Semiconductor die attachment

AppHcations for electroplated indium coatings include indium bump bonding for shicon semiconductor die attachment to packaging substrates and miscehaneous appHcations where the physical or chemical properties of indium metal are desired as a plated deposit. 

Ikble 3.16 Typical Properties of some film adhesives for semiconductor die attachment... 

Table 3.16. Properties of Film Adhesives for Semiconductor Die Attachment... 

Micro I (stand-alone) and n (in-line)/ GPD Global 18 X 18 (maximum) 1.83 Auger/28,000 Underfill, semiconductor die attach, and hybrid dispensing (heated) Underfill Ablebond 7737s, Amicon E1252, Hysol FP4459, Semiconductor die attach Ablebond 84-1 LMl SR4, Hysol KO 111, QMl 506, and QMl 505 MX, Hybrid Dispensing Ablebond 84-1 LMl, Ablebond 84-3, Epo-Tek H20-E. 

The use of polymer-based adhesives for semiconductor die attachment offers a number of advantages over the more traditional eutectic die bond approach. Polymeric die attach materials can be used at lower temperatures (150°C or less), have re-work capability and, because of their low moduli of elasticity, allow stress dissipation without damaging the die or the substrate. This latter factor has become particularly important in the last few years with the ever-increasing size of die. ... 

The acoustic microscopy s primary application to date has been for failure analysis in the multibillion-dollar microelectronics industry. The technique is especially sensitive to variations in the elastic properties of semiconductor materials, such as air gaps. SAM enables nondestructive internal inspection of plastic integrated-circuit (IC) packages, and, more recently, it has provided a tool for characterizing packaging processes such as die attachment and encapsulation. Even as ICs continue to shrink, their die size becomes larger because of added functionality in fact, devices measuring as much as 1 cm across are now common. And as die sizes increase, cracks and delaminations become more likely at the various interfaces. 

During die attach, an adhesive creates a mechanical interface between the die and substrate in a semiconductor assembly. A typical dispense pattern has intersecting lines with strategically placed dots so that after die placement, the fluid is evenly distributed (Figure 10-12). Most die attach adhesives also provide thermal and/or electrical conductivity between the die and substrate. 

Mechanically attach parts such as semiconductor die, components, substrates, packages, and heat sinks. 

Applications for silver-glass adhesives are primarily for the attachment of power semiconductor die, LEDs, and devices near the engine in automobiles. 

Flip chip and CSP underfills, die-attach adhesives for advanced electronics and semiconductor packaging... 

Bell GC, RoseU CM, Josline ST. Rheology of silver filled glass die attach adhesive for high speed automatic processing, Du Pont semiconductor materials. In Proc. 37th Electronic Components Conference May 11-13, 1987. 

Cam/alot 3700/ Speedline Technologies 14 X 14 2.0 Rotary pump standard, time/pressure available/ <25,000 Semiconductor, COB, die attachment Semiconductor and COB mounting Ablebond 84-1 LMI. 

XyFlex / Speedline Technologies 13 X 18 1.0 Rotary (auger) or multi-piston, four-head dispenser/ 140,000 (maximum) Surface mount, semiconductor, COB, die attach SMD adhesive Loctite Chipbonder 3615 (red) Semic[Pg.234]

XyFlexPro / Speedline Technologies (7100) 13 X 10 (7200) 19 X 22 1.0 Single-head dispenser/ 30,000-120,000 (application dependent) Semiconductor packaging or surface mount SMD adhesive Amic[Pg.234]

Comstock, R., Die Attach Epoxy s Role in Thin-Package Delamination, Semiconductor Inti. (Jul. 1993)... 

Bell, G. C., Resell, C. M., andJosline, S. T., Rheology of Silver Filled Glass Die Attach Adhesive for High Speed Automatic Processing, Du Pont Semiconductor Materials, Proc. 37 Electronic Components Conference (May 11-13,1987)... 

Bare semiconductor die may be mounted with epoxy, solder, or by direct eutectic bonding. The most common method of both active and passive component attachment is with epoxy, both conductive and nonconductive. This method offers anumber of advantages over other techniques, including ease of repair. 

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