Rework and repair

The standard requires the supplier to re-inspect repaired and reworked product in accordance with the quality plan and/or documented procedures. 

How do you ensure that repairs and reworked product is re-inspected in accordance with documented procedures ... 

Repaired and reworked products are reinspected in accordance with the [quality plan]. 

Repaired and reworked product is reinspected in accordance with documented procedures. 

There are several advantages associated with the laser welding of garments. The external texture and appearance of the fabric is retained, strong air and waterproof seams can be made efficiently, production is fast and almost fume free, and the colour of the parent materials is unaffected by welding. The process is also amenable to automation, and multiple layers can be welded in one pass. On the downside, some fabrics need to be precoated with absorber, production usually requires investment in new equipment, and repair and rework can be difficult. 

It is necessary to clearly define the terms repair and rework ... 

The second issue is that of mixing Pb-free and Sn-Pb solder. This situation would be less likely to occur with newly fabricated product, when repair and rework procedures are performed immediately after assembly inspection. The same solder would be used for both processes. Rather, the concern arises particularly with regard to the rework of legacy products that are returned from service. Older, field-return electronics were most likely assembled with a Sn-Pb solder. In those cases where Pb-free rework procedures are in full use, there is the likelihood of intermixing Sn-Pb and Pb-free solders in the interconnections. In terms of the rework process itself, the poorer solderability of Pb-free solders will be improved by Sn-Pb residues remaining on the circuit board pads. (The I/O finish of the replacement component wUl likely be Pb-free, unless the component was in storage as a life-of-program-buy [LoPB] for that system. Then, the Sn-Pb finish on the I/O will also improve Pb-free solderability.)... 

Repair and rework procedures differ between through-hole-mount and surface-mount interconnections. That difference is due to the size and geometries of the interconnections, the munber of I/Os on the packages, the thermal sensitivity of the components, and the overall density of the printed wiring assemblies. The following subsections describe these factors for the two technologies. 

To devise repair and rework procedures with novel lead-free, flux-cored wire. 

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