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Substrate bias

Examples were given above of stereocontrol due to substrate bias of a steric nature. Substrate bias can also result from coordinative or chelate effects. Some instances of coordinative (or chelate) substrate bias are shown retrosynthetically in Chart 18. [Pg.49]

The optical gap of a-C H films was found to continuously decrease with increasing self-bias [42]. The gap shrinking was found to be strongly correlated to the variation of Raman spectra that is related to the increase of the graphitic clusters present in the a-C H films. Accordingly, the electrical resistivity of C H films was found to strongly decrease with substrate bias [43]. [Pg.226]

Our studies of ( )-kinamycin F (6) motivated the development of a three-step sequence for synthesis of the diazofluorene function, comprising fluoride-mediated coupling, palladium-mediated cyclization, and diazo transfer. Our synthesis also features the strategic use of substrate bias to establish the trans- 1,2-diol of the target. [Pg.64]

Using the unique four-electrode STM described above, Bard and coworkers (Lev, 0. Fan, F-R.F. Bard, A.J. J. Electroanal. Chem.. submitted) have obtained the first images of electrode surfaces under potentiostatic control. The current-bias relationships obtained for reduced and anodically passivated nickel surfaces revealed that the exponential current-distance relationship expected for a tunneling-dominated current was not observed at the oxide-covered surfaces. On this basis, the authors concluded that the nickel oxide layer was electrically insulating, and was greater than ca. 10 A in thickness. Because accurate potential control of the substrate surface is difficult in a conventional, two-electrode STM configuration, the ability to decouple the tip-substrate bias from... [Pg.194]

A final advantage of the cosputtered CCS approach is that rf bias, typically 10 W, under independent control can be supplied to the substrate as indicated in the schematic diagram (Fig. 10.2). We speculate that the role of substrate bias is to increase surface mobility during film growth. This changes the microstructure and decreases the defect density of the as-grown film, which is related to the leakage behavior of... [Pg.157]

Figure 2.11 The influence of substrate bias on the drain current-voltage characteristics in 500-ppm Hj or 0.5% Oj at 400°C. (From [97]. 2004 Material Science Forum. Reprinted with permission.)... Figure 2.11 The influence of substrate bias on the drain current-voltage characteristics in 500-ppm Hj or 0.5% Oj at 400°C. (From [97]. 2004 Material Science Forum. Reprinted with permission.)...
The applied negative substrate bias depletes part of the n"-doped epilayer on top of the buried channel from mobile carriers. The conducting channel of the JFET device will then in fact extend also into this depleted epilayer. Then we can define the intrinsic gate of the device as the area in the epilayer, on top of the conducting channel, where the electrons have the highest energy. [Pg.46]

The influence of substrate bias on q and fx can be estimated from (2.10) using the linear region of the log (/ ) versus curve. From the dependence of the inclination on temperature, the values of Hfx are obtained. It is almost independent... [Pg.47]

In most cases nano-cBN deposition is supported by the generation of ions. Parameters for the substrate bias (ion energy, ion mass, etc. [187]) are similar to that in PVD as well as in CVD methods. Therefore a equal growth mechanism in both methods can be considered. When starting the deposition process, commonly an oriented h-BN layer is deposited on the substrate. On... [Pg.28]

The material is sputtered off an h-BN target and deposited on the substrate in a nitrogen/argon atmosphere. For deposition a high negative substrate bias is applied [60, 202, 211]. [Pg.31]

Electron cyclotron resonance (ECR) is used to deposit c-BN layers. Yokohama et al. [220] considered a negative substrate bias as an essential parameter for the deposition in ECR plasma to accelerate the ions formed in the plasma. A linear coherence was found between the bias and the etching rate of c-BN and h-BN, which was higher for h-BN. Three points are important for the crystal growth ... [Pg.32]

Mendez et al. [231] showed in deposition experiments with RF plasma and without substrate bias that there is a coherence of the nano-cBN amount with the substrate temperature and the plasma power. Additionally a dependence on the substrate material used (e.g. Si or NaCl) could be found. Further... [Pg.32]

A rather extreme example of this is given by Wang et al. in a study of TiN/ AIN multilayers (Wang et al., 1998). For samples made with pulsed d.c. substrate bias, the improved hardness was retained down to the lowest values of A. However, when r.f. substrate bias was used the structure at A < 2 nm... [Pg.234]

Hollow cathode gas flow sputtering operates in the pressure range of 0.1-1 mbar. The particles are thermalized at the substrate. Plasma activation of growth processes can be achieved either by applying a substrate bias or by pulsed mode operation of the discharge. [Pg.227]

These surface modifications were performed in "pure" micro-wave (2.45 GHz, "single-mode") or in combined microwave/ radio frequency (2.45 GHz/13.56 MHz, "dual-frequency") plasma. Important systematic changes of the surface composition, wettability, and adhesion of thin metal films were observed for different substrate bias values, and for the different gases. The modified surface-chemical structure is correlated with contact angle hysteresis of water drops this helps to identify which surface characteristics are connected with the wettability heterogeneity and with adhesive bonding properties, and how they are influenced by plasma-surface interactions. [Pg.147]

Fig. 3 Effect of substrate bias on the surface characteristics of PVC and PC treated by Ar in MW/RF "dual-frequency-mode" plasma. Fig. 3 Effect of substrate bias on the surface characteristics of PVC and PC treated by Ar in MW/RF "dual-frequency-mode" plasma.
Definitely as reported previously, it can be concluded that the ion energy flow density was ascribed to the essential factor with influence in c-BN formation [10-13]. So, the substrate bias of 180V was here chosen to deposit c-BN films at different T ub. [Pg.448]


See other pages where Substrate bias is mentioned: [Pg.2808]    [Pg.424]    [Pg.201]    [Pg.229]    [Pg.260]    [Pg.277]    [Pg.171]    [Pg.156]    [Pg.156]    [Pg.158]    [Pg.292]    [Pg.233]    [Pg.240]    [Pg.146]    [Pg.45]    [Pg.46]    [Pg.46]    [Pg.48]    [Pg.150]    [Pg.151]    [Pg.157]    [Pg.159]    [Pg.170]    [Pg.251]    [Pg.448]    [Pg.156]   
See also in sourсe #XX -- [ Pg.44 , Pg.114 ]

See also in sourсe #XX -- [ Pg.252 , Pg.414 ]




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Biases

Substrate bias surface characteristics

Substrate bias voltage

Substrate spatial bias

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