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Loctite Chipbonder

Figure 2.1 Torque strength versus cure schedule for Loctite Chipbonder 3607 (strength measured on 1206 capacitors 22 °C per IPC SM-817). ... Figure 2.1 Torque strength versus cure schedule for Loctite Chipbonder 3607 (strength measured on 1206 capacitors 22 °C per IPC SM-817). ...
Cam/alot 1414/ Speedline Technologies 14 X 14 2.0 Rotary pump standard, time/pressure available/ <13,000 Surface mount, semic[Pg.232]

XyFlex / Speedline Technologies 13 X 18 1.0 Rotary (auger) or multi-piston, four-head dispenser/ 140,000 (maximum) Surface mount, semiconductor, COB, die attach SMD adhesive Loctite Chipbonder 3615 (red) Semic[Pg.234]

Champion 3000/ Creative Automation 18 X 18 1.5 True Volume Pump / 90,000 (maximum) Underfill, encapsulation. Dam Fill, conductive epoxy, SMA and solder paste SMT Adhesives Loctite Chipbonder 3615 (red), Dymax 9-20365 (red) and 20366 (yellow). [Pg.234]

MicroMax / GPD Global 12 X 12 2.25 True Value Pump/ servo-driven valve/36,000 SMT adhesive, conductive epoxies, no-flow underflll (unheated), hybrid assembly, small-dot dispensing SMT Adhesives Amicon D125F, 125FDR, Loctite Chipbonder 3615 (red), Dymax 9-20367 (red) and 9-20368 (yeUow), Amicon E7650, 7652, conductive epoxies Ablebond 84-1 LMl, no-flow underfill Amicon E1330 LV, 1350, and 1355. [Pg.235]

Technical Guide for Chipbonder Products. Henkel-Loctite, www.loctite.com/ electronics/smt viscosity.html Mar. 2002. [Pg.214]

Surface- mount adhesives DGEBA Resin (GY 6010, DER 331, Shell 828) 40-50% Amine epoxy adduct or polyamide (Versamide , Ancamide, Aradur , etc.) 20-30% Mineral filler and thixotrope 12-25% Amicon 125 D3, Amicon E 6752, Epo-Tek 70E-4 Chipbonder series (Loctite), Epi-bond 7275 (Vantico)... [Pg.140]

Chipbonder 3612/ Loctite Metal stencil-print applications for large-component bonding 800,000/10 350-700 Peaked 12.7-50.8 mm/sec (0.5-2 in/sec)... [Pg.218]

Chipbonder 3616/ Loctite High speed stencil printing adhesive compatible with DEK Proflow dispense system 32,000/NA 300-550 Rounded High-speed stencil printing up to 152.4 mm/sec (6 in/sec) squeegee pressure (4-6 N/cm)... [Pg.218]

Chipbonder 3617/ Loctite Stencil application for surface-mount devices requiring high speed and hi wet strengths 32,000/NA 300-550 Rounded 60-100 mm/sec (2.4-3.9 in/sec), snap-off [1 mm (39 mils)], squeegee pressure (4—6 N/cm)... [Pg.218]

Adhesives for jet dispensing must have relatively low viscosities of approximately 120,000 cps at 5 rpm, or 20,000-40,000 cps at 10 rpm, and fast recovery of thixotropic properties after dispensing (narrow hysteresis in viscosity loop) Examples of SMT adhesives that are jet dispensible are Loctite s Chipbonder 3621, Epoxy Technology s Epo-Tek H70E, and Emerson Cuming s Amicon E-1330J 1... [Pg.242]

Chipbonder 3621, Loctite Technical Data Sheet (Nov. 2001) Epo-Tek H70E, Revision 2, Epoxy Technology Data Sheet (Mar. 1998) Amicon E-1330LV, Technical Data Sheet, Emerson Cuming (Jun. 2000)... [Pg.259]

See other pages where Loctite Chipbonder is mentioned: [Pg.232]    [Pg.232]    [Pg.232]    [Pg.232]   
See also in sourсe #XX -- [ Pg.37 ]



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