Particle board with wood

Particle board and wood chip products have evolved from efforts to make profitable use of the large volumes of sawdust generated aimually. These products are used for floor undedayment and decorative laminates. Most particle board had been produced with urea—formaldehyde adhesive for interior use resin demand per board is high due to the high surface area requiring bonding. Nevertheless, substantial quantities of phenol—formaldehyde-bonded particle board are produced for water-resistant and low formaldehyde appHcations. 

Philippou also experimented with wood particles preoxidized with nitrogen oxide-oxygen by using furfuryl alcohol acid polymer as cross-linking agent and maleic acid as catalyst. He obtained particle board with IB values of 43-159 psi and 9-20% swelling in a 2-h boil test at 0.70-0.77 g/cm densities and 7.5% resin usage 84, 86). The procedure does not differ much in principle from the one where furfuryl alcohol monomer was used. 

Vapors emitted from the materials of closed storage and exhibit cases have been a frequent source of pollution problems. Oak wood, which in the past was often used for the constmction of such cases, emits a significant amount of organic acid vapors, including formic and acetic acids, which have caused corrosion of metal objects, as well as shell and mineral specimens in natural history collections. Plywood and particle board, especially those with a urea—formaldehyde adhesive, similarly often emit appreciable amounts of corrosive vapors. Sealing of these materials has proven to be not sufficiently rehable to prevent the problem, and generally thek use for these purposes is not considered acceptable practice. 

Waferboard, a more recent wood constmction product, competes more with plywood than particle board. Waferboard and strand board are bonded with soHd, rather than Hquid, phenoHc resins. Both pulverized and spray-dried, rapid-curing resins have been successfully appHed. Wafers are dried, dusted with powdered resin and wax, and formed on a caul plate. A top caul plate is added and the wafers are bonded in a press at ca 180°C for 5—10 min. Physical properties such as flexural strength, modulus, and internal bond are similar to those of a plywood of equivalent thickness. 

Wood (qv) is arguably the oldest building material used by humans to constmct their dweUings. It is a natural product obtained from trees, used in both stmctural and decorative appHcations. The chemical composition of wood is largely cellulose (qv) and lignin (qv). Today there are a variety of composite or reconstituted wood products, such as plywood, particle board, wood fiber boards, and laminated stmctural beams, where small pieces of wood or wood fiber are combined with adhesives to make larger sheets or boards (see Laminates). 

Amino Resins. Amino resins (qv) include both urea- and melamine—formaldehyde condensation products. They are thermosets prepared similarly by the reaction of the amino groups in urea [57-13-6] or melamine [108-78-1] with formaldehyde to form the corresponding methylol derivatives, which are soluble in water or ethanol. To form plywood, particle board, and other wood products for adhesive or bonding purposes, a Hquid resin is mixed with some acid catalyst and sprayed on the boards or granules, then cured and cross-linked under heat and pressure. 

Phenolic Resins. PhenoHc resins [9003-35 ] (qv) are thermosets prepared by the reaction of phenol with formaldehyde, through either the base-cataly2ed one-stage or the acid-cataly2ed two-stage process. The Hquid intermediate may be used as an adhesive and bonding resin for plywood, particle board, ftberboard, insulation, and cores for laminates. The physical properties for typical phenoHc laminates made with wood are Hsted in Table 1. 

Plastic laminated sheets produced in 1913 led to the formation of the Formica Products Company and the commercial introduction, in 1931, of decorative laminates consisting of a urea—formaldehyde surface on an unrefined (kraft) paper core impregnated with phenoHc resin and compressed and heated between poHshed steel platens (8,10). The decorative surface laminates are usually about 1.6 mm thick and bonded to wood (a natural composite), plywood (another laminate), or particle board (a particulate composite). Since 1937, the surface layer of most decorative laminates has been fabricated with melamine—formaldehyde, which can be prepared with mineral fiUers, thus offering improved heat and moisture resistance and allowing a wide range of decorative effects (10,11). 

Milled wood lignin was mixed with the crude enzyme solution of Tram-ties versicolor extracellular phenoloxidases produced on spent sulfite liquor in a ratio of approximately 2 1. This comprised the main part of the two-component bio-adhesive. Industrial particles were bonded with 15% bioadhesive under conventional pressing conditions to have 19 mm particle boards (40 x 50 cm) of the properties described in Table IV. The bonding reaction (crosslinking) took place in aqueous solution at room temperature. If conventional pressing technology is applied, the temperature should be elevated in order to maintain water evaporation within a reasonable press time. 

