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Thermal balance test

Thermogravimetric analysis (TGA) has been used to study the kinetics of feedstock pyrolysis. In this work, a Seiko 220 TG/DTA thermal balance system was used. The sample mass was 10.0 0.1 mg. The heating rate was 10 C/min. For each test, the nitrogen gas was first introduced in the furnace to remove the air. Then the pressure in the furnace was lowered by a vacuum pump to 13 kPa absolute. [Pg.1302]

Yield of Organic Residue. A high yield of organic residue adversely affects the cost of leaching the pulping base from the solid product as well as the thermal balance of the over-all recovery system. However, it was found in the laboratory (using the methylene blue adsorption test) that if the residue were produced at 750°C. or higher, it showed excellent adsorptive properties, similar to commercial activated carbons. The optimum yield of the residue appears to depend therefore on the size of the accessible market for this material. [Pg.247]

Find et al. [25] developed a nickel-based catalyst for methane steam reforming. As material for the microstructured plates, AluchromY steel, which is an FeCrAl alloy, was applied. This alloy forms a thin layer of alumina on its surface, which is less than 1 tm thick. This layer was used as an adhesion interface for the catalyst, a method which is also used in automotive exhaust systems based on metallic monoliths. Its formation was achieved by thermal treatment of microstructured plates for 4h at 1000 °C. The catalyst itself was based on a nickel spinel (NiAl204), which stabUizes the catalyst structure. The sol-gel technique was then used to coat the plates with the catalyst slurry. Good catalyst adhesion was proven by mechanical stress and thermal shock tests. Catalyst testing was performed in packed beds at a S/C ratio of 3 and reaction temperatures between 527 and 750 °C. The feed was composed of 12.5 vol.% methane and 37.5 vol.% steam balance argon. At a reaction temperature of 700°C and 32 h space velocity, conversion dose to the thermodynamic equilibrium could be achieved. During 96 h of operation the catalyst showed no detectable deactivation, which was not the case for a commercial nickel catalyst serving as a base for comparison. [Pg.929]

Thermal stability in air and vacuum (Tab. 6) were tested on a thermal balance under vacuum and air environments for 3 hrs. [Pg.27]

Successful soldering is dependent on several factors including suitable, well-maintained, and controlled reflow equipment good-quahty solderable parts a thermally balanced board designed for the reflow process a well-tested and rehable solder paste a proven time-temperature profile and good thermometry techniques. [Pg.1086]

The balanced Taguchi designed test matrix (see Table 20.3), because of its Latin square arrangement is ideally suited for statistical analysis of the rapid thermal cycle test behaviour. The main effects of test temperature, upper dwell time and specimen geometry can be investigated. The three... [Pg.375]

Since the last benchmark calculation, due to safety and technological problems, the shroud design and the insulator used (less porous) have been changed also new wishes concerning the test conduct appear it is necessary to check the thermal balance of the test train mth stea states at the beghming of the transient. Therefore, a new scenario was proposed and a new set of calculations is presently under way. Preliminary results for the bundle are summarized below. [Pg.246]

Sn-3.8Ag-0.7Cu Thermal cycling on NiAu-coated FR-4 PCB with 0402 ceramic chip capacitors wetting balance tested 47... [Pg.790]

Significant time is saved in this calibration procedure by minimizing sample preparation and the number of calibrated test apparatus wherein only a balance, a 5-mL volumetric flask, a stopwatch, a thermal probe, two standards, one HPLC column, and one mobile phase are used. The use of MS Word template forms (see Figure 10) saves considerable time by eliminating any notebook entries and also improves the consistency of calibration records. Two important system parameters, dwell volume, and... [Pg.299]


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