Plasma polymerization coating deposition mechanism

The sputter coating of polymers (misrepresentation of the real phenomenon) is another important demonstration of how important the CAP mechanism is not only in plasma polymerization but also in other plasma processes. Thus, inadvertent plasma polymerization can take place in an attempted etching process conversely, etching can occur in an elfort to deposit a polymer by plasma polymerization. Therefore, a thorough understanding of the CAP principle seems to be important for the successful operation of any plasma process. 

These notches can be reduced by decreasing the volume of the material or by healing effects. The three monomers used for the plasma polymerization process lead to higher values of 0 and 6 for coated Hercules and Grafil fibres, because of healing mechanism during the plasma polymerization. and E also increase with deposition time ranging from 1 to 12 minutes. 

Polymeric resists are usually deposited on the substrates by spin coating, followed by baking in order to eliminate the residual solvent and to suppress mechanical stress. Some attempts have been made to deposit polymeric films by the plasma deposition technique [5]. 

---