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Resistivity devices

Such a resistance device is usually called an electrical heater but, since there is no means of measurement at the boundary between the resistance and the material in contact with it, it is easier to regard the resistance as being inside the system, i.e. a part of it. Energy enters the system in the fomi of work where the wire breaches the wall, i.e. enters the container. [Pg.327]

Focused Current Resistivity. Focused resistivity devices are particularly suited for wells where highly conductive drilling muds are used, where relatively high formation resitivities are encountered and where large resistivity contrasts are expected. [Pg.978]

The charts mentioned in the section titled Measuring While Tripping Wiper Logs can be used to estimate quantitatively the permeability if several measurements during tripping are made with resistivity devices that can give the invasion diameter. [Pg.1009]

The ability of S -nitrosothiols to mimic many of the biological properties of NO itself may emanate from in vivo decomposition to generate NO. This decomposition is catalysed by Cu2+,n and may be important in the development of thrombo-resistant devices used in kidney dialysis or coronary by-pass surgery.196 It is also possible that direct transfer of NO from RSNO occurs in biological systems.197... [Pg.252]

Molecular Rectifiers and Negative Differential Resistance Devices. 234... [Pg.218]

Heating is most often achieved using electrical resistive devices to heat a relatively massive metal block. This ensures that the temperature... [Pg.54]

Poten- Potential" Pofentiometer - a high-resistance device for measuring potential A potentiometiic titration is a titration in which the end point is indicated by following the potential... [Pg.8]

The properties of the wide band-gap semiconductor SiC have been extensively studied by HFEPR because knowledge of the defect states is needed for its application in high power and radiation resistant devices. (The main method of doping SiC is by ion implantation that inevitably also introduces defects into the lattice.) The primary defects that can be produced are vacancies, interstitials and anti-sites. In contrast to silicon the primary defects in SiC seem to be stable at and even far above room temperature. [Pg.340]

Another type of high temperature solid state O2 sensor that has been developed is based on the principle of electrochemical pumping of oxygen with Zr02 electrolytes. These sensors have higher sensitivity (generally, a first power dependence on Pq) than the Nernst cell and the resistive device and possess a number of other characteristics that make them very promising for many new applications. [Pg.137]

Nernst cell or the resistive device. Of course the minimum detectable O2 concentration or difference in concentration depends on device design or signal processing electronics. [Pg.141]

With large holes (16 to 25 mm), these trays are some of the most fouling-resistant and corrosion-resistant devices in the industry. This defines their main application highly fouling services, slurries, and corrosive services. Dual-flow trays are also the least expensive and easiest to install and maintain. [Pg.34]

Figure 3.1 Polyphosphazene elastomers of general formula, [NP(OCH2CF3) (OCH2(CF2), CF2H)]b, fabricated into fuel lines, O-rings, gaskets, and other hydrocarbon-resistant devices. Reproduced by permission of the Firestone Tire and Rubber Company, and Ethyl Corporation. Figure 3.1 Polyphosphazene elastomers of general formula, [NP(OCH2CF3) (OCH2(CF2), CF2H)]b, fabricated into fuel lines, O-rings, gaskets, and other hydrocarbon-resistant devices. Reproduced by permission of the Firestone Tire and Rubber Company, and Ethyl Corporation.
The catalyst was introduced as a suspension into the ready-made reactor. Resistance devices for temperature sensing and a meander for heating, both made of platinum, were incorporated into the reactor, which had overall dimensions of 40 x 40 x 3 mm. A pressure drop of approximately 1.6 bar was calculated for the whole reactor at the design point. [Pg.293]

Carachteristographers are d.c. instruments made up by a current (voltage) power supply and a voltage (current) meter. They give a two quadrant V-I relation for the resistive device. The information supplied by such instruments is more exhaustive than that supplied by a.c. bridges, but the measurement is time consuming, and an inversion of polarity is necessary to detect the possible presence of partially rectifying contacts. In Fig. 9.8, an example of a V-I relation in the first quadrant for a Ge-NTD 12 resistor (see Section 15.2.1.1) is shown. Note that the power used in the measurements can be as low as 10-14W. [Pg.209]

One of the major markets for wide band-gap materials is in electronics. Specifically, they are suitable for and have been used for heat sinks (diamond), short wavelength optoelectronic devices (GaP, GaN, SiC), high-temperature electronics (SiC, GaN), radiation resistant devices, and high-power/high-frequency electronic devices (diamond, GaN, SiC). " Recent research showed that Mn-doped GaN can be used for spintro-nic applications.f" Atomically flat technology developed by NASA for SiC and GaN WBG material can introduce a new dimension of application for WBG materials. [Pg.3234]

Equal contact resistances Device 2 has a lower channel resistance (by lOX)... [Pg.146]

Equal channel resistances Device 4 has a lower contact resistance (by 2X)... [Pg.146]

Gamma-radiation resistant devices intravenous devices, trocars dialysis tubes transparent, gamma radiation stable, low melt viscosity... [Pg.968]

Pearce,R.,Yakimova, R.,Eriksson, J,Hultman, L., Andersson,M. and Lloyd Spetz,A. (2012), Development of FETs and resistive devices based on epitaxially grown... [Pg.155]

Another example of sintered resistive device is reported by Jiao et al. (2002), who mixed BaCOj andliOj and heated the mixture up to 1300°C to obtain the powder of BaliOj, which was then thoroughly mixed with CuO. The mixture was made into pellets and sintered in air. [Pg.522]

An alternative approach is to accept whatever rate of feed reaches the compacting screw and press this against a constant resistance to produce a controllable compacting force. This is done by a form of plug seal screw, either with a fixed form of construction, or with the provision of a variable resistance device to increase or decrease the compacting force. Linking the discharge resistance to the drive unit allows the compaction force to be optimized to the drive capacity. [Pg.149]

Uses Semiconductor in light-emitting diodes for telephone dials, injection lasers, solar cells, magneto-resistance devices, thermistors, microwave generation Regulatory SARA 313 reportable Manuf./Distrib. Aldrich http //www.sigma-aldrich.com, Alfa Aesar http //www.aifa.com-. [Pg.1864]


See other pages where Resistivity devices is mentioned: [Pg.173]    [Pg.224]    [Pg.234]    [Pg.151]    [Pg.245]    [Pg.31]    [Pg.275]    [Pg.38]    [Pg.195]    [Pg.195]    [Pg.343]    [Pg.863]    [Pg.703]    [Pg.546]    [Pg.419]    [Pg.112]    [Pg.92]    [Pg.300]    [Pg.161]    [Pg.508]    [Pg.412]    [Pg.1069]    [Pg.165]    [Pg.23]   
See also in sourсe #XX -- [ Pg.21 ]




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