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Nitrogen technology

Urea—Formaldehyde Reaction Products. Urea—formaldehyde (UF) reaction products represent one of the older controlled release nitrogen technologies. An early disclosure of the reaction products of urea [57-13-6] and formaldehyde [50-00-0] was made in 1936 (1) (Amino resins and plastics). In 1948, the USDA reported that urea (qv) and formaldehyde (qv) could react to produce a controlled release fertilizer at urea to formaldehyde mole ratios (UF ratio) greater than one (2). [Pg.130]

Table 1 Range of Applicability for Oxygen and Nitrogen Technology... Table 1 Range of Applicability for Oxygen and Nitrogen Technology...
Fuel-bound NO. is formed at low as well as high temperatures. However, part of the fuel nitrogen is directly reacted to N2. Moreover, N2O and N2O4 are also formed in various reactions and add to the complexity of the formation. It is virtually impossible to calculate a precise value for the NO, emitted by a real combustion device. NO, emissions depend not only on the type of combustion technology but also on its size and the type of fuel used. [Pg.307]

This justifies all the work undertaken to arrive at fuel denitrification which, as is well known, is difficult and costly. Moreover, technological improvements can bring considerable progress to this field. That is the case with low NO burners developed at IFF. These consist of producing separated flame jets that enable lower combustion temperatures, local oxygen concentrations to be less high and a lowered fuel s nitrogen contribution to NOj. formation. In a well defined industrial installation, the burner said to be of the low NO type can attain a level of 350 mg/Nm, instead of the 600 mg/Nm with a conventional burner. [Pg.269]

Technological advances continue to be made, several recent patents describe advanced phenol—formaldehyde—furfuryl alcohohol biader systems (68—70). These systems are free of nitrogen compounds that can be detrimental to metal iategrity. Systems with extended bench life have also been developed (71). [Pg.81]

E. Blasiak, Technology of Nitrogen Compounds, Vol. 2, State Technical PubHsher, Warsaw, 1956, pp. 596—642. [Pg.310]

Coal is expected to be the best domestic feedstock alternative to natural gas. Although coal-based ammonia plants have been built elsewhere, there is no such plant in the United States. Pilot-scale projects have demonstrated effective ammonia-from-coal technology (102). The cost of ammonia production can be anticipated to increase, lea ding to increases in the cost of producing nitrogen fertilizers. [Pg.243]

In general, the proven technology to upgrade methane is via steam reforming to produce synthesis gas, CO + Such a gas mixture is clean and when converted to Hquids produces fuels substantially free of heteroatoms such as sulfur and nitrogen. Two commercial units utilizing the synthesis gas from natural gas technology in combination with novel downstream conversion processes have been commercialized. [Pg.78]

Agricultural Uses. Pesticides represent the second largest commercial market for hydrazine. Hundreds of hydrazine derivatives have been patented for a wide range of agricultural appHcations. Table 13 presents a sampling of the 50—60 that are commercially available or developmental products. These compounds are made from hydrazine, MMH, and UDMH and are for the most part heterocycHc nitrogen compounds (see Insect control technology). [Pg.289]

Gate oxide dielectrics are a cmcial element in the down-scaling of n- and -channel metal-oxide semiconductor field-effect transistors (MOSEETs) in CMOS technology. Ultrathin dielectric films are required, and the 12.0-nm thick layers are expected to shrink to 6.0 nm by the year 2000 (2). Gate dielectrics have been made by growing thermal oxides, whereas development has turned to the use of oxide/nitride/oxide (ONO) sandwich stmctures, or to oxynitrides, SiO N. Oxynitrides are formed by growing thermal oxides in the presence of a nitrogen source such as ammonia or nitrous oxide, N2O. Oxidation and nitridation are also performed in rapid thermal processors (RTP), which reduce the temperature exposure of a substrate. [Pg.348]


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See also in sourсe #XX -- [ Pg.414 , Pg.433 ]




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