Technologically-enhanced naturally

NAS/NRC (1999a). National Academy of Sciences/National Research Council. Evaluation of Guidelines for Exposures to Technologically Enhanced Naturally Occurring Radioactive Materials (National Academy Press, Washington). 

NORM is an internationally adopted acronym for Naturally Occurring Radioactive Material while TENORM stands for Technologically-Enhanced Naturally Occurring Radioactive Material. 

Birky, B.K., Tolaymat, T., Warren, B.C. (1998). Evaluation of Exposure to Technologically Enhanced Naturally Occurring Radioactive Materials (TENORM) in the Phosphate Industry. Florida, USA Florida Institute of Phosphate Research. 

Enhanced natural degradation (END) is an in situ bioremediation technology for groundwater contaminated with hazardous organic compounds. By promoting the proper environmental conditions, the natural microorganisms in the subsurface soils multiply and transform the contaminants into nontoxic compounds, according to the vendor. 

The various technologies that rely upon the degradative activities of microorganisms and focus on enhancing natural (although slow) biodegradation processes in soil are encompassed by the term bioremediation. 

Consideration of MNA as a remedy or remedy component is the result of a complex process including evaluation of MNA along with other remedial approaches and technologies. In particular, source control measures should be evaluated for all sites and implemented at most sites where practicable. These measures include the removal, treatment or containment of sources (US EPA 1999). If human action is involved to accelerate the attenuation processes the term Enhanced Natural Attenuation (ENA) is used. 

Cohen B. 1979. Radon Characteristics, natural occurrence, technological enhancement, and health effects. Progress in Nuclear Energy 4 1-24. 

Rowell R.M., Property enhanced natural fiber composite materials based on chemical modification, in Science and Technology of Polymers and Advanced Materials Emerging Technologies and Business Opportunities, Proceedings of the Fourth International Conference on Frontiers of Polymers and Advanced Materials, Cairo, Egypt, 4—9 January 1997), Plenum Press, New York N.Y., 1998, pp. 717-732. 

Thus, LLRW is defined more by what it is not than by what it is, that is, LLRW is defined by exclusion. LLRW is radioactive waste that is not HLRW, TRU waste, SNF, or byproduct material (commonly referred to as uranium mill tailings). All of these have separate legal definitions. Naturally occurring radioactive material and technologically enhanced NORM are also defined separately from LLRW but are not currently regulated under federal statute. 

What gives communication technologies, and by extension virtual worlds, their power as spaces is the concept of extensibility. This term denotes a person s ability to influence events in space and time (Adams, 1995, 2005 Janelle, 1973). Extensibility varies for all people as a function of their class, race, employment structure, nature of their work, and their own motivations. At the same time, extensibility emphasizes the fact that humanity s epistemology is derived from the body. The concept of extensibility helps one to visualize the multiple linkages forged in the virtual and material realms. Internet technologies enhance extensibility rather than transport a disembodied mind to a virtual realm separate from material space. 

Dielectric Film Deposition. Dielectric films are found in all VLSI circuits to provide insulation between conducting layers, as diffusion and ion implantation (qv) masks, for diffusion from doped oxides, to cap doped films to prevent outdiffusion, and for passivating devices as a measure of protection against external contamination, moisture, and scratches. Properties that define the nature and function of dielectric films are the dielectric constant, the process temperature, and specific fabrication characteristics such as step coverage, gap-filling capabihties, density stress, contamination, thickness uniformity, deposition rate, and moisture resistance (2). Several processes are used to deposit dielectric films including atmospheric pressure CVD (APCVD), low pressure CVD (LPCVD), or plasma-enhanced CVD (PECVD) (see Plasma technology). 

Pressure Swing Adsorption. A number of processes based on Pressure Swing Adsorption (PSA) technology have been used in the production of carbon dioxide. In one version of the PSA process, CO2 is separated from CH using a multibed adsorption process (41). In this process both CH4 and CO2 are produced. The process requires the use of five adsorber vessels. Processes of this type can be used for producing CO2 from natural gas weUs, landfiU gas, or from oil weUs undergoing CO2 flooding for enhanced oil recovery (see Adsorption, gas separation). 

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