Low temperature bonding

Wire imprinting was also achieved on PS, PMMA, and a copolyester material (Vivak) using chromel wire [206], Low-temperature bonding was applied for channel sealing. The EOF was found to be the highest in the copolyester chip and the lowest in the PS chip. The chromel wire was stretched taut and placed... 

Tadepalli R, Thompson CV. Quantitative characterization and process optimization of low-temperature bonded copper interconnects for 3-D integrated circuits. Proceedings of The IEEE International Interconnect Technology Conference 2003. p 36-38. 

He A, Osborn T, Bidstrup S, Allen P, Kohl P. Low temperature bonding of copper pillars for all-copper chip-to-substrate interconnects. Electrochem Solid-State Lett 2006 9 (12) C192-C195. 

In this session, micro direct methanol fuel cells (DMFC) fabricated by Si MEMS and plastic MEMS are described. For examples of micro/nano fabrication technologies, fine micro plastic fluidic chips fabricated by molding and low temperature bonding are reported. The 3-D metal micro mesh electrode fabricated by simple UV photolithography is described next. For an example of micro flow devices, the pneumatically actuated microvalve and the microreactor having multireagent inlets are introduced. 

In general, flexibilizers improve the low-temperature bond strengths at 50 °C or lower by reducing stresses, but often at the expense of reducing high-temperature strengths. 

Takeoka, G. and Jennings, W. (1984) Developments in the analysis of head-space volatiles on-column injections into fused silica capillaries and split injections with a low-temperature bonded PEG stationary phase. Journal of Chromatographic Science, 22, 11 %A. 

Acrylic Solvent solutions, emulsions and mixtures requiring added catalysts Evaporation of solvent RT or elevated temp (two-part) Good low-temperature bonds poor heat resistance excellent resistance to ultraviolet clear colorless Glass, metals, paper, textiles, metallic foils, plastics Medium... 

Sayah A, Solignac D, Cueni T, Gijs MAM (2000) Development of novel low temperature bonding technologies for microchip chemical analysis applications. Sens Actuator A 84 103-108... 

We wish to concern ourselves with the popular latent catalyzed, rubber modified, epoxy film adhesives developed for low temperature bonding of the main aircraft alloys, i.e., 2024 and 7075, bare and clad, aluminum. The maximum service environment we shall consider is 60°C, 100% relative humidity. Similarly, let us consider the problems with realistic structural loads, following the common adage that any material called "structural should be capable of sustaining a constant stress which is about 25% of its failing stress. 

In designing insulation for liquid-hydrogen rocket tanks, several specialized problems must be considered thermal conductivity and strength at low temperatures, bond strength between insulation and metal tanks, surface seal for prevention of air condensation within the insulation, and ablation at high surface temperatures. These separate problems will each be discussed. In addition, for a specific vehicle and flight plan, two insulations that will accomplish their necessary tasks will be described. 

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