Due to their low dehydration temperatures and water solubilities, boric acid and sodium borates (borax pentahydrate and borax decahydrate) are mostly used as fire retardants in wood/cellulosic products such as timbers, plywood, particle board, wood fiber, paper products, and cotton products. In recent years, boric acid has also been used as fire retardant in epoxy intumescent coating, pheno-lics, urethane foam, and so on. When necessary, boric acid can be coated with silicone oil such as silicone to alleviate its water solubility in water-based coating. 

Wood Composites—these are resin-bonded composite boards where the particles are wood shavings, flakes, chips, or fibers bonded with thermosetting adhesives that can be urea formaldehyde, melamine formaldehyde, phenol formaldehyde, or diisocyanate. In recent years, the markets for OSB and MDF board have been rapidly increasing. Most particle board production uses urea-formaldehyde as a binder that is acid setting. Hence, sodium borates (alkaline) can interfere with the setting. As a result, boric acid has been the major boron compound used as the flame retardant in particle board.28 29 Typically, a loading of 12%-15% of boric acid in MDF is required to meet the ASTM E-84 Class A rating. If sodium borate is used as a flame retardant, phenol-formaldehyde binder, that is compatible with alkaline chemicals, is commonly used. 

Plywood and particle board are often glued with cheap, waterproof urea-formaldehyde resins. Two to three moles of formaldehyde are mixed with one mole of urea and a little ammonia as a basic catalyst. The reaction is allowed to proceed until the mixture becomes sympy, then it is applied to the wood surface. The wood surfaces are held together under heat and pressure, while polymerization continues and cross-linking takes place. Propose a mechanism for the base-catalyzed condensation of urea with formaldehyde to give a linear polymer, then show how further condensation leads to cross-linking. (Hint The carbonyl group lends acidity to the N—H protons of urea. A first condensation with formaldehyde leads to an inline, which is weakly electrophilic and reacts with another deprotonated urea.)... 

Two standard combustible materials may be used in this test. One is cellulose C, manufactured by The TOYO Filtratio Paper Co., Ltd. of particle size under 300 mesh and apparent specific gravity of 0.28 g/cm 3. The second is sawdust of 9-20 mesh in particle size with an apparennt specific gravity of 0.099 - 0.124 g/cm 1 and crushed wood for pets, made under the tradename "Woodshavings" by Japan Kurea. The sawdust is made from boiled fish paste and the board from American cedar trees. The reference sample is a fine sawdust for explosives with a particle size of 32- 50 mesh and apparent specific gravity of 0.175g/cm manufactured by Sanshin Industy Co., Ltd. 

Currently, existing pilot plants in Canada, Netherlands, UK utilize mainly well defined non contaminated biomass fractions such as wood particles, saw dust, and bark. The performed investigations in this work should broaden the knowledge of the pyrolytic behaviour of various industrial biomass waste. This wilt facilitate the introduction of flash pyrolysis processes into existing industrial processes. Therefore, a new way of biomass exploitation will be demonstrated. In cooperation with several companies different biomass waste such as cocoa shell, wood waste, fibre sludge and panel boards with a high content of phenol-foimaldehyde resin were decomposed by flash pyrolysis into smaller molecules to use them for the production of energy and/or chemicals. 

Furthermore, representative samples from a waste wood collection site (Otto Ddmer, Hamburg) were subjected to fest pyrolysis and analysis. Two classes, H2 and H3, were selected. H2 contains typically particle boards and window frames, H3 consists of railway sleepers, fences, cable dnuns, and other materials impregnated with organic chemicals. 

In a study concerned with the decay resistance provided by isocyanate bonding to wood, the distribution of the methyl isocyanate reaction in southern pine showed that 60% of the lignin hydroxyls and 12% of the holocellulose hydroxyls are substituted at the point where resistance to biological attack occurs. Therefore, it can be surmised that the chemical bonding of wood by isocyanates through the urethane link can contribute significantly to the excellent performance of diphenylmethane-diisocyanate X or polymeric isocyanates XI as adhesive binder in particle boards (24, 25). 

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