Cleaning solutions

Undeniably, one of the most important teclmological achievements in the last half of this century is the microelectronics industry, the computer being one of its outstanding products. Essential to current and fiiture advances is the quality of the semiconductor materials used to construct vital electronic components. For example, ultra-clean silicon wafers are needed. Raman spectroscopy contributes to this task as a monitor, in real time, of the composition of the standard SC-1 cleaning solution (a mixture of water, H2O2 and NH OH) [175] that is essential to preparing the ultra-clean wafers. 

Three important precautions are needed when working with pipets and volumetric flasks. First, the volume delivered by a pipet or contained by a volumetric flask assumes that the glassware is clean. Dirt and grease on the inner glass surface prevents liquids from draining evenly, leaving droplets of the liquid on the container s walls. For a pipet this means that the delivered volume is less than the calibrated volume, whereas drops of liquid above the calibration mark mean that a volumetric flask contains more than its calibrated volume. Commercially available cleaning solutions can be used to clean pipets and volumetric flasks. 

Acetate and triacetate are essentially unaffected by dilute solutions of weak acids, but strong mineral acids cause serious degradation. The results of exposure of heat-treated and untreated triacetate taffeta fabrics to various chemical reagents have been reported (9). Acetate and triacetate fibers are not affected by the perchloroethylene dry-cleaning solutions normally used in the United States and Canada. Trichloroethylene, employed to a limited extent in the UK and Europe, softens triacetate. 

Dispersion is the process of wetting the surface of the metal, thereby penetrating the oil film. Surfactants can reduce the surface tension and interfacial tension of the cleaning solution at the metal—Hquid interface. As the cleaner undercuts and penetrates the oil, the cleaner breaks the oil into small droplets which then float to the surface. 

Immersion Gleaning. The simplest method for using an alkaline cleaner is by immersion. A part is placed on a hook or rack and immersed ia the cleaner solution so that all of the part is below the Hquid level. A typical concentration, temperature, and process time for an immersion cleaner would be ca 75 g/L at 77°C for 5 min. In addition to being the simplest method, immersion is also among the least expensive in terms of equipment. Only a vessel to contain the cleaning solution and a means of heating the solution are needed. 

The transducers are typically mounted on an outside wall of the cleaning tank, but may also be mounted on the inside of the tank below the solution level in a sealed container. Alkaline cleaning solutions are typically at the same concentration and temperature as for a normal immersion cleaner, but the time required to clean may be less because of the ultrasonic effect. Like electrocleaning, ultrasonic cleaning produces an extremely clean surface. The main drawback is the relatively high cost. 

Stainless steel develops a passive protective layer (<5-nm thick) of chromium oxide [1118-57-3] which must be maintained or permitted to rebuild after it is removed by product flow or cleaning. The passive layer may be removed by electric current flow across the surface as a result of dissinulat metals being in contact. The creation of an electrolytic cell with subsequent current flow and corrosion has to be avoided in constmction. Corrosion may occur in welds, between dissimilar materials, at points under stress, and in places where the passive layer is removed it may be caused by food material, residues, cleaning solutions, and bmshes on material surfaces (see CORROSION AND CORROSION CONTROL). 

A CIP system includes pipelines, interconnected with valves to direct fluid to appropriate locations, and the control circuit, which consists of interlines to control the valves that direct the cleaning solutions and water through the lines, and air lines which control and move the valves. A programmer controls the timing and the air flow to the valves on a set schedule. The 3A Standards for CIP components, equipment, and installation have been developed. A simple CIP system circuit is shown in Figure 11. 

Ozone can be analyzed by titrimetry, direct and colorimetric spectrometry, amperometry, oxidation—reduction potential (ORP), chemiluminescence, calorimetry, thermal conductivity, and isothermal pressure change on decomposition. The last three methods ate not frequently employed. Proper measurement of ozone in water requites an awareness of its reactivity, instabiUty, volatility, and the potential effect of interfering substances. To eliminate interferences, ozone sometimes is sparged out of solution by using an inert gas for analysis in the gas phase or on reabsorption in a clean solution. Historically, the most common analytical procedure has been the iodometric method in which gaseous ozone is absorbed by aqueous KI. 

Irregular grooving can occur, especially on copper alloys after acid cleaning. Tubes can be only partially filled with cleaning solution. Condensation and running of the fluid down the tube interior cuts tortuous channels (Fig. 7.9). 

For VOCs, control options are multiple. Source reduction or removal includes product substitution or reformulation. Particleboard or pressed w ood has been developed and used extensively in building materials for cabinet bases and subflooring and in furniture manufacturing for frames. If the product is not properly manufactured and cured prior to use as a building material, VOCs can outgas into the interior of the residence or building. Other sources of VOCs may be paints, cleaning solutions, fabrics, binders, and adhesives. Proper use of household products will lower volatile emissions. 

Cleaning solutions Tobacco smoke Air-conditioning systems Water treatment Humidifiers Disinfectants Exhaled breath Vehicle exhausts Smoking chimneys Portable heaters Tobacco smoke Gas cookers Gas and oil heaters... 

Application of the de minimis limitation to process streams must also be reviewed. Mixtures containing toxic chemicals can be added to a process or generated within a process. In both cases (assuming reporting thresholds are exceeded) a facility is required to consider and report releases from the process up to the point where the concentration of the chemical falls below the de minimis level. For example, a 10% solution of a listed chemical is mixed Into a formulated cleaning solution, resulting in a final concentration of less than 1%. Releases such as air emissions, from the mixing vessel must be counted, but releases from the finished formulation are not counted because the de minimis exemption applies... 

Figure 1. The wire is drawn through a cleaning solution bath, which removes the copper dust from the surface of the extruded wire. The wash liquor is slightly acidic and contains a detergent so that the wire surface is clean. From this point on the wire is spooled, and then sent to another part of the operation which manufactures multi-strand telecommunications cable.

Cleaning solutions normally use one or more of the following methods ... 

Rinsing Rinsing removes contaminants through dilution, physical attraction, and solubilization. Multiple rinses with clean solutions remove more contaminants than a single rinse with the same volume... 

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