Multilayer technology

An optical currency substrate that uses multilayer technology... 

Company Technology This is about whether the product utilizes the company s multilayer technology. It has a weighting of 0.15. The optical polymer should have a high score because the coextruded film does not require much knowledge of other technologies such as adhesives, etc. 

Thick-Film Multilayer. Thick-film multilayer technology has been used for many years to fabricate hybrid circuits that interconnect small-scale ICs or discrete components on a ceramic or metal substrate (67-70). This technology has also been used for multichip packaging of more highly integrated ICs for large computer applications. 

The capillary tube can be replaced by a porous ceramic appropriately limiting gas flow. Because of the constant urge to reduce component size and cost multilayer technology is exploited in the fabrication of sensors. 

Fig. 4.41 A planar form of NO sensor the entire fabrication exploiting multilayer technology (adapted from [16]).

Multilayer technology is exploited just as for multilayer capacitors (see Section 5.4.3) to EIA size specifications, and inductor chips can be bandoliered ready for surface mounting, typical inductance values lying in the range 1 nH to about 20 /rH. They find important applications as EMI suppressors as well as for a wide range of applications as a lumped circuit component in equipment of all types -communications, entertainment , computers, etc. (see Fig. 9.17). 

With multilayer technology being used in exhaust-gas sensors, the complexity is increased by using the third dimension. 

For planar sensors manufactured by multilayer technology, the recently developed ceramic tape casting process was improved further [17, 18]. ZrOz powder is mixed into an organic matrix of binders, plasticizers, and solvents and is tape cast onto a Mylar supporting tape or a steel belt After drying, the ceramic tape is separated from the support tape and the flexible green tape can be punched to form individual substrates. 

Use of physically reprocessed PET in nonfood containers is more common than for food packaging. Up to 100% recycled PET can be used, or the recycled material can be blended with virgin. For example, Clorox uses about 50% postconsumer recycled PET in bottles for its Pine-Sol cleaner, after having tried and abandoned use of 100% recycled content due to processing problems. Most often, the recycled material in these containers is blended with virgin, since this is less costly than using multilayer technology. 

Thick-film ceramic multilayer technology was chosen for this marine engine control module for its ability to handle high power dissipation and perform reliably in harsh envirorunents cycling between temperature extremes. Packaging density was also important to reduce the module size for direct mounting on the engine. 

Finally mention must be made of some problems which are specific to multilayered technology and which have no parallel in the solid-wall situation. 

H. Tsuneno, Multilayer technology of circuit board Research and Development of Ceramic Devices and Material for Electronics (CMC, Tokyo, 2(XX)), pp. 128-139. 

M. Fujimoto, N. Narita, H. Takahashi, M. Nakazawa, Y. Kamiyama, and S. Sekiguchi, Miniaturization of Chip Inductors using Multilayer Technology and Its Application as Chip Components for High Frequency Power Modules, Industrial Ceramics, 12, (2001), pp. 26-28. 

Nonoriented Tedlar SP films (Types 8 and 9) offer excellent conformability to almost any shape or substrate while maintaining the durability, chemical resistance, and ease of cleaning expected of PVF film.1 ] Nonoriented films are available as multilayer films without adhesives or heat sealing. Multilayer technology allows for effects such as pearlescent or metallic colors. The Tedlar SP process allows a pigmented base layer to be covered with an integral clear top layer. 

One advantage that LTCC has over the other multilayer technologies is the ability to print and fire resistors. Where trimming is not required, the resistors can be buried in intermediate layers with a eorresponding saving of space. It is also possible to bury printed capacitors of small value. 

Injection molding technology involves the injection of molten plastic into one or several cavities via a hot-runner system (melt-channel distribution system) and rapid cooling of a preform to a low temperature. At this point the freshly manufactured article can be ejected from the cavity. In multilayer technology, more than one plastic resin is injected into the cavity. 

The constant evolution towards a miniaturization and higher integration of electronic circuits has rapidly shown the limits imposed by the two-dimensional nature of the substrate. The multilayer technology helps to make use of a third dimension. On each layer, prepared by tape casting, conducting tracks are deposited. 

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