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Powder electronic

Divalent metal chromium(III) oxides produced by a double-decomposition reaction between LiCr02 and a molten metal(II) salt are fine powders. Electron microscopic examination shows that these powders are constituted of grains, the repartition size of which is heterogeneous (500-3000 A), but each grain is made of smaller crystallites. The average diameter of the crystallites, determined by a radiocrystallographical method (measurement of the widening of X-rays 220 and 335), is about 250 A. [Pg.53]

A Li-S battery comprises a positive electrode of elementary sulfur (Sg), an organic liquid electrolyte and a negative electrode of metal lithiiun. More specifically, the positive electrode is usually composite, i.e. prepared using elementary sulfur and non-electroactive adjuvants. A finely powdered electronic conductor (carbon black or acetylene black) is used to improve the... [Pg.264]

All synthetic M-SHs are obtained as fine white powders. Electron microscopic images (Fig. 10) show the typical cauliflower" morphology of magadiite and... [Pg.560]

Powder diffraction studies with neutrons are perfonned both at nuclear reactors and at spallation sources. In both cases a cylindrical sample is observed by multiple detectors or, in some cases, by a curved, position-sensitive detector. In a powder diffractometer at a reactor, collimators and detectors at many different 20 angles are scaimed over small angular ranges to fill in the pattern. At a spallation source, pulses of neutrons of different wavelengdis strike the sample at different times and detectors at different angles see the entire powder pattern, also at different times. These slightly displaced patterns are then time focused , either by electronic hardware or by software in the subsequent data analysis. [Pg.1382]

Figure C2.11.2. A scanning electron micrograph showing individual particles in a poly crystalline alumina powder. Figure C2.11.2. A scanning electron micrograph showing individual particles in a poly crystalline alumina powder.
One of the most important uses of specific surface determination is for the estimation of the particles size of finely divided solids the inverse relationship between these two properties has already been dealt with at some length. The adsorption method is particularly relevant to powders having particle sizes below about 1 pm, where methods based on the optical microscope are inapplicable. If, as is usually the case, the powder has a raiige of particle sizes, the specific surface will lead to a mean particle size directly, whereas in any microscopic method, whether optical or electron-optical, a large number of particles, constituting a representative sample, would have to be examined and the mean size then calculated. [Pg.37]

ADVANCEDCERAMICS - ELECTRONIC CERAMCS] (Vol 1) Electronic ceramic powders... [Pg.357]

Fig. 4. Scanning electron micrograph of 5-p.m diameter Zn powder. Neck formation from localized melting is caused by high-velocity interparticle coUisions. Similar micrographs and elemental composition maps (by Auger electron spectroscopy) of mixed metal coUisions have also been made. Fig. 4. Scanning electron micrograph of 5-p.m diameter Zn powder. Neck formation from localized melting is caused by high-velocity interparticle coUisions. Similar micrographs and elemental composition maps (by Auger electron spectroscopy) of mixed metal coUisions have also been made.
Fig. 10. Scanning electron micrograph of amorphous nanostmctured iron powder produced from the ultrasonic irradiation of Fe(CO). ... Fig. 10. Scanning electron micrograph of amorphous nanostmctured iron powder produced from the ultrasonic irradiation of Fe(CO). ...
Fabrication technologies for ah electronic ceramic materials have the same basic process steps, regardless of the appHcation powder preparation, powder processing, green forming, and densiftcation. [Pg.310]

Powder Preparation. The goal in powder preparation is to achieve a ceramic powder which yields a product satisfying specified performance standards. Examples of the most important powder preparation methods for electronic ceramics include mixing/calcination, coprecipitation from solvents, hydrothermal processing, and metal organic decomposition. The trend in powder synthesis is toward powders having particle sizes less than 1 p.m and Httie or no hard agglomerates for enhanced reactivity and uniformity. Examples of the four basic methods are presented in Table 2 for the preparation of BaTiO powder. Reviews of these synthesis techniques can be found in the Hterature (2,5). [Pg.310]

Table 2. Methods Used to Prepare BaTiO Electronic Ceramic Powders... Table 2. Methods Used to Prepare BaTiO Electronic Ceramic Powders...
Electrical Applications. The largest application of PTFE is for hookup and hookup-type wire used in electronic equipment in the military and aerospace industries. Coaxial cables, the second largest appHcation, use tapes made from fine powder resins and some from granular resin. Interconnecting wire appHcations include airframes. Other electrical appHcations include computer wire, electrical tape, electrical components, and spaghetti tubing. [Pg.355]

Electrically conductive mbber (13) can be achieved by incorporation of conductive fillers, eg, use of carbon or metal powders. These mbbers exhibit volume resistivities as low as lO " H-cm. Apphcations include use in dissipation of static charge and in conductive bridging between dissimilar electronic materials under harsh operating conditions. [Pg.401]

Small, complex-shaped glass articles such as thread guides for the textile industry and television gun mounts for the electronics industry are made by the multiform process. The dry-milled powder is mixed with an inorganic binder and a fluid vehicle, and then atomi2ed by a spray dryer into small, dried agglomerates of glass powder and binder with good flow characteristics. They are subsequently pressed to the desired shape and fired. [Pg.310]

Polyimides (PI) were among the eadiest candidates in the field of thermally stable polymers. In addition to high temperature property retention, these materials also exhibit chemical resistance and relative ease of synthesis and use. This has led to numerous innovations in the chemistry of synthesis and cure mechanisms, stmcture variations, and ultimately products and appHcations. Polyimides (qv) are available as films, fibers, enamels or varnishes, adhesives, matrix resins for composites, and mol ding powders. They are used in numerous commercial and military aircraft as stmctural composites, eg, over a ton of polyimide film is presently used on the NASA shuttle orbiter. Work continues on these materials, including the more recent electronic apphcations. [Pg.530]

Titanium hydride is used as a source for Ti powder, alloys, and coatings as a getter in vacuum systems and electronic tubes as a sealer of metals and as a hydrogen source. [Pg.300]

The most significant commercial product is barium titanate, BaTiO, used to produce the ceramic capacitors found in almost all electronic products. As electronic circuitry has been rniniaturized, demand has increased for capacitors that can store a high amount of charge in a relatively small volume. This demand led to the development of highly efficient multilayer ceramic capacitors. In these devices, several layers of ceramic, from 25—50 ]lni in thickness, are separated by even thinner layers of electrode metal. Each layer must be dense, free of pin-holes and flaws, and ideally consist of several uniform grains of fired ceramic. Manufacturers are trying to reduce the layer thickness to 10—12 ]lni. Conventionally prepared ceramic powders cannot meet the rigorous demands of these appHcations, therefore an emphasis has been placed on production of advanced powders by hydrothermal synthesis and other methods. [Pg.500]


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Auger electron spectroscopy powder surfaces

Electron carbon powder

Electron powder spectra

Electron spin resonance powder pattern

Electron-hole separation, metallized semiconductor powder

Electronics powder particle size

Powder electronic drying

Powder spectra, electron spin resonance

Role of electron powder diffraction in solving structures

Semiconductor powder metallized, electron-hole

Tego Magnan powder scanning electron micrographs

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