Baking temperature

In appHcatioa, the automobile or other article to be coated is made the cathode ia an electro deposition system. A current differential on the order of 250 to 400 V is appHed, which attracts the positively charged coating aggregates to the cathode. At the cathode, hydroxide ions from the electrolysis of water precipitate the aggregates on the surface of the metal. As the conveyor removes the coated product from the bath, residual Hquid is tinsed off with water and the article is conveyed iato a bakiag ovea for a high temperature bake. 

Conditions to be met in oven drying enamels depend also on the composition of the binder. Paint systems containing melamine-formaldehyde or urea-formaldehyde resins, for instance, harden by polycondensation with other resins, such as epoxy resins, short-oil alkyd or acrylic resins at elevated temperatures. Baking is carried out at temperatures between 100 and almost 200°C and may last from a few minutes to more than an horn. A general trend towards energy conservation has shifted public attention towards binders which require low baking temperatures. 

Frequently, adhesion promoters are used. The substrates are primed or coated with a thin layer of an adhesion promoter, typically HMDS, prior to spin coating with resist (18). Possibly, the primary action of HMDS is to negate hydrophilic sites such as SiOH and trapped moisture on the substrate surface that would otherwise repel the photoresist. HMDS is applied by dipping, vapor priming in special chambers, or spin coating. Spin coating is most often accomplished with the same equipment that is used to coat resists. No high-temperature bake other than the resist prebake is required. 

A conditioning method which is very effective for reducing particle desorption coefficients without resorting to high temperature bake-out is discharge cleaning (1, 31, 37) The... 

A cake Amount of sugar, starch, and Oven temperature, baking time,... 

Researchers should therefore study the performance of the derivatization reactions used with their samples to avoid the possibility that biases are introduced due to the derivatization reactions (QC samples of the type employed in LC-MS can provide much useful data in this respect) (44). Another issue is the need for extensive column cleanup. In most cases, injection occurs in splitless mode. Introduction of excess derivatization reagents may damage the injection liner and the analytical column. Frequent replacement of the liner is thus necessary. Cleanup of the column can be done by back-flush (when this feature is available) or by application of high temperatures (bake-out). 

Postbaking of a photoresist mask. Postexposure high temperature bakes are used to stabilize the film prior to subsequent processing. 

Effects of Brominated Resins. Wirebonds under high-temperature bake endured a remarkably longer life when coated with the experimental resins as compared to the standard. Uncoated wirebonds, of course, still had longer... 

The soil used for testing was contaminated with 2,3,7,8-tetrachlorodibenzo-p-dioxin (TCDD) at a concentration of about 200 ppb. Two tests were run at a 48 Ib/hr feed rate and solid phase residence times of 30 minutes and 15 minutes. The primary chamber temperature was 1490 F to 1560°F. The secondary chamber temperature was maintained above 2200°F. The thermal treatment conditions for both tests are listed in Table II. The testing was performed over two days followed by decontamination of the incinerator and trailer. The incinerator was decontaminated by an extended, high temperature bake out. 

Have a clean set of effusion cells and fresh samples ready to load. The least damaging method of cleaning effusion cells is a high-temperature bake-out. For some ceramic cells, an aqua regia (HNOsiHCl-1 3) soak prior to bake-out will help remove bulk quantities of residual metals without damaging the cell. 

Phenol- color low cost Stable High temperature Baked enamels can. 

After delineation of the resist with the last phosphor, the polymer is removed from the phosphor dots by a high temperature bake. The polymer must disappear completely, otherwise no vacuum can be maintained in the CRT. Another important function of the bake at high temperature is that the phosphor dots are made to adhere very well to the screen surface. 

KYNAR SL is a copolymer of vinylidene fluoride and tetrafluoroethylene and is designed for low temperature bake coating applications. It complements the established KYNAR 500 based finishes that are baked on metallic substrates at relatively high temperatures. Typical properties of KYNAR SL are shown in Table 3. Like KYNAR FLEX, this copolymer is flexible but unlike the homopolymer and the former copolymer, it is much more soluble in common solvents. 

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