Applications electronic components

The purpose of this section is to introduce the basic concept of power conversion. Power eonversion eneompasses a wide range of applications, electronic components, cireuit topologies, and related technical issues. An in-depth discussion of this technology is beyond the scope of this chapter and is best left to texts and papers authored by specialists in power electronics. Three instructive publications are an introduetion to the teehnology by Bose [4], a technology review by Bose [26], and a Sandia National Labs overview report [27]. 

Another important application area is the non-destructive defectoscopy of electronic components. Fig.2a shows an X-ray shadow image of a SMC LED. The 3-dimensional displacement of internal parts can only be visualized non-destructively in the tomographic reconstmction. Reconstructed cross sections through this LED are shown in Fig.2b. In the same way most electronic components in plastic and thin metal cases can be visualized. Even small electronic assemblies like hybrid ICs, magnetic heads, microphones, ABS-sensors can be tested by microtomograpical methods. 

R. A. Ereggens, Experimental Determination of Wick Propertiesfor Heat Pipe Applications, ST-4086, RCA Electronics Components, Lancaster, Pa., 1969. 

Barrier polymers are used for many packagiag and protective applications. As barriers they separate a system, such as an article of food or an electronic component, from an environment. That is, they limit the iatroduction of matter from the environment iato the system or limit the loss of matter from the system or both. In many cases the environment is simply room air, but the environment can be very different, such as ia the case of protecting a submerged system from water. 

Another important application area for PSAs in the electronic industry focuses on the manufacturing, transport and assembly of electronic components into larger devices, such as computer disk drives. Due to the sensitivity of these components, contamination with adhesive residue, its outgassing products, or residue transferred from any liners used, needs to be avoided. Cleanliness of the whole tape construction becomes very critical, because residuals like metal ions, surfactants, halogens, silicones, and the like can cause product failures of the electronic component or product. Due to their inherent tackiness, acrylic PSAs are very attractive for this type of application. Other PSAs can be used as well, but particular attention has to be given to the choice of tackifier or other additives needed in the PSA formulation. The choice of release liner also becomes very critical because of the concern about silicone transfer to the adhesive, which may eventually contaminate the electronic part. 

There are many applications for silicone adhesives, sealants, or coatings where the condensation curing systems are not suitable. This is because they are relatively slow to cure, they require moisture to cure that can itself be in some cases uncontrollable, and they evolve by-products that cause shrinkage. Adhesives needed in automotive, electronics, microelectronics, micro electromechanical systems, avionic, and other hi-tech applications are usually confined to vei7 small volumes, which can make access to moisture difficult. Also, their proximity to very sensitive mechanical or electronic components requires a system that does not evolve reactive chemicals. 

For the electronic component industry, different types of plastics and processes are extensively used. Not too evident is the high powered action of electronics in the plastic toy industry. The digital revolution has opened up a variety of new applications in smart microprocessor-based toys that use technology in innovative ways. Foremost player is the MIT Media Laboratory s Toys of Tomorrow (TOT) consortium that was organized in April 1998. 

Since the end of the 1970s, the polyimides have been introduced for the production of electronic components mainly for the passivation. But more and more they are interesting for the integrated circuits and multichip modulus fabrications. Processability and dielectric and thermomechanical properties are the most attractive features of these materials for the electronic31 and electro-optical applications.32... 

Their great strength and conductivity have led to the use of nanotubes in submicroscopic electronic components such as transistors. The rigidity of nanotubes may also allow them to be used as minute molds for other elements. For example, they can be filled with molten lead to create lead wires one atom in diameter and can serve as tiny test tubes that hold individual molecules in place. Nanotubes that are filled with biomolecules such as cytochrome c hold the promise of acting as nanosensors for medical applications. 

In the thermochromic liquid crystal (TLC) the dominant reflected wavelength is temperature-dependent and it has been employed for full-field mapping of temperature fields for over three decades. Although it is non-intrusive and cost effective, there are some problems in applying it to micro-scale measurements, because of size (typically tens of micrometers) and time response (from a few milliseconds to several hundred milliseconds depending on the material and the form). Examples of application are micro-fabricated systems (Chaudhari et al. 1998 Liu et al. 2002) and electronic components (Azar et al. 1991). 

