Auger electron spectroscopy (AES) sputter profiles of transition metal carbides and nitrides is proposed. It is shown that the chemical information hidden in the shape of the peaks, and usually neglected in depth profiles, can be successfully extracted by factor analysis (FA). The various carbide and nitride phases of model samples were separated by application of FA to the spectra recorded during AES depth profiles. The different chemical states of carbon, nitrogen and metal were clearly identified. 

There are several methods available to probe the actual interphase to demonstrate the existence of interpenetrating networks directly. Among these techniques are depth profiling by SIMS (secondary ion mass spectrometry) or SNMS (sputtered neutral mass spectrometry), and the use of X-ray photoelectron spectroscopy (XPS) depth profiling or Auger electron spectroscopy (AES) depth profiling. 

While a number of techniques like ion scattering and depth profiling via secondary ion mass spectrometry, Auger electron spectroscopy or X-ray photoelectron spectroscopy can be used to... 

Auger electron spectroscopy (AES) is particularly suited for surface analysis (depth 0.5-1 nm). AES depth profile analysis was employed to determine the thickness and composition of surface reaction layers formed under test conditions in the Reichert wear apparatus in the presence of four different ZDDPs additives at different applied loads (Schumacher et al., 1980). Using elemental sensitivity factors the concentration of the four elements (S, P, O, C) was determined at three locations corresponding to a depth of 1.8, 4.3, and 17 nm. No significant correlation between wear behavior and carbon or oxygen content of the reaction layer was observed. A steady state sulfur concentration is reached after a very short friction path. Contrary to the behavior of sulfur, phosphorus concentration in the presence of ZDDPs increases steadily with friction path, and no plateau value is reached. 

The color-coded nature of the PL in conjunction with Auger electron spectroscopy (AES)/depth profile analysis (which spatially resolves the alloys relative to the surface) permits mapping of the effective electric field (EEF) in the solid the term "effective electric field" reflects the idea that the field has contributions from, for example, band-edge and effective-mass gradients in addition to contributions from band bending (7). 

The surface of the particles can be studied directly by the use of electron microprobe X-ray emission spectrometry (EMP), electron spectroscopy for chemical analysis (ESCA), Auger electron spectroscopy (AES), and secondary ion-mass spectrometry. Depth-profile analysis determines the variation of chemical composition below the original surface. 

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