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Resist processing development

Electrically Conducting Fibers. FlectricaHy conducting fibers are useful in blends with fibers of other types to achieve antistatic properties in apparel fabrics and carpets. The process developed by Nippon Sanmo Dyeing Co., for example, is reportedly used by Asahi in Casbmilon 2.2 dtex (2 den) staple fibers. Courtaulds claims a flame-resistant electrically conductive fiber produced by reaction with guanadine and treatment with copper sulfide (97). [Pg.285]

Flame-Retardant Treatments For Wool. Although wool is regarded as a naturally flame-resistant fiber, for certain appHcations, such as use in aircraft, it is necessary to meet more stringent requirements. The Zirpro process, developed for this purpose (122,123), is based on the exhaustion of negatively charged zirconium and titanium complexes on wool fiber under acidic conditions. Specific agents used for this purpose are potassium hexafluoro zirconate [16923-95-8] [16923-95-8] K ZrF, and potassium hexafluoro titanate [16919-27-0], K TiF. Various modifications of this process have been... [Pg.490]

Shrink-resistance processes compatible with Zirpro-treated wool have also been developed (166). [Pg.353]

Recently, nonionic acid precursors based on nitrobenzyl ester photochemistry have been developed for chemically amplified resist processes (78-80). These ester based materials (Figure 8) exhibit a number of advantages over the onium salt systems. Specifically, the esters are easily synthesized, are soluble in a variety organic solvents, are nonionic in character, and contain no potential device contaminants such as arsenic or antimony. In addition, their absorption characteristics are well suited for deep-UV exposure. [Pg.13]

Figure 44. A schematic representation of the plasma developed x-ray resist process. Exposure serves to covalenty bind the monomer (m) into the polymer matrix (p). Heating (fixing) drives out (volatilizes) the monomer except where it is "locked in place" by exposure. Plasma treatment converts the silicon to Si02 which retards the etch rate in the exposed areas through formation of a metallic oxide (MO) layer. Figure 44. A schematic representation of the plasma developed x-ray resist process. Exposure serves to covalenty bind the monomer (m) into the polymer matrix (p). Heating (fixing) drives out (volatilizes) the monomer except where it is "locked in place" by exposure. Plasma treatment converts the silicon to Si02 which retards the etch rate in the exposed areas through formation of a metallic oxide (MO) layer.
Starch-plastic composites contain a mixture of two very different types of materials (/) hydrophobic, petrochemical-derived polymers (PE, EAA) known to be highly resistant to degradation by living organisms, and (i7) a hydrophilic, natural polymer (starch) that is easily broken down by a wide array of organisms. In the process developed by Otey (3), these fundamentally incompatible materials are forced into an intimate mixture during production of the plastic film. Since... [Pg.69]

We are currently involved in a three phase developmental program to extend the process to other hydrogen containing streams. The program involves screening candidate streams to identify poisonous species for the metal hydrides, developing poison resistant processes for each stream, and demonstrating the process(es) on a pilot scale to establish process economics. [Pg.241]

Granodixing Process, developed by the American Chemical Paint Co, Waterbury, Conn for rust prevention of iron, steel, zinc or cadmium consists in immersing the material in a hot soln of acid zinc phosphate. This operation forms an acid resistant coating. The resulting material may be painted... [Pg.766]

In 1987, the US National Institutes of Health reviewed existing worldwide data on the prevalence of antibiotic resistance (51). They concluded that resistance to antibiotics was not solely a function of usage, but might result from the inevitable process of bacterial evolution. Other phenomena, including increased human resistance to antibiotics never used in animals and the prevalence of antibiotic resistance in developing countries where use of animal antibiotics is uncommon, led the experts to support that human antibiotic resistance should primarily be due to a variety of factors other than animal antibiotics. [Pg.265]

The clinical usefulness of cis-Pt is often limited by the development of resistance. The development of resistance to cis-Pt has been explained by several factors, including reduced drug accumulation, increased DNA repair processes, and an increase in the amount of inactivation proteins. In most cis-Pt-resistant tumors probably a combination of such factors plays a role. In this section, only an increase in cellular thiols in relation to resistance will be discussed. Such inactivation processes have already been discussed (Section IV,B), but attention will be directed now to the mechanism of resistance. These mechanisms are probably also of importance for the inactivation of cis-Pt in nonre-sistant tumors, though to a lesser extent. [Pg.192]

What is accomplished by adhesion promotion treatments in IC manufacturing should actually be referred to as wafer substrate preparation, and not adhesion. Adhesion in the structural sense, as experienced in airplane composite material parts attachment, is not accomplished by silane wafer processing treatments except for the PI applications discussed early in this paper. The term adhesion, as it is used here, refers to a more practical definition—that is, resist image adhesion. Nevertheless, this type of adhesion is essential to the huge international semiconductor business, and the early silane work of Plueddemann and others was essential to early wafer adhesion process development. [Pg.459]


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Model resist development process

Plasma-developed resist process

Process development resist

Process development resist

Resist development

Resist processes

Resist processing

Resistance development

Resistive process

Water-Processable Resists (Casting and Development)

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