Aluminium bonding

Burg, A. B., and K. Modritzer Chemistry of Phosphorus Aluminium Bonding Dimethylphosphino-Aluminium Hydrides and Chlorides. J. Inorg. Nucl. Chem. 13, 318 (1960). 

To ascertain whether tritium could have entered the polyisobutylenes by a process other than the hydrolysis of a carbon-aluminium bond, we tested the reaction of suitable polymers with aluminium bromide. The polyisobutylenes were dissolved in ethyl bromide, and phials of aluminium bromide were crushed into these solutions, which were subsequently kept at 0 °C for ca. 15 minutes, and then hydrolysed in the usual way with tritiated water. The three substances examined in this way were polyisobutylenes of high and low DP, and nonadecane. The polyisobutylenes contain approximately one double bond per molecule. The results in... 

Complementing the transition metal chemistry reported in Section 2.12.9.2, aluminacyclopropene complexes 183 undergo insertion of CO or t-butylisonitrile into the carbon-aluminium bond to yield 2-aluminacyclobutenone complexes 184 or the analogous 2-aluminacyclobutenimine complexes, respectively (Scheme 47) <2006CC1763>. 

The blends of XNBR and chlorobutyl rubber (CIIR) and XNBR-epichlorohydrin rubber (ECO) act as adhesive for aluminium-aluminium bonding [171,172], In order to study the adhesion between CIIR-XNBR blend on aluminium foil, Bhattacharya and co-workers... 

During the course of hydrothermal dealumination (ultrastabilisation) of zeolite Y quadrupole nutation NMR detects four kinds of aluminium sites. In addition to signals from the framework (F), non-framework tetrahedral (NFT) and non-framework octahedral (NFO) aluminium there is a signal which we attribute to distorted framework (DFT) aluminium bonded to hydroxyl nests formed during dealumination. 

Alkaline carmine formulations can be used in acid conditions if the colour is entrapped in the viscous food matrix. Hence water-soluble carmine has excellent stability in ice-lollies, hard-boiled candy, gums, jellies and the like. If used in a non-viscous product, e.g., soft drinks, the aluminium bond in the carmine may break and the colour will precipitate thereby changing hue towards a more orange shade. 

C. Bockenheimer, V. Valeske, W. Possart (2002). Network structure in epoxy aluminium bonds after mechanical treatment. Int. f. Adhesion Adhesives, 12, 349-356. 

The preparation of an organoaluminium reagent which, although of undetermined composition, is considered to possess a tin-aluminium bond, and its use in converting allylic phosphonates into homo-allylic alcohols in the presence of a palladium catalyst have been described (Scheme 23). ... 

Abraham and co-workers [32] described measurements of the tensile shear lap strength of bonded specimens of an epoxy imide resin derived from N-(4-carboxyphenyl) trimellitimide bonded to stainless steel. The effect of epoxy resin type on adhesive strength of the Pl-aluminium bond, are also discussed. 

Cyclic Disulphides and Cyclic Diselenides.—Formation. No fundamentally new methods of synthesis of this class of compounds have been reported in the past two years. For l,2>dithiolan the oxidation of l,3>dithiols remains a favoured method, the use of iodine in the presence of triethylamine leading smoothly to 1,2-dithiolans without attendant polymerization. cis- and tra/ -l,2-Dithiolan-3,5-dicarboxylic acids were prepared from a diastereo-isomeric mixture of dimethyl 2,4-dibromoglutarates by sequential treatment with potassium thioacetate and potassium hydroxide in the presence of iodine,and jyn-2,3-dithiabicyclo[3,2,l]octan-8-ol was formed from 2,6-dibromocyclohexanone by successive treatment with potassium thiocyanate, lithium aluminium hydride, and iodine. The stereoselective formation of the less thermodynamically stable alcohol in this case was attributed partly to the formation of chelates with sulphur-aluminium bonds. 2,2-Dimethyl-l,3-dibromopropane was converted into 4,4-dimethyl-l,2-diselenolan on treatment with potassium selenocyanate at 175 °C, but at 140 °C the product was 3,3-dimethylselenetan. Reductive debenzylation of 2-alkylamino-l,3-bis(benzylthio)propanes with lithium in liquid ammonia and oxidation of the resultant dithiols with air afforded 4-dialkylamino-l,2-dithiolans, whilst treatment of a-bromomethyl-chalcone with sodium hydrosulphide gave, as minor product, trans-3 phenyl-4-benzoyl-l,2-dithiolan. Among the many products of thermal decomposition of /ra/ -2,4-diphenylthietan was l,4,5,7-tetraphenyl-2,3-dithiabicyclo [2,2,2]octane. ... 

Fig. 2.17. Strengths of some single lap joints of aluminium bonded with an epoxy-polyamide adhesive on exposure to air at 43°C and 90% relative humidity for various times. Metal surface treatments are etching in chromic-sulphuric acid, O alkaline etching, solvent degrease, and phosphoric acid etching, (after Butt and Cotter ).

The membranes can also be reinforced to improve the durability of the material and prevent over-elongation of the membrane. Other t5q>es of materials and membranes are available and a specific assessment should be made where these materials are proposed (e.g. liquid applied membranes and aluminium bonded to geotextile membranes). The disadvantages and points to consider for various types of membrane are provided in Table 7.3. 

Jaguar. In-board and out-board flaps, trailing edges, tips and slats are constructed from BR-227 primed, chromic acid anodised aluminium bonded with FM-61, a 175°C curing modified epoxy film adhesive. 

Figure 31 Structure of IBM s solder bumps fabricated at the wafer scale before integrated circuits are connected to wiring boards by the flip chip technology (a) integrated circuit with an area array of solder bumps (b) exploded view showing the bump structure with silicon substrate 1, aluminium bonding pad 2, silicon dioxide 3, silicon nitride passivation 4, titanium-tungsten alloy 5, sputtered copper 6, plated copper 7, and reflowed plated...

The exploded view drawn in Figure 36(B) illustrates the fabrication of the bumps as the last step of wafer processing on the top of a semiconductor (a) whose passivation layer (b) is opened over the aluminium bonding pads (c) before gold or solder bumps (d) are formed. Another process, called bumped tape TAB, is used when bumped wafers are not available. Here, bumps are built on the inner end of the beam leads, rather than on the chips. Figure 36(C) shows a gold-plated bump (e) positioned over the aluminium bonding pad (c). 

Figure 36 Schematic representation of the TAB process (A) in which bumped chips 2 are aligned by the indexing table 1, whereas the copper leads 3 supported on polyimide tape 4 are matched with the bonding bumps under the thermode head 5. Exploded views (B) and (C) represent bumped chip and bumped tape, respectively, with (a) silicon substrate (b) passivation layer (c) aluminium bonding pad (d) multimetal chip bumps or (e) gold-...

In buildings, rigid insulating panels consisting of aluminium bonded to polystyrene or other polymers are used. Hexible packaging materials are made of aluminium bonded to PVC films. 

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