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Poly thermal conductivity

CeUular polymers are also used for pipe and vessel insulation. Spray and pour-in-place techniques of appHcation are particularly suitable, and polyurethane and epoxy foams are widely used. Ease of appHcation, fire properties, and low thermal conductivity have been responsible for the acceptance of ceUular mbber and ceUular poly(vinyl chloride) as insulation for smaller pipes. [Pg.416]

Polymer-based microreactor systems [e.g., made of poly(dimethyl-siloxane) (PDMS)], with inner volumes in the nanoliter to microliter range (Hansen et al. 2006), are relatively inexpensive and easy to produce. Many solvents used for organic transformations are not compatible with the polymers that show limited mechanical stability and low thermal conductivity. Thus the application of these reactors is mostly restricted to aqueous chemistry at atmospheric pressure and temperatures for biochemical applications (Hansen et al. 2006 Wang et al. 2006 Duan et al. 2006). [Pg.7]

Solid-state (topochemical) polymerization of cyclic disulfur dinitride to poly(sulfur nitride) (or polythiazyl), -fSN, occurs on standing at ambient temperature or higher [Banister and Gorrell, 1998 Labes et al., 1979 Ray, 1978]. Disulfur dinitride is obtained by sublimation of tetrasulfur tetranitride. Polythiazyl is a potentially useful material, since it behaves like a metal. It has an electrical conductivity at room temperature about the same order of magnitude as a metal like mercury and is a superconductor at 0.3°C. Polythiazyl also has high light reflectivity and good thermal conductivity. However, it is insoluble and infusible, which prevents its practical utilization. [Pg.600]

FIG. 17.2 Generalized curve for the thermal conductivity of amorphous polymers. ( ) silicon rubberr (A) polyisobutylene (O) natural rubber (0) polypropylene (A) poly(trifluoro chloro ethylene) ( ) poly (ethylene terephthalate) (V) poly(vinyl chloride) ( ) poly(methyl methacrylate) ( ) poly(bisphenol carbonate) ( ) poly(vinyl carbazole) lines are drawn according to Eq. (17.9). [Pg.648]

Cellular polymers, especially polystyrene and polyurethane, are also widely used for pipe and vessel insulation. The use of cellular rubber and cellular poly(vinyl chloride) in insulation for small pipes is attributed to their ease of application, combustion properties, and low thermal conductivity. [Pg.223]

We have studied a variety of transport properties of several series of 0/W microemulsions containing the nonionic surfactant Tween 60 (ATLAS tradename) and n-pentanol as cosurfactant. Measurements include dielectric relaxation (from 1 MHz to 15.4 GHz), electrical conductivity in the presence of added electrolyte, thermal conductivity, and water self-diffusion coefficient (using pulsed NMR techniques). In addition, similar transport measurements have been performed on concentrated aqueous solutions of poly(ethylene oxide)... [Pg.275]

Before obtaining the experimental results for the proposed covalidation effort, two prior steps were required, namely, the design and fabrication of the microchannels, and the assembly of an experimental platform that would allow for the easy exchange of different microchannel setups. A PMMA poly-methyl methacrylate prism of low thermal conductivity was employed as the structural support of the metallic plates that form the microchannels, chosen to be made of electronic grade copper (upper plate) and brass (lower plate). Micro-machining of the PMMA block and of the metallic plates was accomplished and the setup was assembled according to Fig. 2 below. [Pg.70]

Thermal Stability and Conductivity. Thermal degradation temperature of PMMA, PS, and PVA (poly(vinyl alcohol)) nanocomposites shifts up by 10-100°C. During combustion [179], nanoparticles form a network of char layers that retards the transport of decomposition products. The thermal conductivity of epoxy composites is four times higher than that of the neat epoxy resin with 5 wt% loads. [Pg.599]

Physical and thermal properties for Nylon 6,6 poly (hexamethylene adipamide) Epoxies have excellent electrical and thermal resistance. They are thermosets. Addition of fillers improves hardness, impact resistance and thermal conductivity. [Pg.238]

Figure 10-30. Thermal conductivity k of natural rubber (NR), poly(oxyethylene) (PEOX), and poly (ethylene) (PE) of various densities as a function of temperature. Tg is the glass transition temperature, Tm is the melting temperature. (From data of various authors in the compilation of W. Knappe.)... Figure 10-30. Thermal conductivity k of natural rubber (NR), poly(oxyethylene) (PEOX), and poly (ethylene) (PE) of various densities as a function of temperature. Tg is the glass transition temperature, Tm is the melting temperature. (From data of various authors in the compilation of W. Knappe.)...

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See also in sourсe #XX -- [ Pg.672 ]




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