Triphenylsulfonium hexafluoro-antimonate

As an example, when the photoacid generator triphenylsulfonium hexafluoro-antimonate is exposed to radiation, it decomposes to release the superacid hexafluoroantimonic acid in the resist film. While this photochemical reaction can occur at room temperature, the acid-catalyzed deprotection of the pendant t-butyl group of the resist polymer occurs at reasonable rates only at elevated temperature. It is therefore necessary to heat the resist film to an appropriate temperature (PEB) to provide the energy that is required for the acid-catalyzed deprotection of the t-butyl group of the ester, which in mrn affords the base-soluble norbomene carboxylic acid unit the isobutylene volatilizes. The extent of deprotection at constant temperamre is dependent on the dose of applied radiation. By monitoring the carboxylic acid OH stretch 3000-3600 cm and the ester carbonyl (C O) around 1735 cm acid carbonyl (C O) around 1705 cm , and ester (C-O-C) stretch around 1150 cm it is possible to determine by means of IR spectroscopy the extent of dose-dependent deprotection, as well as the influence of baking temperature on the extent of deprotection for each resist system. Doses ranging from 0 to 50 mJ/cm were applied to each resist system, after which they were baked at 120, 130, 140, and 150°C for 60 seconds and analyzed by FTIR. ... 

A linear-chained epoxy resin was formulated from phenyl glycidyl ether and nadic methyl anhydride, catalysed by benzyldimethylamine (248). An IR fibre-optic probe was used to follow the conversion of a thermosetting tetrafunctional epoxy resin in which the hardener was an aromatic diamine and a carboxylic dianhydride. A polymerisation system consisting of a cycloaliphatic diepoxide, epoxidised natural rubber (ENR), glycidyl methacrylate (GMA) and a cationic photoinitiator, triphenylsulfonium hexafluoro-antimonate, was studied (75). Multifunctional epoxy/ amine formulations (Epon 825 plus 4,4 -methylene-... 

Dudgeon (25) describes systems suitable for curing in deep sections (e,g., as auto body solders) which may be adapted for heat or cationic UV curing (or a combination of both), Fast curing (2-3 min) systems with full depth cure are based on CTBN or HTBN modification of an epoxycyclohexyl ether and mixtures of triphenylsulfonium hexafluoro-antimonate (50% in propylene carbonate) and diphenyl-iodonium hexafluoroarsenate (50% in MEK) with low levels of copper naphthenate. These systems operate at high talc loadings to form deep-section curable putties. Examples suffice where a cluster of two infrared lamps and two ultraviolet lamps operate efficiently to effect cure. 

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