Chemical vapor deposition (C VD) is a versatile process suitable for the manufacturing of coatings, powders, fibers, and monolithic components. With CVD, it is possible to produce most metals, many nonmetallic elements such as carbon and silicon as well as a large number of compounds including carbides, nitrides, oxides, intermetallics, and many others. This technology is now an essential factor in the manufacture of semiconductors and other electronic components, in the coating of tools, bearings, and other wear-resistant parts and in many optical, optoelectronic and corrosion applications. The market for CVD products in the U.S. and abroad is expected to reach several billions dollars by the end of the century. 

Two maj or areas of application of CVD have rapidly developed in the last twenty years or so, namely in the semiconductor industry and in the so-called metallurgical-coating industry which includes cutting-tool fabrication. CVD technology isparticularly important in the production of semiconductors and related electronic components. Itisby far the most... 

The major application of CVD aluminum nitride is for electronic components. At this time, most of the AIN powder is produced by CVD and originates in Japan and is used by the Japanese industry.b l... 

The volume concludes with the preparation of four useful starting materials. The highly electrophilic tricarbonyl reagent DIMETHYL MESOXALATE finds application as a two-electron component in various pericyclic processes. 9-BROMO-9-PHENYL-FLUORENE is becoming increasingly used for the protection of primary amines, particularly amino acids and amino esters. Two methods for introducing the 9-phenylfluorenyl group are illustrated in the preparations of (S)-N-(9-PHENYLFLUOREN-9-YL)ALANINE AND (S)-DIMETHYL N-(9-PHENYLFLUOREN-9-YL)ASPARTATE. 

We have seen that many electronic components, even not specifically produced for cryogenic applications, can be usefully operated at low temperature some of them retain their room temperature characteristics like NiCr resistors which do not appreciably change their resistance (less than 10% upon cooling to 4K) and show a lower noise at low temperature. Other resistors (as RuOz) and most capacitors change their characteristics with temperature. Mica and polyester film capacitors show a good temperature stability. If capacitors insensitive to temperature are needed, crystalline dielectric or vacuum capacitors must be used. 

Molecular electronics was bom in the 1990s as a branch of nanotechnology dealing with the study and application of molecular building blocks for the fabrication of electronic components [1-3]. Today, after more than 15 years of intense... 

The discussion of Brouwer diagrams in this and the previous chapter make it clear that nonstoichiometric solids have an ionic and electronic component to the defect structure. In many solids one or the other of these dominates conductivity, so that materials can be loosely classified as insulators and ionic conductors or semiconductors with electronic conductivity. However, from a device point of view, especially for applications in fuel cells, batteries, electrochromic devices, and membranes for gas separation or hydrocarbon oxidation, there is considerable interest in materials in which the ionic and electronic contributions to the total conductivity are roughly equal. 

The U.S. Department of Energy has a major program in the Solid State Energy Conversion Alliance to bring about dramatic reductions in fuel cell costs. The goal to cut costs to 400 per kilowatt by the year 2010 would make fuel cells competitive for most power applications. The objective is to develop a modular, all-solid-state fuel cell that can be mass-produced for different products in the same way as electronic components are made. 

Substitution of Rb for Ag has led to an ordered Rblj array within which Ag ions are disordered at room temperature over an array of face-shared tetrahedral sites although the E = in this compound is a little larger, stabilisation of fast ionic conduction to room temperature with the elimination of a first-order phase change between room temperature and the melting point was a major technical accomplishment (Bradley and Greene, 1966 Owens and Argue, 1967). Unfortunately there are few technical applications other than in electronic components that can use Ag as the working ion. 

Complete PV systems consist of modules (also referred to as panels), which contain solar cells and the so-called balance of system (BoS). The BoS mainly comprises electronic components, cabling, support structures and, if applicable, electricity storage or optics and Sun trackers (the latter for concentrator systems). The BoS costs also include labor costs for turn-key installation. 

As it turned out, CFCs were ideal for the purpose. The members of this chemical family are nonflammable, noncorrosive, nontoxic, odorless, and very stable. Within a short period, they became widely popular for a variety of industrial applications. In addition to their applications in refrigeration systems, they became popular as aerosol propellants, cleansing agents for electrical and electronic components, and foaming agents in the manufacture... 

Epoxy re.sins, ubiquitous in the electronics industry, are used in a wide variety of applications in the manufacture of electronic components, including insulation materials, circuit board substrates, and component coatings and encapsulants. 

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