Planar technology, discussion

Hopefully, the work discussed within will help to ensure that the next 10 years of planarization technology development will be as fascinating, interesting, and useful as the first 20 have been. 

We now give a few examples of miniaturised mass spectrometer systems, restricting the discussion to cases where planar technology has clearly been employed. 

The goal of this chapter will be to provide an overview of the use of planar, optically resonant nanophotonic devices for biomolecular detection. Nanophotonics23 24 represents the fusion of nanotechnology with optics and thus it is proposed that sensors based on this technology can combine the advantages of each as discussed above. Although many of the issues are the same, we focus here on optical resonance rather than plasmonic resonance (such as is used in emerging local SPR and surface-enhanced Raman spectroscopy-based biosensors). 

Chapters 1 and 2 introduce the CMP process and historical motivations. The present status of CMP is discussed in Chapter 2, which focuses on establishing the need of advanced metallization schemes and planarization. There are a large number of variables that control the process these are discussed in Chapter 3. Chapter 4 presents the science of CMP— mechanical and chemical concepts important in understanding the CMP fundamentals. The CMP of the Si02 films, the most commonly used insulator interlayer dielectric, is discussed in Chapter 5. Chapters 6 and 7 cover the CMP of the two most studied metals, W and Cu, respectively. Chapter 8 examines the applicability of CMP to new materials, e.g., Al, polymers, and Si3N4 photoresists. Finally, Chapter 9 covers post-CMP cleaning science and technology. 

Plasmonic nanostructures that are materials consisting of noble metal nanoparticles with sizes of 1-100 nm are known as specific substrates for surface enhanced Raman scattering and luminescence enhancement [1-4]. These effects are stimulated by the localized surface plasmon absorption (LSPA) and may be controlled by the change of metal nanoparticle sizes, their concentration and a substrate choice [5]. New opportunities for surface-enhanced effect realization and optimization are now discussed in connection with bimetallic nanostructures [6]. At the technological aspect one of the simplest types of a binary nanostructure is a stratified system made of two different monolayers, each is consisted of definite metal nanoparticles. The LSPA properties of these binary close-packed planar nanostructures are the subject of the paper. 

This chapter presents an overview of performance plastic polymers in commercial planar and 3-dimensional circuit board products, and describes in detail one approach (two-shot molding) developed as an integrated 3-D circuit manufacturing technology. The distinctions between conventional planar (2-dimensional) circuitry, based on thermoset laminates and "subtractive etching processes, and the enhanced design flexibility afforded by expanded interconnection capacity in three axes are discussed. Specific examples of 3-dimensional interconnect protoypes and products are described and pictured. 

In the survey of modularity reported in Chapter 1 of [2], a general description of the modular interpretation of crystal structures has been extensively discussed. In this chapter we consider only planar modules, and the examples are devoted to show the polysomatic, merotype and plesiotype aspects (see below) of some series that are important either methodologically or for their technological and mineralogical relevance. The possibility of exploiting the modularity to model unknown crystal structures is illustrated with some examples. 

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