Auger depth profiling

The Auger depth profile obtained from a plasma polymerized acetylene film that was reacted with the same model rubber compound referred to earlier for 65 min is shown in Fig. 39 [45]. The sulfur profile is especially interesting, demonstrating a peak very near the surface, another peak just below the surface, and a third peak near the interface between the primer film and the substrate. Interestingly, the peak at the surface seems to be related to a peak in the zinc concentration while the peak just below the surface seems to be related to a peak in the cobalt concentration. These observations probably indicate the formation of zinc and cobalt complexes that are responsible for the insertion of polysulfidic pendant groups into the model rubber compound and the plasma polymer. Since zinc is located on the surface while cobalt is somewhat below the surface, it is likely that the cobalt complexes were formed first and zinc complexes were mostly formed in the later stages of the reaction, after the cobalt had been consumed. 

Fig. 40. Auger depth profile of an as-prepared oxide obtained by anodizing 2024 aluminum alloy in phosphoric acid. Reproduced by permission of Chapman and Hall Ltd. from Ref. [38].

The Auger depth profile of an aluminum substrate that was anodized in phosphoric acid and then exposed to 100% relative humidity at 50°C for 73 h is... 

The photoelectrochemical behavior of ZnSe-coated CdSe thin Aims (both deposited by vacuum evaporation on Ti) in polysulflde solution has been described by Russak and Reichman [112] and was reported to be similar to MIS-type devices. Specifically, Auger depth profiling showed the ZnSe component of the (ZnSe)CdSe heterostructures to convert to ZnO after heat treatment in air, thus forming a (ZnO)CdSe structure, while the ZnO surface layer was further converted to a ZnS layer by cycling the electrode in polysulfide electrolyte. This electrochemically generated ZnS layer provided an enhanced open-circuit potential compared to CdSe alone. Efficiencies as high as 5.4% under simulated AM2 conditions were recorded for these electrodes. 

Scheme V. Representation of the catalytic p-type Si photocathode for Ht evolution prepared by derivatizing the surface first with Reagent III followed by deposition of approximately an equimolar amount of Pd(0) by electrochemical deposition. The Auger/depth profile analysis for Pd, Si, C, and O is typical of such interfaces (49) for coverages of approximately 10 8 mol PQ2 /cm2.

Auger depth profiling results of (a) 2-methyl resorcinol-PDMSX, (b) o-cresol novolac-PDMSX, and (c) poly(hydroxy-styrene)-PDMSX. 

A comparative smdy of great practical value has been carried out between several Ni-based diffusion barrier properties. Those were produced by means of electroless deposition from nickel sulfate and nickel sulfamate deposition solutions (73). It was concluded on the basis of Auger depth profiling (see Section 13.3) that Ni(P) sulfamate has much better diffusion barrier properties than Ni(P) sulfate. This conclusion is a telling example of the influence of anions on the physical properties of electro-chemically deposited metals. 

Auger Depth Profiles - Auto Exhaust Particles... 

Figure 25 Auger depth profile of molybdenum silicide film.

Figure 4. Auger depth profiles of Ti/Cu strip peeled from polyimide (a) as-deposited and (b) after 350 C forming gas anneal (200W,30min RF)...

The aim of this work is to give a better understanding of the role of the plasma on the surface modifications of the polypropylene. Different surface analysis techniques such as static SIMS and XPS have helped us to point out the chemical modifications of the plasma treated polymer. Auger depth profiles through the metallic coatings and their interfaces with the polypropylene have been performed in the case of both treated and non treated polypropylene. At last, Transmission Electron Microscopy (TEM) has been carried out and has allowed us to measure precisely the thickness of the metallic coating as well as to identify its growth process. 

Fig. 8.22. Auger depth profile of tarnished bornite (after Vaughan et al., 1987).

Figure 33.9 Auger depth profile of TMS film on cold-roll steel, (a) (Ar + H2) plasma pretreated, (b) O2 plasma pretreated.

The interfaces represented by the sketch in Scheme VI have been prepared and characterization by Auger/depth profile analysis is consistent with the preparation procedure.(35) For... 

Figures 1 and 3 for Auger depth profile analyses supporting...

Figure 1. Auger depth profile analysis of a W electrode derivatized first with III to yield W/[(PQ 2Cl)JPd(0)/PQ 2Cr).]. , after removal from O.I M KCl solution as described in the text.

Figure 3. Comparison of pH dependence on H, evolution for two different interfaces top, the derivatization with 111 is followed by Pd(0) deposition and only when [(PQ )n]nrt is reduced, current for Ht is observed and bottom, Pd(0) deposition directly onto W is followed by derivatization with III and Ht evolution shows the usual 59 mV/pH shift expected. The insets show Auger depth profile analyses after the electrodes were used. Data from Ref. 35.

Figure 6. Auger depth profile of hsX thick spin-on glass film.

Figire 1. Auger depth profiles of elements in Al-Ti alloy films before (a) and after (b) anodization. 

Fig. 39. Auger depth profile obtained from a plasma-polymerized film on a polished steel substrate after the film was reacted with a model rubber compound for 65 min. Reproduced by permission of Gordon and Breach Science Publishers from Ref. [45].

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