Ceramic tape casting

Corbin SF, Lee J, and Qiao X. Influence of green formulation and pyrolyzable particulates on the porous microstructure and sintering characteristics of tape cast ceramics. J. Am. Cer. Soc. 2001 84 41 17. 

ECN [40] developed silicon-enriched SiAlON tape-cast ceramic substrates using a plasma-sprayed Si seeding layer. Closed layers of 1 cm2 have been achieved with grain sizes of 10-100 pm when using a melt of In with 1%A1 at 960° C. 

Zhang, J. et al.. Preparation of Ti ceramics through aqueous tape casting, Ceram. Int., 31, 475, 2005. 

Patent filed by W. ]. Gyurk of RCA on the lamination of tape-cast ceramics to form multilayers,... 

K. Blackman, Processing of Non-Aqueous Tape-Cast Ceramic Layers, M.S. Thesis. University of Illinois, Urbana-Champaign, IL, 1996. 

J. A. Lewis, K. A. Blackman, and A. L. Ogden, Rheological Property and Stress Development During Drying of Tape-Cast Ceramic Layers, / Am. Ceram. Soc., 79 [12] 3226 (1996). 

R. E. Mistier and D. J. Shanefield, The Characterization of Unfired Tape Cast Ceramics presented at the 1979 Electronics Division Fall Meeting, The American Ceramic Society, Williamsburg, VA, September 1979. 

Beyong-Hwan Ryu, M. Takahashi, and S. Suzuki, Rheological Characteristics of Aqueous Alumina Slurry for Tape Casting, /. Ceram. Soc. of Japan, International Ed., 101 [6] 626-31 (1993). 

In laminated object manufacturing (LOM), layers of a thin sheet are sequentially bonded to each other and cut by a laser according to a computer-generated model (Fig. 6.51). A modified form of the process, referred to as computer-aided manufacturing of laminated engineering materials (CAM-LEM), has been developed to produce complex shapes directly from tape-cast ceramics (72). In CAM-LEM, individual slices are cut from the tape-cast sheet using a laser and stacked to... 

BOC 88] BOCH P. and CHARTIER T., Understanding and improvement of ceramic processes the example of tape casting . Ceramic Developments, Materials Science Forum, Trans. Tech. Publ., p. 813,1988. 

Equally important as tape casting in the fabrication of multilayer ceramics is thick film processing. Thick film technology is widely used in microelectronics for resistor networks, hybrid integrated circuitry, and discrete components, such as capacitors and inductors along with metallization of MLC capacitors and packages as mentioned above. 

Interconnects are formed into the desired shape using ceramic processing techniques. For example, bipolar plates with gas channels can be formed by tape casting a mixture of the ceramic powder with a solvent, such as trichloroethylene (TCE)-ethanol [90], Coating techniques, such as plasma spray [91] or laser ablation [92] can also be used to apply interconnect materials to the other fuel cell components. 

Tai L-W and Lessing PA. Tape casting and sintering of strontium-doped lanthanum chromite for a planar solid oxide fuel cell bipolar plate. J. Am. Ceram. Soc. 1991 74 155—160. 

FIGURE 6.9 Schematic diagram of the tape-casting process for producing a ceramic green film. 

Once the structural support layers have been fabricated by extrusion or EPD for tubular cells or by tape casting or powder pressing for planar cells, the subsequent cell layers must be deposited to complete the cell. A wide variety of fabrication methods have been utilized for this purpose, with the choice of method or methods depending on the cell geometry (tubular or planar, and overall size) materials to be deposited and support layer material, both in terms of compatibility of the process with the layer to be deposited and with the previously deposited layers, and desired microstructure of the layer being deposited. In general, the methods can be classified into two very broad categories wet-ceramic techniques and direct-deposition techniques. 

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