Oven temperature profiles, for

OVEN TEMPERATURE PROFILES FOR PROGRAMMED-TEMPERATURE GAS CHROMATOGRAPHY... 

The agreement between the experimental and calculated values of Ce, is excellent. The data shown in Figure 2 are for a constant bake time of 17 minutes. The upper and lower limits on define a cure window. The cure window for the low solids coating is 50 C. The model was further tested by measuring extents of reaction and temperature profiles for samples attached to different parts of a car body which passed through a pilot plant oven. This simulation tested the model under conditions where the substrate temperatures were far from constant. As shown in Table II, the agreement between the experimental and calculated values of Ce is again excellent. 

The results of the calculation of Cel for the different coatings using the typical oven temperature profiles raises several questions ... 

Ee was determined by gas chromatography (GC) on a Supelco Beta-DEX 120 column (fused-sihca capillary column, 30 m, 0.25 mm inner diameter, 0.25 mm film thickness Supelco, Buchs, Switzerland) with spht injection (20 1) and an isothermal oven temperature profile at 90 °C for separation of styrene oxide enantiomers. 

The optimum operating conditions for GC analysis must be determined prior to the GC-MS analysis. In general, this is accomplished by injecting the sample solution several times while varying such parameters as carrier gas, splitting ratio of carrier gas at the injection port fitted with a split liner, carrier gas flow rate, and oven temperature profile. In addition, the type of capillary column used and the concentration and volume of the sample to be injected also have to be optimized. 

Figure 5.10 Bundle center temperature prediction for oven temperature profile with hyperbolic stages. Note The smooth curve is the hyperbola approximated by the given temperature ramps indicated by the dashed line. Source Reprinted from Heine M, PhD Dissertation, University of Karlsruhe, Germany, 1988.

Dunham and Edie (1992) [219] used bundles of 12,000-60,000 filaments to establish a model of stabilization for Courtauld s SAP PAN based precursor by grouping the many reactions into three major groups of reactions—cyclization, dehydrogenation and oxidation. They found that bundle temperatures could be as much as 15°C above the oven temperature and predicted that incremental oven temperature profiles should be useful in reducing the time taken for stabilization. 

Quantitation Capillary Column Oven Temperature Profile (Tier II, 17 min run time may also be used for Tier I analysis ... 

Figure 4 Changes of (a) the bulk resistivity, and (b) the bonded sample electrical resistance with cure time, for Epon830/Ni adhesives with 50 wt% of Ni during cure at 150 °C for 30 minutes. The dash line shows the oven temperature profile.

Fig. 4.61 illustrates typical temperature profiles during the rotational moulding of polyethylene. A ith typical values of oven temperatures and data for an aluminium mould... 

Differences in retention times in the chromatograms are due to the different oven temperature program used. Some remarkable differences in the profiles evidence the different enrichment obtained by the two methods. Data reported in Table 5.2 and Figure 5.3 show evidence of generally good linear correlations between XAD-2 extraction and HS-SPME enrichment methods. In the conditions used for SPME/GC-FID analysis, some compounds such as octanoic and decanoic acids partially overlap ethyl myristate and ethyl palmitate, respectively. 

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