Package temperature, measurement

The above discussion is presented merely to give an idea of the types of EUV detectors and their applications in use on present fusion plasma experiments. It is by no means an exhaustive list of possibilities. Indeed, several different detectors are in use or being planned in future experiments. Resistive anode encoders will probably see more use in fusion experiments as they become commercially available. However, the low count rates available ( 10 to 10 sec-1) will result in these detectors being used mostly for line profile studies (e.g., ion temperature measurements via Doppler broadening measurements). Intensified CCD arrays (back-illuminated or otherwise), vidicon or CID systems, lens-coupled intensifiers, and anode detectors have all seen some use on tokamak experiments or are planned for the near future, but have not been widely used as yet. However, in terms of availability, pixel format, dynamic range, insensitivity to magnetic fields, compact package, and moderate cost, the IPDA remains the most versatile multichannel EUV detector for plasma spectroscopy. 

Practical tests may be used to determine the internal and external temperatures of the package under normal conditions by simulating the heat source due to radioactive decay of the contents with electrical heaters. In this way, the heat source can be controlled and measured. Such tests should be performed in a uniform and steady thermal environment (i.e. fairly constant ambient tanperature, stiU air and minimum heat input from external sources such as sunlight). The package with its heat source should be held under test for sufficient time to allow the temperatures of interest to reach steady state. The test ambient temperature and internal heat source should be measured and used to adjust linearly all measured package temperatures to those corresponding to a 38 C ambient temperature. 

Generally, the normal conditions of transport will have been assessed by calculation, so detailed temperature and pressure distributions should be available. Alternatively, the package temperatures might have been measured experimentally, so that, after correction to the appropriate ambient temperature and for the effects of insolation and the heat load due to the contents, these provide the initial conditions for the calculated thermal test conditions. Ambient temperature corrections can be made in accordance with para. 651.4. 

Gas phase interferences due to compound formation of the analyte element with a concomitant should not be very significant in ETAAS because a much longer time is available for dissociation compared to FAAS. It was shown by high-temperature equilibrium calculations that gas phase interferences at the temperatures used in ETAAS should actually be rather insignificant [18], The reason why the literature is nevertheless full of reports on such interferences is largely due to an improper use of this technique. Slavin et al. [19], based on the systematic work of L vov [20], introduced a concept which they called stabilized temperature platform furnace (STPF). It is in essence a package of measures which eliminates most nonspectral interferences in ETAAS by atomization under local thermal equilibrium conditions. 

A dynamic tubular reactor model, comprising a set of partial differential equations, has been used to test the computational efficiency and the data handling capabilities of the various software packages. Experimental data of three time-varying model inputs, i.e. the reactor temperature, the fluid velocity and the reactant inlet concentration, are used to estimate the model parameters fix)m experimental data of the reactor temperature measured at several fixed reactor locations as a function of time. This problem was originally published in 1992 [3]. 

JEDEC Standard, JESD22bll2, High Temperature Package Warpage Measurement Methodology, May 2005. www.jedec.org. 

A more quantitative technique for cell flow characterization is the hot wire anemometer. Fig. 12 shows such an apparatus analyzing cell flow uniformity within a stack. The anemometer is set up to scan across each individual cell package quantitatively measuring flow and temperature. The integrated data identifies cell-to-cell flow variations with a high degree of precision and accuracy. Using the hot wire anemometer as a tool, improved cell-to-cell reactant gas flow uniformity can be achieved. 

Cure kinetics of thermosets are usually deterrnined by dsc (63,64). However, for phenohc resins, the information is limited to the early stages of the cure because of the volatiles associated with the process. For pressurized dsc ceUs, the upper limit on temperature is ca 170°C. Differential scanning calorimetry is also used to measure the kinetics and reaction enthalpies of hquid resins in coatings, adhesives, laminations, and foam. Software packages that interpret dsc scans in terms of the cure kinetics are supphed by instmment manufacturers. 

The vent sizing package (VSP) was developed by Fauskes Associates, Inc. The VSP and its latest version VSP2 employ the low thermal mass test cell stainless steel 304 and Hastelloy test cell with a volume of 120 ml contained in a 4-1, high-pressure vessel as shown in Figure 12-13. The typical ([t-factor is 1.05-1.08 for a test cell wall thickness of 0.127-0.178 mm. Measurements consist of sample temperature Tj and pressure Pj, and external guard temperature Tj and... 

Zhu, D. and Hu, Y. Z., A Computer Program Package for the Prediction of EHL and Mixed Lubrication Characteristics, Friction, Subsurface Stresses and Flash Temperatures Based on Measured 3-D Surface Roughness," Tribol. Trans., Vol. 44, No. 3,2001, pp. 383-390. 

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