Semiconductor wafer production

Semiconductor wafer production also consumes a large quantity of fresh water. The Philips San Antonio facility was producing 150 mm wafers and planned to move into 200 mm wafer production in early 2000. One task it encountered was the need to increase its supply of high purity water. Its project team evaluated several options, including expanding the fresh water supply and recycling waste wafer rinse water. The team... 

In the cement and mineral industries, XRF analysis of raw materials, intermediate and final products for production and quality control is well established. In addition to the traditional analysis, the universal XRF analysis allows analysis of environmentally relevant elements and materials. New applications of XRF analysis are in the electronic industries analyzing semiconductors, wafers and data carriers, and in the fodder, food and pharmaceutical industries. 

There are two main processes in the fabrication of semiconductor wafers (Wald and Jones 1987 Burgess 1995) - substrate manufacture and device fabrication (Irizarry and Blumstein 1997). These processes are carried out in clean rooms, which are designed to minimise contaminant particles in the environment from depositing and destroying the product. Airflow in clean rooms is continuous, filtered and recirculated. The relative humidity is often low. 

Document value-delivery success AkzoNobel (a chemical manufacturer) conducted a 2-week pilot study on a production reactor at a prospective customer s facility in order to study the performance of its high-purity metal organics product relative to the next best alternative in producing compound semiconductor wafers. The study proved that AkzoNobel s product was as good as, or better, than the rivals and that it significantly lowered energy and maintenance costs. 

Wafer bonding is a technology to combine two substrates in order to achieve a mechanically stable connection between them. The technology is apphed for substrate production, for example, for the fabrication of silicon on insulator wafers or compound semiconductor wafers and for device fabrication, for example, for the fabrication of MEMS/MOEMS devices as described in previous sections, for stacking devices in 3D integration, or for wafer-level packaging. 

After the detail study through a thorough process qualification, the new boron carbide coated chamber wall is used to replace the previously anodized aluminum surface. The new ceramic material such as YAG or Y2O3 is used to replace original high purity alumina. This configuration was introduced to semiconductor wafer fabrication for evaluation. Excellent etch performance, enhanced defect and particle reduction, and 50 to 100 times chamber lifetime improvement are reported. The production yield of the wafer fabrication also improved about 7% in production at the customer site (see Fig.l9) [41]. The following data provide some of the information. The sequence of the data collection is as follows ... 

Thermal spray coating of boron carbide has been studied thoroughly. It has been introducing to worldwide semiconductor wafer fabrication since 1998. The coating has demonstrated over 50 times even 100 times lifetime improvement in production of semiconductor wafer fabrication and has been one of major chamber materials up to today. 

Fig. 32.2 A typical process flow for integrated circuit (IC) fabrication. It is a complex process involving IC design and layout, circuit delineation on a semiconductor wafer, dicing of individual chips, appropriate packaging, and finally incorporating into the electronic product. (From Refs. 4 and 6.)...

Irreversible behavior. It is often impossible to reverse the effects of history-dependent evolution in product properties such as molecular weight distribution in a polymer or crystal size distribution in a pharmaceutical product. In the semiconductor industry, once a semiconductor wafer is made, it is difficult to modify its electrical properties by further processing or rework. 

In 2006 GE announced a new amorphous TPI, Extern , with Tg < 311°C, and high strength, stiffness, chemical and creep resistance at T < 230°C.The new TPI finds applications in auto, aerospace and military products, downhole oil and gas production, medical membranes, electrical connectors, electronics for lead-free soldering, semiconductor wafer handling, and specialty films for insulators and flexible circuitry. 

Undeniably, one of the most important teclmological achievements in the last half of this century is the microelectronics industry, the computer being one of its outstanding products. Essential to current and fiiture advances is the quality of the semiconductor materials used to construct vital electronic components. For example, ultra-clean silicon wafers are needed. Raman spectroscopy contributes to this task as a monitor, in real time, of the composition of the standard SC-1 cleaning solution (a mixture of water, H2O2 and NH OH) [175] that is essential to preparing the ultra-clean wafers. 

Diborane(6), B2H. This spontaneously flammable gas is consumed primarily by the electronics industry as a dopant in the production of siHcon wafers for use in semiconductors. It is also used to produce amine boranes and the higher boron hydrides. Gallery Chemical Co., a division of Mine Safety AppHances Co., and Voltaix, Inc., are the main U.S. producers of this substance. Several hundred thousand pounds were manufactured worldwide in 1990. 

As a world leader in Fluorine chemistry, Honeywell has established a broad base of application specific products to enable the semiconductor industry to meet its technology roadmap. Most recently, we have announced the availability of a new line of wafer thinning materials which provide increased chip flexibility and reduced package size as well as increased thermal dissipation... 

The depth profiles in Fig. 3.26 show that the typical flat channeling implantation profile is generated with low doses only. Increasing the dose superimposes the normal implantation profile shape. Undertaking such experiments with homogeneous wafers enables the production of calibrating models for semiconductor production. 

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