Wafer scale packaging

FIGURE 3.14 Wafer-scale package. (Courtesy ofFUpchip Tedinologies.)... 

Packaging and/or Process Process Process Cabling Laser Wafer-scale... 

Majid, N. Dabral, S. McDonald, J. F., The parylene aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging, J. Electron. Mater. 1989, 18, 301 311... 

In the multichip package, a variety of pretested chips (e.g., bipolar, MOS, and GaAs) and discrete components (decoupling capacitors and termination resistors) may be mounted on the high-density interconnection substrate. This approach is sometimes termed hybrid-wafer-scale integra-... 

Wafer-Scale Planarity Wafer-scale nonplanarities are not often well characterized in IC processing because their effect on yield is often low compared to other processing parameters however, work has been reported on its effects on electrical performance [99,100]. For the characterization of 3D integration and wafer-level packaging (WLP) approaches such as the use of redistribution layers, wafer-level planarization requirements have not been... 

The manufacturing processes represent the link between the reliability issues of the microstructure on one hand and those of assembly and packaging on the other. The process flow must take into account, for example, the impact of the applied temperature range, pressure, and media on the sensor structure, which at the time of packaging is already completed. Dicing of sensor structures that include delicate elements, such as freestanding cantilevers or thin membranes, is usually very critical and requires some kind of protection which can be effectively provided by zero-level packaging on the wafer scale. 

WLCSP—Wafer level Chip Scale Package. 

In bunq>ing/redistribution/wafer level cMp scale packaging, polymer layers are used for rerouting of perimeter bond pads to an internal array or for recon-figurmg pads for solder bunqring. Photosensitive DVS-bisBCB resin is used extensively for this plication in the U.S., Taiwan, Korea, and Europe. 

Uddin, A., Milaninia, K., Chen, C. H., and Theogarajan, L. 2011. Wafer scale integration of CMOS chips for biomedical applications via self-aligned masking. IEEE Trans. Compon., Packag., Manuf. Technol. 1 1996-2004. 

This research uses the validated finite-element analyses to study the thermo-mechanical behaviors of the 96.5Sn-3.5Ag, 95.5Sn-3.8Ag-0.7Cu lead-fi ce solders and the classical 63Sn-37Pb solder bumped wafer level chip scale package on PCB assemblies subjected to a novel temperature cycle test. It can be seen that the same scale to the WLCSP and the WLCSP with underfill, the difference of the equivalent total strain range exceed an order of magnitude for all the three solder joints. 

Lau, J. H. and Lee, S. W. R., Modeling and Analysis of 96.5Sn-3.5Ag Lead-Free Solder Joints of Wafer Level Chip Scale Package on Buildup Microvia Printed Circuit Board, IEEE Transactions on Electronics Packaging Manufacturing, 25,51-58 (2002). 

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