Thick-Film Components

Compatible with other thick film components such as resistors and dielectrics... 

Choosing the glass content for thick-film components is mainly dictated by the following requirements ... 

Equally important as tape casting in the fabrication of multilayer ceramics is thick film processing. Thick film technology is widely used in microelectronics for resistor networks, hybrid integrated circuitry, and discrete components, such as capacitors and inductors along with metallization of MLC capacitors and packages as mentioned above. 

Weathering. Articles fabricated from FEP are unaffected by weather, and thek resistance to extreme heat, cold, and uv kradiation suits them for apphcations in radar and other electronic components. For example, after 15 years of solar exposure in Florida, the tensile strength (73) and light transmission (96%) of a 25-p.m thick film was unchanged and the film remained crystal clear. Elongation increased slightly for the first 5 to 7 years of outdoor exposure, probably as a result of stress relaxation. Beyond 10 years, a small decrease was observed. 

Silver Thick Films. About half of the silver consumed in the United States for its electrical properties is used by the electronics industry. Of this amount some 40% is used for the preparation of thick-film pastes in circuit paths and capacitors. These are silk-screened onto ceramic or plastic circuit boards for multilayer circuit sandwich components. 

Figure 5-21. N(ls) core level spectra of the iiniim model compound PC20X adsorbed on ITO. The upper curve corresponds to a thick film, the central curve to an intermediate thick film, and the lower curve to an ultra thin Him, essentially a mono-layer in thickness. The bold solid lines are the filled curves and the thin solid and dolled lines are the Gaussian peak components lor physisorbed and chemisorbed PC20X, respectively.

Figure 8.19 Two-diaenslonal separation of the components of a coal derived gasoline fraction using live switching. Column A was 121 n open tubular column coated with poly(ethelene glycol) and column B a 64 m poly(dimethylsiloxane) thick film column. Both columns were temperature programmed independently taking advantage of the two oven configuration. Peak identification 1 acetone, 2 2-butanone, 3 > benzene, 4 isopropylmethylketone, 5 isoprop-anol, 6 ethanol, 7 toluene, 8 => propionitrile, 9 acetonitrile, 10 isobutanol, 11 — 1-propanol, and 12 = 1-butanol. (Reproduced with permission from Siemens AG).

Cold splitless WCOT thick film Idem Reproducible and accurate sampling Controlled evaporation No discrimination on basis of b.p. Large volume injection Low detection limits Minimisation of solvent entering column Allows polar solvents Automation Small sample size introduction (<2 xL) Thermal degradation possible (long residence times of components in liner)... 

Ru02 resistors are commercial small-power (volume of few mm3) electronic components. They belong to the group of smd (surface mount device) thick-film resistors and are... 

Figure 1. Smart dust mote and its components Micro-fabricated sensors, optical receiver, signal-processing and control circuitry the power source consists of a solar cell and a thick-film battery. (Derived with permission from ref 16. Copyright 2001 IEEE)...

Figure 15 (a) The yield function from 4-ML-thick films of an O2/C4H10 mixture of increasing percentage volume concentration of Oj. (b) The H signal from a 4-ML-thick mixture of 10% O2 in C4H10 can be resolved into two components one centered at 10 eV, associated with production via DEA to the alkane (dotted line), and another at 7.8 eV, associated with reactive scattering of 0 ions (bold line). Also shown is the yield of OH ions from the same film. (From Ref. 257.)... 

Thick-Film Multilayer. Thick-film multilayer technology has been used for many years to fabricate hybrid circuits that interconnect small-scale ICs or discrete components on a ceramic or metal substrate (67-70). This technology has also been used for multichip packaging of more highly integrated ICs for large computer applications. 

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